TW201908687A - Connection structure between heat pipe and metal housing of mobile electronic apparatus being stable and thin, and excellent in heat dissipation - Google Patents

Abstract

A connection structure of a heat pipe and a metal housing of a mobile electronic apparatus includes a metal housing on which an elongated groove is disposed, wherein the left and the right sides of the groove define a groove width; a heat pipe, which is composed of a heat conductive metal and has a flat body with a thickness of less than 1 mm, wherein the width of a pipe body on the left side and the right side of the heat pipe is smaller than an accommodating width of the groove. When the heat pipe is disposed in the groove, a gap is formed between the heat pipe and a groove wall of the groove, the heat pipe and the metal housing are positioned in a dispensing manner; and a plastic layer, which is formed in the gap (d) by an in-mold injection process and is of a heterogeneous connection structure of connecting two metal members of the metal housing and the heat pipe. Accordingly, the connection structure has effects of being stable and thin, and excellent in heat dissipation.

Description

Connection structure between heat pipe and metal casing of mobile electronic device

The present invention relates to a connection structure between a heat pipe and a metal casing of a mobile electronic device, and more particularly to a heterogeneous bonding structure in which a plastic is joined by insert molding to bond a metal casing and a heat pipe.

According to the mobile electronic device, the electronic device becomes thinner and lighter, and the electronic component density increases and the working frequency increases. After a long time of use, it will cause local overheating. This phenomenon brings excessive temperature to the consumer. Inferior use experience; in other words, the wafer or battery of the mobile electronic device is usually the main heat source during operation, and the heat dissipation is not only to reduce the temperature of the wafer or the battery itself to ensure that it can work normally within the required temperature range, but also to balance heat dissipation. When the housing is not overheated locally, that is, a hot spot is generated, which causes a bad user experience. Currently, the heat dissipation method of the mobile electronic device mainly uses simple opening, heat conduction, heat radiation, etc., but Some heat dissipation methods can not meet the heat energy generated by today's high-performance chips, so there is a problem of overheating, heat energy can not be evenly distributed in the casing, resulting in reduced heat dissipation efficiency inside the mobile electronic device; The phenomenon of frequent or too slow crashes has also occurred from time to time. In order to solve the above problems, the current high order Device model artificial graphite sheet, but with the higher requirements of video, have not solve the problem of overheating gradually; therefore been used in commercial micro heat pipe smartphone, a micro heat pipe as a heat exchange element.

As shown in FIG. 1 , it is a new type of M496156 patent, which discloses a mobile electronic device heat dissipation structure, which comprises a front case bracket 41, a liquid crystal display module 42 and a back cover 46 and the thin micro heat pipe 45. The substrate of the liquid crystal display module 42 is provided with a substrate 44. The substrate 44 is provided with at least one electronic component 441. The rear cover 46 has an accommodating space 461. 33, the substrate 44 is embedded in the middle frame 43, the thin micro heat pipe 45 is disposed between the electronic component 441 and the back cover 46, and the side of the thin micro heat pipe 45 corresponds to the electronic component 441. The other side corresponds to the back cover 46 and cooperates with a heat sink 451; thereby helping the electronic component 421 to uniformly distribute thermal energy without generating heat. However, it is checked that the thin micro heat pipe 45 is a tubular body made of copper or aluminum material. Since copper or aluminum material is a good conductor for heat conduction, it is widely used as a direct contact with a heat source for conduction. a heat-conducting element of heat, but it is required to bond the thin micro-heat pipe 45 to the accommodating space 461 through a solder paste or a soldering method. However, since the heat pipe is made of copper or aluminum, its material properties are adhered or soldered through the solder paste. Combined with fixing, it is easy to cause thermal resistance problems, the casing is not easy to be thinned and environmental protection problems.

2A, 2B, and 2C, which is the invention of Taiwan Patent No. I544204, which discloses a heat pipe fixing structure, comprising: a heat pipe 52, a carrier 51, and two fixing members 53, 54; Having a body having a first side and a second side; the carrier 51 has a groove 511 having an open side and a closed side, and the heat pipe 52 is disposed in the groove 51, and The first side and the second side respectively correspond to the open side and the closed side; the outer ends 54b of the two fixing members 53 and 54 are disposed above the heat pipes 53 and 54 and the carrier 51, the inner side of the first fixing member The end 54a (free end) is in contact with the first side of the heat pipe 52 to "press or snap", providing a fixed structure of the heat pipe, thereby improving the defect of the conventional welded fixed heat pipe. However, it is checked that the heat 52 tube is combined with the carrier 51 by a tight fitting method. Although the two methods can be used to fix the two, a part of the tight fitting structure needs to exert pressure on the heat pipe to deform it. When the pressure is applied to the heat pipe, the capillary structure inside the heat pipe is destroyed, so that the heat transfer efficiency of the heat pipe is greatly reduced or even dissipated, thereby reducing or losing the heat transfer effect of the heat pipe.

3A, 3B, and 3C, which is a new type of U.S. Patent No. M522552, which discloses a handheld communication device 60 and a thinned heat sink 70 thereof. The thinned heat sink 70 includes a first heat conducting plate 71. a heat pipe 72 and a second heat conducting plate 73, the first heat conducting plate 71 is provided with a through slot 711; the heat pipe 72 is disposed in the through slot 711; the second heat conducting plate 73 is overlapped or pasted corresponding to the first heat conducting plate 71 and the heat pipe 72. Pick up. Thereby, the heat generated by the heating element 63 is uniformly guided to the heat pipe 72 and the heat conducting plate 71, so that heat is accumulated around the heat generating component 63 or the casing 61, so as to improve the heat dissipation efficiency. However, it is checked that the heat pipe 72 is combined with the heat conducting plate 71 through the second heat conducting plate 73. However, in the heat pipe of such thickness, the smaller the thickness, the worse the performance, and the problem of loosening and decomposition due to vibration factors during the handling process.

Therefore, the absence of the above-mentioned prior art is the primary goal of those who are familiar with the art.

The main object of the present invention is to solve the prior art, and to provide a connection structure between a heat pipe and a metal casing of a mobile electronic device, which has the advantages of stable combination, thinness, and good heat dissipation.

In order to achieve the above-mentioned effects, the technical features of the present invention include: a metal casing comprising a middle frame casing, a rear cover body or a heat conducting plate body on a mobile electronic device, the metal shell The body is provided with a long and narrow groove, and the left and right sides of the groove define a groove width (S); a heat pipe is formed of a heat conductive metal, and has a flat body with a thickness of less than 1 mm. The body has an upwardly facing first surface and an opposite corresponding second surface, and the tube width (W) of the left and right sides of the heat pipe is smaller than the receiving width (S) of the groove, and the jingle When the heat pipe is disposed in the groove, a gap (d) is formed between the left and right sides of the heat pipe and the groove wall of the groove, and the heat pipe and the metal shell are positioned by dispensing; and a plastic The layer is formed in the gap (d) by an insert molding process, and the metal shell and the heat pipe are connected by the injection molded plastic layer, and the plastic layer is wrapped Covering the left and right sides of the heat pipe, so that the first side and the second side of the heat pipe are not plasticized The exposed layer coated heat dissipating surface.

According to the foregoing feature, in the first embodiment, the metal casing may be a middle frame casing or a rear cover body, and the groove may include: an open side with an upward facing side and a closed side of the bottom portion, The first side of the heat pipe is opposite to the open side, and the second side is opposite to the closed side.

In another embodiment, the metal casing may be a heat conducting plate body, and the groove includes: an upper and lower open sides facing upward and downward, and the first surface of the heat pipe is relatively open on the upper side On the side, the second side is opposite to the lower open side.

According to the foregoing feature, the groove on the metal casing and the contact surface of the heat pipe and the plastic layer may be processed to have a microporous rough surface, and the plastic layer is coated in a C-shaped clamping shape on the heat pipe. Left and right sides.

With the above technical features, the present invention is different from the conventional heat pipe combination structure, and the present invention does not have the traditional combination of solder paste bonding or welding to fix the heat pipe, which is liable to cause thermal resistance problems and environmental protection problems. There is no such thing as a through-tightening method of "pressing or snapping", which easily causes the heat pipe to exert pressure and deform, and loses the problem of heat pipe heat transfer. There is no traditional way to fix the heat pipe through the lap joint or the joint, which is easy to cause loosening and decomposition due to vibration factors during the handling process. Therefore, the present invention has solved the above-mentioned disadvantages of the prior art, and has a hetero-bonding structure in which the metal shell and the heat pipe are joined by the injection molding plastic layer by means of insert molding. Combines solid, thin, and heat-dissipating effects.

First, referring to FIG. 4 to FIG. 7 , the connection structure between the heat pipe and the metal casing of the mobile electronic device of the present invention comprises: a metal casing 10 including a middle frame casing 10a on a mobile electronic device. a rear cover body 10b or a heat-conducting plate body 10c, the metal casing 10 is provided with a narrow-shaped groove 11, and the left and right sides of the groove 11 define a groove width (S); In this embodiment, the material of the metal casing 10 may include copper, aluminum, titanium, stainless steel, silver or a metal alloy thereof, or a metal composite of any two or more.

A heat pipe 20, which is made of a heat conductive metal, has a flat body having a thickness of less than 1 mm, the body having an upward first face 21 and an opposite corresponding second face 22, and the heat pipe is left, The width (W) of the tube on the right two sides is smaller than the accommodating width (S) of the groove. When the heat pipe 20 is disposed in the groove 11, the left and right sides of the heat pipe 20 and the groove 11 A gap (d) is formed between the walls of the groove, and the heat pipe 20 and the metal casing 10 are positioned by means of dispensing 31. In this embodiment, the dispensing 31 may comprise: a thermoplastic resin, a thermosetting resin or a resin. Any one of them.

A plastic layer 30 is formed in the gap (d) by an insert molding process, and the metal shell 10 and the heat pipe 20 are joined by the injection molded plastic layer 30. The plastic layer 30 is coated on the left and right sides of the heat pipe 20 such that the first surface 21 and the second surface 22 of the heat pipe 20 are exposed to the exposed heat dissipation surface without the plastic layer 30. In this embodiment, the material of the plastic layer 30 may include: PBT, PC, ABS, PC/ABS, PPS, PA6, PA66, PA66/PA6, PBT/filler, PC/filler, PC/ABC/filler, PPS/ Filler, PA6/filler, PA66/filler, PA66/PA6/filler, the filler can be fiber or inorganic filler, and the fiber can be carbon fiber, graphite fiber, carbon nanotube, graphene fiber, glass fiber, polymer Fiber, or polymer hollow fiber or nanowire; the filler may be calcium carbonate, barium sulfate, alumina, tantalum carbide, mica, boron nitride, aluminum nitride, titanium dioxide, zinc oxide, magnesium oxide, carbon balls , graphite, graphene and nano carbon materials.

As shown in FIGS. 5A-5D, in the present embodiment, the metal casing 10 is constructed as a middle frame casing 10a, and the groove 11 includes: an open side with an upward facing side and a closed side with a bottom portion 111 and a bottom portion. 112, the first surface 21 of the heat pipe 20 is opposite to the open side 111, and the second surface 22 is opposite to the closed side 112. That is to say, in the present embodiment, the bottom of the groove 11 of the middle frame casing 10a has a closed side 112 instead of a through hole.

As shown in FIG. 5E, another possible embodiment of the metal casing 10 is a rear cover body 10b. The bottom of the groove 11 also has a closed side 112. Therefore, when the heat pipe 20 is disposed in the groove The joint construction of the 11 injection molding is the same as that shown in FIG. 5D, and therefore will not be described.

As shown in FIGS. 6A-5D, in another possible embodiment, the metal casing 10 is configured as a heat conducting plate body 10c, and the groove 11 of the heat conducting plate body 10c includes: an upward facing and a downward facing The upper and lower open sides 113, 114 are located on the upper open side 113 of the first surface 21 of the heat pipe 20, and the second open side 21 is located on the lower open side 114. That is to say, in the present embodiment, the bottom of the groove 11 of the heat conducting plate body 10c has no closed side but a structure of a through hole.

Therefore, the present invention utilizes insert molding, and the metal shell 10 and the heat pipe 20 are joined by the injection molded plastic layer 30, which is applicable to the above-mentioned middle frame housing 10a. Examples of the back cover 10b and the heat transfer plate 10c.

Further, as shown in FIG. 7, the groove 11 on the metal casing 10 and the contact surface of the heat pipe 20 and the plastic layer 30 are more permeable to the microporous rough surface 12, 23, and the plastic layer is Covered on the left and right sides of the heat pipe in a C-shaped clamping shape. In this embodiment, in order to make the metal layer 10 and the heat pipe 20 of the plastic layer 30 more completely engaged, the contact surface is processed by a general C or T or HK or E or PMH or TRI treatment or ECIM. Thereby, the surface of the metal casing 10 subjected to the above processing is formed into nano-scale microporous rough surfaces 12, 23, and the resin of the plastic layer 30 is engaged with the metal to form an "anchor effect", which is a nano-scale physical joint. The resin can be firmly bonded to the metal, and after the above processing, such as TRI-treated aluminum alloy chemistry, an oxide film having a thickness of 70-1500 nm is formed, and the oxide film contains triazine thiol, etc., and can react with the resin and can be combined with the metal. The substance, in the high temperature and high pressure, produces a chemical reaction link, so that the resin and the metal are firmly bonded.

By means of the above-mentioned technical features, the present invention has the following effects as compared with the conventional heat pipe combination structure: 1. The present invention does not have a conventional solder paste bonding or welding combined with a fixed heat pipe, which is liable to cause thermal resistance problems and a casing. Not easy to thin and environmental issues. 2. The invention does not have the traditional "pressing or snapping" type of tight fitting, which is easy to cause the heat pipe to exert pressure to deform and lose the problem of heat transfer of the heat pipe. 3. The invention has no traditional lap joint or joint bonding fixed heat pipe, which is easy to cause problems such as loosening and decomposition due to vibration factors during the handling process. 4. The present invention can be made thinner without increasing the original thickness of the structure.

Therefore, the present invention has overcome and solve the above-mentioned disadvantages of the prior art, and has an in-mold injection molding method, and the joint structure of the heat pipe 20 and the metal casing 10 is stabilized by the injection molded plastic layer 30. It has the effect of being thin and heat-dissipating.

To sum up, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patent to be invented by the bureau. German sense.

The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

10‧‧‧Metal housing

10a‧‧‧Medium frame housing

10b‧‧‧Back cover

10c‧‧‧heat conducting plate

11‧‧‧ trench

12‧‧‧Microporous rough surface

111‧‧‧ open side

112‧‧‧ Closed side

113‧‧‧Open side

114‧‧‧Under the open side

20‧‧‧heat pipe

21‧‧‧ first side

22‧‧‧ second side

23‧‧‧Microporous rough surface

30‧‧‧Plastic layer

31‧‧‧ Dispensing

Fig. 1 is an exploded perspective view of the new Taiwanese M496156. 2A to 2C are exploded perspective views, combined perspective views, and structural cross-sectional views of the Japanese Patent No. I544204. 3A to 3C are exploded perspective views, combined perspective views, and structural cross-sectional views of a conventional Taiwan Patent No. M522552. Figure 4 is a flow chart of the molding of the present invention. 5A to 5D are exploded perspective views, combined perspective views, and structural cross-sectional views of the first embodiment of the present invention. Figure 5E is an exploded perspective view of a second embodiment of the present invention. 6A to 6D are exploded perspective views, combined perspective views, and structural cross-sectional views of a third embodiment of the present invention. Figure 7 is an enlarged cross-sectional view showing the main structure of the present invention.

Claims (4)

A connection structure between a heat pipe and a metal casing of a mobile electronic device, comprising: a metal casing, comprising a middle frame casing, a rear cover body or a heat conducting plate body on a mobile electronic device, the metal The casing is provided with an elongated groove, and the left and right sides of the groove define a groove width (S); a heat pipe is formed of a heat conductive metal, and has a flat body with a thickness of less than 1 mm. The body has an upwardly facing first surface and an opposite second surface, and the tube width (W) of the left and right sides of the heat pipe is smaller than the receiving width (S) of the groove, When the heat pipe is disposed in the groove, a gap (d) is formed between the left and right sides of the heat pipe and the groove wall of the groove, and the heat pipe and the metal shell are positioned in a dispensing manner; a plastic layer is formed in the gap (d) by an insert molding process, and the metal shell and the heat pipe are connected by the injection molded plastic layer, and the plastic layer is wrapped Covering the left and right sides of the heat pipe to present the first side and the second side of the heat pipe Plastic coated with a layer of the exposed heat dissipation surface. The connection structure of the heat pipe and the metal casing of the mobile electronic device according to the first aspect of the invention, wherein the metal casing is a middle frame casing or a rear cover body, the groove has an upward facing The open side and a closed side of the bottom, the first side of the heat pipe is opposite to the open side, and the second side is opposite to the closed side. The connection structure of the heat pipe and the metal casing of the mobile electronic device according to the first aspect of the invention, wherein the metal casing is a heat conducting plate body, the groove has an upward facing and a downward facing, The lower open side, the first side of the heat pipe is opposite to the upper open side, and the second side is opposite to the lower open side. The connection structure between the heat pipe and the metal casing of the mobile electronic device according to the second or third aspect of the invention, wherein the groove on the metal casing and the contact surface of the heat pipe and the plastic layer further comprise processing The microporous rough surface is present, and the plastic layer is coated on the left and right sides of the heat pipe in a C-shaped clamping shape.