TW201912690A - Resin sheet and semiconductor device comprising a first support sheet, a resin composition layer, and a second support sheet - Google Patents

Abstract

An object of the present invention is to provide a resin sheet which is less likely to float at the interface between the resin composition layer and the support sheet, and has excellent operability during processing and transportation. The solution of the present invention is to provide a resin sheet 1 which is a resin sheet 1 used in a method for manufacturing a semiconductor device using a panel-level package and used to form an electronic component seal or an insulating film. The resin sheet 1 includes a first support. The sheet 11, the resin composition layer 10, and the second support sheet 12, the resin composition layer 10 is formed of a resin composition containing a thermosetting resin, a thermoplastic resin of 30% by mass or less, and an inorganic fine particle of 50% by mass or more. The contact surface between the first support sheet 11 and the resin composition layer 10 is not peeled off by a polysiloxane-based release agent, and the resin composition layer 10 is measured at 120 ° C by gas chromatography mass spectrometry. The concentration of volatile components generated during heating for 30 minutes was 100-45000 ppm.

Description

Resin sheet and semiconductor device

The present invention relates to a resin sheet and a semiconductor device manufactured using the resin sheet.

In recent years, the requirements for miniaturization and thinness of semiconductor packages have been greatly increased. To meet such requirements, there have been proposals to disclose a fan-out type semiconductor package. As a method for manufacturing a fan-out semiconductor package, a panel-level fan-out packaging technology (FOPLP) manufactured by using a square substrate size of about 300 to 700 mm is receiving attention.

In the manufacturing method of a semiconductor device of FOPLP, for example, an electronic component provided on a support is laminated to form a thin resin composition layer, and then the electronic component is buried in the resin composition by pressing the resin composition layer. Floor. Subsequently, the electronic component is sealed by curing the resin composition layer, and then a redistribution layer is formed.

As a resin sheet provided with the resin composition layer as described above, in order to improve the workability during processing and transportation, a resin sheet having a configuration in which a support sheet is laminated on a resin composition layer is often used. For example, Patent Document 1 discloses a resin sheet including a resin composition layer and a support sheet laminated on both sides of the resin composition layer. The surface of the support sheet that is in contact with the resin composition layer is subjected to a peeling treatment with a silicone-based release agent.

In addition, since the resin sheet described above generally contains a thermosetting resin such as epoxy resin and a hardening accelerator in the resin composition layer, it tends to be a substance with low storage stability, and therefore it may be necessary to store it under refrigeration. Prior Art Literature Patent Literature

[Patent Document 1] Japanese Patent Laid-Open No. 2015-126133

Problems to be solved by the invention

The above-mentioned resin sheet has little or no adhesion on the surface of the resin composition layer. Therefore, when stored in a state protected by the support sheet, it may occur at the interface between the resin composition layer and the support sheet. Floating problems. In addition, during processing and during transportation, handling problems such as defects and cracks may occur in the resin composition layer. In particular, when the resin sheet is stored under refrigeration at 5 ° C or lower, when a resin composition layer having a relatively high content of inorganic fillers is used, and when a phenoxy resin is used as a resin component for imparting film-forming properties, etc., And other issues become significant.

The present invention has been made in view of such a situation, and an object thereof is to provide a resin sheet which is less likely to float at the interface between the resin composition layer and the support sheet, and has excellent operability during processing and transportation. The present invention also provides a semiconductor device having good quality using such a resin sheet. Means to solve the problem

In order to achieve the above-mentioned object, the first aspect of the present invention provides a resin sheet, which is a resin sheet used in a method for manufacturing a semiconductor device using a panel-level package, forming a sealing of an electronic part, or forming an insulating film, wherein the resin is characterized in that: The sheet 1 includes a first support sheet, a resin composition layer laminated on one side of the first support sheet, and a second support sheet laminated on the resin composition layer on a side opposite to the first support sheet. The resin composition layer is formed of a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles. The content of the inorganic fine particles in the resin composition is 50% by mass or more. The thermoplastic resin is composed of the resin. The content of the content is 30% by mass or less. The contact surface between the first support sheet and the resin composition layer is not subjected to a peeling treatment with a polysiloxane-based release agent, and is measured using a gas chromatography mass analysis method. When the resin composition layer is heated at 120 ° C. for 30 minutes, the volatile component concentration is 100 ppm or more and 45000 ppm or less ( Ming 1).

In the resin sheet of the above invention (Invention 1), the support sheet is provided on both sides of the resin composition layer, and the contact surface of the first support sheet with the resin composition layer is not peeled off with a silicone-based release agent. In the process, the interface between the resin composition layer and the support sheet is less likely to float. In addition, when the concentration of the volatile component in the resin composition layer is within the above range, the surface of the resin composition layer has good viscosity, and thus, floating at the interface between the resin composition layer and the support sheet is unlikely to occur. In addition, when the concentration of the volatile component in the resin composition layer is within the above range, the fragility of the resin composition layer can be improved. As described above, by suppressing the occurrence of floating and improving the fragility of the resin composition layer, defects and cracks are not easily generated in the resin composition layer during processing and transportation, and excellent operability can be achieved.

In the above invention (Invention 1), it is preferable that the thermoplastic resin does not contain an acrylic resin (Invention 2).

In the above invention (Inventions 1, 2), it is preferable that the surface on the resin composition layer side of the first support sheet be peeled off with an alkyd-based release agent (Invention 3).

In the above invention (Inventions 1 to 3), it is preferable that the first support sheet is provided with a resin support substrate having a glass transition temperature (Tg) of 50 ° C or higher (Invention 4).

In the above inventions (Inventions 1 to 4), it is preferable that the surface on the resin composition layer side of the second support sheet is peeled off by a release agent (Invention 5).

A second aspect of the present invention provides a semiconductor device including a hardened layer (invention 6) obtained by hardening a resin composition layer on the resin sheet (inventions 1 to 5). Invention effect

When the resin sheet of the present invention is used, the interface between the resin composition layer and the support sheet is unlikely to float, and it has excellent operability during processing and during transportation. In addition, according to the manufacturing method of the present invention, a semiconductor device having good quality can be manufactured using such a resin sheet.

Forms used to implement the invention

Hereinafter, embodiments of the present invention will be described. [Resin Sheet] FIG. 1 shows a cross-sectional view of the resin sheet 1 in this embodiment. As shown in FIG. 1, the resin sheet 1 according to this embodiment includes a first support sheet 11, a curable resin composition layer 10 laminated on one side of the first support sheet 11, and a resin composition layer 10 laminated on the resin composition layer 10. The support sheet 11 is a second support sheet 12 on the opposite surface.

In addition, the contact surface between the first support sheet 11 and the resin composition layer 10 in this embodiment is not peeled off by a silicone-based release agent. In addition, in the present specification, the "not peeling treatment with a silicone-based release agent" means that the first support sheet 11 is peeled with a release agent other than a silicone-based release agent, or is performed without using a release agent. Peeling treatment.

As described above, the resin sheet 1 of the present embodiment has a structure in which the first support sheet 11 and the second support sheet 12 are laminated on both sides of the resin composition layer 10, respectively, and the supported sheet on both sides of the resin composition layer 10 is good. Earth protection. In addition, the resin sheet 1 of the present embodiment is not treated with a silicone-based release agent at the contact surface between the first support sheet 11 and the resin composition layer, and the resin composition layer 10 and the first support sheet 11 are not peeled off. The interface can achieve the required adhesion. As described above, the first support sheet 11 is used to protect one side of the resin composition layer 10 and the other side is also protected by the second support sheet 12. In this embodiment, the resin sheet 1 is not easily applied to the resin composition layer 10. The interface with the support sheet creates floating objects.

In the resin sheet 1 of this embodiment, the volatile component concentration generated when the resin composition layer 10 is heated at 120 ° C. for 30 minutes using a gas chromatography mass analysis method is 100 ppm or more and 45000 ppm or less. Thereby, the resin composition layer 10 becomes a thing which has favorable adhesiveness on the surface, and it becomes a thing which is hard to generate | occur | produce at the interface of the resin composition layer 10 and a support sheet. Moreover, when the volatile matter concentration is within the above range, the fragility of the resin composition layer 10 can also be improved.

As described above, in the resin sheet 1 according to this embodiment, it is possible to suppress the occurrence of floating at the interface between the resin composition layer 10 and the support sheet, and at the same time to improve the fragility of the resin composition layer 10, which is not easy during processing and transportation. Defects and cracks are generated in the resin composition layer, and excellent operability can be achieved.

1. Resin Composition Layer The resin composition layer 10 of this embodiment is formed of a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles. The resin composition layer 10 is a material having a curability, and a cured layer can be formed by curing the resin composition layer 10. The hardened layer obtained by hardening the resin composition layer 10 preferably exhibits insulation properties. Since the hardened layer exhibits insulating properties, it is possible to suppress defects such as short circuits and obtain excellent performance in the obtained semiconductor device.

(1) Thermosetting resin The thermosetting resin is not particularly limited, and examples thereof include an epoxy resin, a phenol resin, a naphthol-based resin, an active ester-based resin, a benzofluorene-based resin, and a cyanate-based resin. Etc. These can be used individually by 1 type or in combination of 2 or more types.

As the epoxy resin, various conventional epoxy resins can be used. Specific examples include bisphenol A, bisphenol F, resorcinol, phenol novolac, and cresol novolac. Ether; Glycidyl ether of alcohols such as butanediol, polyethylene glycol, polypropylene glycol; Glycidyl ether of carboxylic acids such as phthalic acid, isophthalic acid, tetrahydrophthalic acid; used Glycidyl-based or alkyl-glycidyl-type epoxy resins substituted by active hydrogen bonded to nitrogen atoms such as aniline isocyanurate; such as vinylcyclohexane bicyclo Oxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-cyclo (Oxygen) cyclohexane-m-dioxane, etc., is a so-called alicyclic epoxide formed by introducing a carbon-carbon double bond in the molecule into an epoxy group, for example by oxidation. In addition, an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, or the like can also be used. These epoxy resins can be used individually by 1 type or in combination of 2 or more types. Among the above-mentioned epoxy resins, epoxy propyl ether (bisphenol A type epoxy resin) using bisphenol A, epoxy resin having a biphenyl skeleton (biphenyl epoxy resin), and epoxy resin having a naphthalene skeleton An epoxy resin (naphthalene-type epoxy resin) or a combination thereof is preferred.

Examples of the phenol resin include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane-type phenol, Tetraphenol, novolac-type phenol, cresol novolac resin, phenol (biphenyl-type phenol) having a biphenylaralkyl skeleton, etc., among these, biphenyl-type phenol is preferably used. These phenol resins can be used individually by 1 type or in combination of 2 or more types. When an epoxy resin is used as the curable resin, a phenol resin is preferably used in combination from the viewpoint of reactivity with the epoxy resin and the like.

The content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and further preferably 20% by mass or more. The content is preferably 60% by mass or less, particularly preferably 50% by mass or less, and further preferably 40% by mass or less. When the content is 10% by mass or more, the resin composition layer 10 is hardened more sufficiently and the electronic component can be sealed more firmly. In addition, when the content is 60% by mass or less, it is possible to further suppress the resin composition layer 10 from being hardened in an unexpected step, and to make it more excellent in storage stability. The content of the thermosetting resin is a solid content conversion value.

(2) Thermoplastic resin The resin composition of this embodiment contains a thermoplastic resin of 30% by mass or less. Thereby, excellent film-forming property can be provided to a resin composition, and the operability of the obtained resin sheet 1 can be effectively improved. From such a viewpoint, the content of the thermoplastic resin in the resin composition is preferably 20% by mass or less, and particularly preferably 10% by mass or less. The lower limit of the content of the thermoplastic resin is not particularly limited. For example, it is preferably 1.0% by mass or more, particularly preferably 3.0% by mass or more, and further preferably 5.0% by mass or more. The content of the thermoplastic resin is a solid content conversion value.

Examples of the thermoplastic resin include a phenoxy resin, an olefin resin, a polyester resin, a polyurethane resin, a polyester urethane resin, an acrylic resin, and a fluorene resin. Resin, styrene resin such as styrene-isobutylene-styrene copolymer (SIS), silane resin, rubber resin, polyvinyl acetal resin, polyvinyl butyral resin, polyimide Resins, polyfluorene-imide-based resins, polyetherfluorene-based resins, polyfluorene-based resins, fluorine-based resins, and the like can be used alone or in combination of two or more. The thermoplastic resin may be a material having a curable functional group.

Here, in order to miniaturize a semiconductor device and miniaturize wiring, when manufacturing a semiconductor device using the resin sheet 1 of this embodiment, it is provided by forming an electrode on a hardened layer formed by hardening the resin composition layer 10 In the case of redistribution layers. In particular, when a redistribution layer is provided by a semi-additive process described later, in the process of desmear treatment, the hardened layer is processed under severe conditions such as exposure to an alkaline solution. At this time, depending on the type of the thermoplastic resin, the hardened layer may be dissolved and the peeling strength of the plating may be lowered, and the wiring formability may be deteriorated. Therefore, from the viewpoint of the wiring formation property in the hardened layer, it is preferable that the thermoplastic resin does not contain an acrylic resin. As the thermoplastic resin, it is preferable to use at least one selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, and a polyvinyl butyral resin among the thermoplastic resins.

The phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, bisphenol A / bisphenol F copolymerization type, bisphenol S type, bisphenol acetophenone type, and novolac type , Fluorene type, dicyclopentadiene type, norbornene type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type, biphenyl type phenoxy resin Among these, it is preferable to use a bisphenol A type phenoxy resin. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy-based resin may be used alone or in combination of two or more.

When a phenoxy-based resin is used as the thermoplastic resin, the viscosity on the surface of the resin composition layer 10 tends to decrease. However, even when a phenoxy-based resin is used as the thermoplastic resin, the resin sheet 1 of this embodiment can effectively suppress the occurrence of floating at the interface between the resin composition layer 10 and the support sheet.

The weight average molecular weight (Mw) of the thermoplastic resin is preferably 100 or more, particularly preferably 1,000 or more, and even more preferably 10,000 or more. The weight average molecular weight (Mw) of the thermoplastic resin is preferably 1 million or less, particularly 800,000 or less, particularly preferably 100,000 or less. When the weight average molecular weight (Mw) of the thermoplastic resin is in the above range, it is easier to form the resin composition layer 10 into a sheet shape. In addition, the weight average molecular weight in this specification is a standard polystyrene conversion value measured using the gel permeation chromatography (GPC).

(3) Inorganic fine particles The resin composition according to this embodiment contains 50% by mass or more of inorganic fine particles. Thereby, the hardened layer hardened by the resin composition layer 10 becomes a thing with small thermal expansion coefficient and water absorption, and the resin composition layer 10 becomes a thing which exhibits the outstanding softness | flexibility, fluidity | liquidity, and adhesiveness. From such a viewpoint, the content of the inorganic fine particles in the resin composition is preferably 55% by mass or more, and particularly preferably 60% by mass or more. The upper limit of the content of the inorganic fine particles is not particularly limited. For example, it is preferably 90% by mass or less, particularly preferably 85% by mass or less, and further preferably 80% by mass or less. The content of the inorganic fine particles is a solid content conversion value.

Examples of the inorganic fine particles include silicon oxide, aluminum oxide, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, Compound oxides such as aluminum nitride, aluminum borate whisker, boron nitride, crystalline silicon oxide, amorphous silicon oxide, mullite (mu11ite), cordierite (cordierite), montmorillonite (montmori11onite), swelling Smectite, boehmite, talc, iron oxide, silicon carbide, zirconia, etc. are used as the inorganic fine particles of the material, and these can be used alone or in combination of two or more. Among these, the use of silica fine particles and aluminum fine particles is preferred, and the use of silica fine particles is particularly preferred.

The inorganic fine particles are preferably surface-treated with a surface-treating agent. Thereby, the inorganic fine particles in the resin composition have excellent dispersibility and filling properties. Examples of the surface treatment agent include epoxy silane, vinyl silane, silazane compound, alkoxy silane, and silane coupling agent. These can be used alone or in combination.

The minimum area of the surface-treating agent coated is less than 550m ² / g preferably to 520m ² / g or less is particularly preferred, and further to 450m ² / g or less is preferable. On the other hand, the lower limit value of the minimum coating area of the surface treatment agent is preferably 100 m ² / g or more, particularly preferably 200 m ² / g or more, and more preferably 300 m ² / g or more. When the minimum coating area is in the above range, the dispersibility and filling properties of the inorganic fine particles in the resin composition are improved, and at the same time, the electrode formability of the hardened layer formed by hardening the resin composition layer 10 is improved.

The minimum coating area (m ² / g) of the surface treatment agent refers to the area (m ² ) of the monomolecular film when a monomolecular film is formed using 1 g of the surface treatment agent. The minimum coating area can be calculated theoretically from the structure of the surface treatment agent and the like.

Suitable examples of the surface treatment agent include epoxysilane such as 3-glycidoxypropyltrimethoxysilane and vinylsilane such as vinyltrimethoxysilane.

The average particle diameter of the inorganic fine particles is preferably 0.01 μm or more, particularly preferably 0.1 μm or more, and further preferably 0.3 μm or more. The average particle diameter of the inorganic fine particles is preferably 100 μm or less, more preferably 3.0 μm or less, and even more preferably 1.0 μm or less. When the average particle diameter of the inorganic fine particles is in such a range, the resin composition layer 10 is likely to be an object having excellent flexibility and flexibility, and at the same time, it is easy to adjust the content of the inorganic fine particles to a higher filling rate as described above. . In addition, when the average particle diameter of the inorganic fine particles is 1.0 μm or less, when the rewiring layer is formed on the hardened layer formed by curing the resin composition layer 10 as described above, the electrode formability is easily improved.

The maximum particle diameter of the inorganic fine particles is preferably 0.05 μm or more, and particularly preferably 0.5 μm or more. The maximum particle diameter is preferably 5 μm or less, and particularly preferably 3 μm or less. When the maximum particle diameter of the inorganic fine particles is in the above range, the inorganic fine particles can be easily filled in the resin composition, and the thermal expansion rate at the time of curing can be suppressed to be low. In addition, when the redistribution layer is formed on the cured layer formed by curing the resin composition layer 10 as described above, fine wiring is easily formed. In addition, the average particle diameter and the maximum particle diameter of the inorganic fine particles in this specification are measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT151"). value.

(4) Hardening catalyst It is preferable that the resin composition of this embodiment further contains a hardening catalyst. Thereby, the hardening reaction of a thermosetting resin can be performed efficiently, and the resin composition layer 10 can be hardened favorably. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2 -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2- Methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl 4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-bis (hydroxymethyl) imidazole and the like.

Specific examples of the amine-based curing catalyst include triazine compounds such as 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine, Tertiary amine compounds such as 1,8-diazabicyclo [5,4,0] undecene-7 (DBU), triethylene ethylenediamine, benzyldimethylamine, triethanolamine and the like. In particular, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine is preferred.

Specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tris (p-methylphenyl) phosphine, and tris (nonylphenyl) phosphine.

The said hardening catalyst may be used individually by 1 type, and may use 2 or more types together.

From the viewpoint of hardenability, the melting point of the hardening catalyst is preferably 180 ° C or lower, particularly preferably 100 ° C or lower, and more preferably 60 ° C or lower. When the melting point of the curing catalyst is 180 ° C. or lower, the resin composition layer 10 is easily cured. On the other hand, the lower limit of the melting point of the hardening catalyst is preferably from room temperature (23 ° C) or higher in terms of storage stability.

The hardening catalyst content in the resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and more preferably 0.1% by mass or more. The content is preferably 2.0% by mass or less, particularly preferably 1.5% by mass or less, and further preferably 1.0% by mass or less. When the content is in the above range, the resin composition layer 10 can be hardened more favorably. The content of the curing catalyst is a solid content conversion value.

(5) Other components The resin composition of this embodiment further contains a plasticizer, a stabilizer, an adhesion-imparting material, a colorant, a coupling agent, an antistatic agent, and an antioxidant.

(6) Physical properties and other properties of the resin composition layer In the resin sheet 1 according to this embodiment, the resin composition layer 10 is generated when the resin composition layer 10 is heated at 120 ° C. for 30 minutes as measured by a gas chromatography mass analysis (GC-MS) method. The concentration of volatile components is 100 ppm or more. Here, the volatile component is specifically a residue of an organic solvent component used in a coating liquid for forming the resin composition layer 10.

When the concentration of the volatile component is 100 ppm or more, the surface of the resin composition layer 10 has good adhesiveness, and it is difficult for the surface of the resin composition layer 10 and the interface between the first support sheet 11 and the second support sheet 12 to float. In addition, when the concentration of the volatile component is 100 ppm or more, the fragility of the resin composition layer 10 can be improved, and defects and cracks are less likely to occur in the resin composition layer 10 during processing and during transportation, and workability is improved. From such a viewpoint, the concentration of the volatile component is preferably 1,000 ppm or more, and particularly preferably 5,000 ppm or more.

On the other hand, the upper limit of the concentration of the volatile component is 45,000 pp or less, particularly preferably 35,000 pp or less, and further preferably 30,000 ppm or less. When the concentration of the volatile component is more than 45,000 ppm, the surface of the resin composition layer 10 becomes excessively sticky, or when the resin composition layer 10 is thermally hardened, expansion due to the volatile component is caused, and the reliability of the obtained semiconductor device becomes The cause of the depression.

In the resin sheet 1 of the present embodiment, the organic solvent component remains in the resin composition layer 10 at a specific concentration, which can impart good adhesion to the surface of the resin composition layer 10 and can be suppressed in the resin composition layer. 10. The interface with the first support sheet 11 and the second support sheet 12 floats, and at the same time, the fragility of the resin composition layer 10 can be improved, and defects and cracks in the resin composition layer 10 during processing and transportation can be suppressed .

The concentration of the volatile component can be adjusted by the conditions under which the resin composition layer 10 is formed. For example, the volatile component concentration of the resin composition layer 10 can be adjusted to the above range by adjusting the drying temperature, drying time, type of organic solvent, and the like when the resin composition layer 10 is formed.

The thickness of the resin composition layer 10 can be set in consideration of use and the like. For example, in the method for manufacturing a semiconductor device, when the resin sheet 1 of this embodiment is used for sealing electronic parts, the thickness of the resin composition layer 10 is preferably 20 μm or more, more preferably 50 μm or more, and particularly preferably 60 μm or more More preferably, it is 100 μm or more. The thickness is preferably 1000 μm or less, more preferably 500 μm or less, and further preferably 300 μm or less. When the thickness of the resin composition layer 10 is within the above range, the electronic component can be sealed and sufficiently embedded.

In the method for manufacturing a semiconductor device, when the resin sheet 1 according to this embodiment is used for the formation of an insulating film, the thickness of the resin composition layer 10 is not particularly limited, but it is preferably 5 μm or more, and particularly preferably 10 μm or more. It is preferably 15 μm or more. The thickness is preferably 80 μm or less, particularly preferably 60 μm or less, and more preferably 40 μm or less.

2. First Support Sheet The first support sheet 11 is not particularly limited as long as the contact surface with the resin composition layer is not peeled off by a silicone-based release agent.

As a supporting base material constituting the first supporting sheet 11, it is preferable to use a resin film, a non-woven fabric, paper, or the like. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, and polyethylene naphthalate film; polyethylene films, and polypropylene Polyolefin films such as films; polyimide films and the like. Examples of the nonwoven fabric include nonwoven fabrics using fibers such as rayon, acrylic resin, and polyester. Examples of the paper include fine paper, glassine paper, impregnated paper, coated paper, and the like. These can also be used in the form of two or more laminated bodies. In addition, the supporting substrate constituting the first supporting sheet 11 may be subjected to surface treatments such as primer treatment, corona treatment, plasma treatment, and oxidation treatment on one or both sides as necessary.

The material constituting the resin film preferably has a glass transition temperature (Tg) of 50 ° C or higher, particularly preferably a glass transition temperature (Tg) of 55 ° C or higher, and more preferably a glass transition temperature (Tg) of 60 ° C or higher. When the glass transition temperature (Tg) of the material is 50 ° C. or higher, the first support sheet 11 is thermally hardened even when the first support sheet 11 is laminated on the resin composition layer 10. It is not easy to be thermally deformed, so that the first support sheet 11 can be easily peeled from the hardened layer. The upper limit of the glass transition temperature (Tg) is not particularly limited, but is usually preferably 500 ° C or lower, and particularly preferably 400 ° C or lower. The glass transition temperature (Tg) is a value measured using a differential scanning calorimeter.

When the first support sheet 11 is peeled off by a release agent other than a silicone-based release agent, as the release agent, an alkyd-based release agent, a fluorine-based release agent, a long-chain alkyl-based release agent, or an olefin resin is used. At least one of a system-based release agent, an acrylic-based release agent, and a rubber-based release agent is preferable, and among these, an alkyd-based release agent is particularly preferably used.

The thickness of the first support sheet 11 is usually 10 μm or more and 250 μm or less.

3. Second supporting sheet As the supporting base material 1 constituting the second supporting sheet 12, a resin film, a non-woven fabric, paper, or the like is preferably used. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, and polyethylene naphthalate film; polyethylene films, and polypropylene Polyolefin films such as films; polyimide films and the like. Examples of the nonwoven fabric include nonwoven fabrics using fibers such as rayon, acrylic resin, and polyester. Examples of the paper include fine paper, glassine paper, impregnated paper, coated paper, and the like. These can also be used in the form of two or more laminated bodies. In addition, the supporting substrate constituting the second supporting sheet 12 may be subjected to surface treatments such as primer treatment, corona treatment, plasma treatment, and oxidation treatment on one or both sides as necessary.

The contact surface between the second support sheet 12 and the resin composition layer 10 may be subjected to a peeling treatment with a release agent, or may not be subjected to a peeling treatment.

As the release agent, a silicone-based release agent, an alkyd-based release agent, a fluorine-based release agent, a long-chain alkyl-based release agent, an olefin resin-based release agent, an acrylic-based release agent, and a rubber-based release agent are used. At least one is preferred.

In addition, from the viewpoint of suppressing floating at the interface between the second support sheet 12 and the resin composition layer 10 and improving the operability during storage and operation of the resin sheet 1, the second support sheet 12 and the resin composition layer The contact surface of 10 is preferably not subjected to a peeling treatment with a silicone-based release agent.

The thickness of the second support sheet 12 is not particularly limited, but is usually 20 μm or more and 250 μm or less.

4. Physical properties of resin sheet In the resin sheet 1 of this embodiment, the peel force when the first support sheet 11 is peeled from the resin composition layer 10 is set to F1, and when the second support sheet 12 is peeled from the resin composition layer 10 When the peeling force is set to F2, it is preferable that F1 and F2 satisfy the following formula (1): F11 / F2> 1 ･ ･ ･ (1). With this, in a state where the first support sheet 11 remains in the resin composition layer 10, the second support sheet 12 is easily peeled from the resin composition layer 10. Accordingly, it is possible to effectively suppress the occurrence of defects and cracks in the resin composition layer 10 accompanying the peeling operation.

The peeling force F1 when peeling the first support sheet 11 from the resin composition layer 10 is preferably 0.05 N / 100 mm or more, and more preferably 0.1 N / 100 mm or more. The peeling force F1 is preferably 2.0 N / 100 or less, and particularly preferably 1.5 N / 100 mm or less.

The peeling force F2 when the second support sheet 12 is peeled from the resin composition layer 10 is preferably 0.05 N / 100 mm or more, and particularly preferably 0.1 N / 100 mm or more. The peeling force F2 is preferably 2.0 N / 100 mm or less, and particularly preferably 1.5 N / 100 mm or less.

When the peeling forces F1 and F2 are within the respective ranges described above, it is possible to effectively suppress the occurrence of floating at the interface between the resin composition layer 10 and the first support sheet 11 or at the interface between the resin composition layer 10 and the second support sheet 12. .

The peeling force was measured as follows. That is, a test piece obtained by cutting the resin sheet 1 into a width of 100 mm and a length of 100 mm was T-shaped at a peeling speed of 300 mm / min in an environment according to JIS K6854-3: 1999 and a relative humidity of 50% at 23 ° C. Peeling, and peeling off the 1st support sheet 11 or the 2nd support sheet 12, can obtain the peeling force F1 or F2 as the peeling force (N / 100mm) measured at this time.

5. Manufacturing method of resin sheet The resin sheet 1 of this embodiment is not particularly limited. For example, a coating liquid containing the above-mentioned resin composition and a further solvent or dispersion medium as required can be prepared, and the coating liquid can be spin-coated. Cloth coating, spray coating, bar coating, blade coating, roll coating, roll blade coating, blade coating, die coating, gravure coating, etc. The coating method is applied to the second support sheet 12 to form a coating film, and the resin composition layer 10 is formed by drying the coating film.

Here, from the viewpoint of adjusting the concentration of the volatile component in the resin composition layer 10 to the above range, the drying temperature of the coating film is preferably set to 50 ° C. or higher, and particularly preferably set to 60 ° C. or higher. The temperature is preferably 70 ° C or higher. The drying temperature is preferably 150 ° C or lower, particularly preferably 140 ° C or lower, and further preferably 130 ° C or lower. The drying time of the coating film is preferably 30 seconds or more from the same viewpoint. The drying time is preferably 30 minutes or less. The solid content concentration of the coating liquid is preferably, for example, 30% by mass or more, and particularly preferably 35% by mass or more. The solid content concentration is preferably 60% by mass or less, and particularly preferably 50% by mass or less.

Next, the formed resin composition layer 10 can be adhered to a surface on the side opposite to the second support sheet 12 and a surface of the first support sheet 11 (the release-treated surface when treated with a release agent) to be bonded to each other. Manufacture resin sheet 1.

Examples of the solvent include toluene, ethyl acetate, methyl ethyl ketone, isobutanol, methyl isobutyl ketone, n-butanol, butyl acetate, 2-methoxypropanol, and isobutyl acetate. , Tetrachloroethylene, ethylene glycol monomethyl ether, methylbutyl ketone, isoamyl alcohol, ethylene glycol monoethyl ether, N, N-dimethylformamide (DMF), ethylene glycol monoethyl ether acetate , Turpentine, cyclohexanone, ethylene glycol monobutyl ether and other organic solvents. Among these, high-boiling-point solvents such as cyclohexanone and ethylene glycol monobutyl ether are preferably used from the viewpoint that the concentration of volatile components can be easily adjusted to the above-mentioned range, and particularly from the general versatility and solubility From the viewpoints of others, it is preferable to use cyclohexanone.

[Semiconductor Device] The semiconductor device according to this embodiment includes a hardened layer obtained by hardening the resin composition layer 10 of the resin sheet 1 according to this embodiment. The conditions for curing the resin composition layer 10 can be performed using conventionally known conditions. Generally, the heating temperature is preferably 100 ° C or more and 240 ° C or less, and the heating time is preferably 15 minutes or more and 300 minutes or less. In addition, the hardening of the resin composition layer 10 may be performed in steps by a plurality of heat treatments. Here, the semiconductor device of this embodiment may be provided with a hardened layer as a layer for sealing an electronic component, or may be provided with a hardened layer as an insulating film. The semiconductor device of this embodiment is a semiconductor device manufactured by using a panel-level package. As a specific example, a semiconductor package manufactured by using a panel-level fan-out packaging technology (FOPLP) can be mentioned.

As described above, the resin sheet 1 according to this embodiment is less likely to float at the interface between the resin composition layer 10 and the first support sheet 11, and at the same time, the fragility of the resin composition layer can be improved. As a result, the resin sheet 1 is less likely to generate defects and cracks in the resin composition layer during processing and transportation, and can achieve excellent and excellent operability. Therefore, the semiconductor device of this embodiment manufactured by using the resin sheet 1 of this embodiment is manufactured by using this resin sheet 1 and becomes a thing with good quality.

The resin sheet 1 of this embodiment can be suitably used as a sheet for sealing electronic parts (resin sheet for sealing) or a sheet for forming an insulating film ( Resin sheet for interlayer insulation layer). In addition, the resin sheet 1 of this embodiment can be suitably used in a case where it is refrigerated and stored in a state protected by a supporting sheet, and more specifically, it can be suitably used in a case where it is refrigerated and stored at 5 ° C or lower. The resin sheet 1 according to this embodiment can be suitably used for a method for manufacturing a semiconductor device in which a redistribution layer is formed on a hardened layer formed by curing a resin composition layer 10.

In addition, when the resin sheet 1 of this embodiment is manufactured using a fan-out packaging technology (FOPLP) to manufacture a semiconductor package, the resin sheet 1 can be effectively suppressed even if the size of the resin sheet 1 is a large area. Floating occurs at the interface between the layer 10 and the support sheet.

From the viewpoints described above, the semiconductor device of this embodiment manufactured using the resin sheet 1 of this embodiment is manufactured using this resin sheet 1 and has a good quality.

The embodiments described above are described for easy understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment also includes all design changes and equivalents belonging to the technical scope of the present invention. [Example]

Hereinafter, the present invention will be described in more detail by way of examples, test examples, and the like, but the present invention is not limited at all by the following test examples and the like.

[Example 1] As a thermoplastic resin, 5.1 parts by mass of a bisphenol A-type phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "jER1256") (solid content conversion, the same below) as a thermosetting resin 5.7 parts by mass of phenol A epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "jER828"), biphenyl epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product name "NC-3000-L") 5.7 parts by mass, 4.1 parts by mass of a naphthalene-type epoxy resin (manufactured by DIC Corporation, product name "HP-4700") as a thermosetting resin, and biphenyl-type phenol (manufactured by Meiwa Chemical Co., Ltd.) as a thermosetting resin (Named "MEHC-7851-SS") 14.1 parts by mass, 2-ethyl-4-methylimidazole as an imidazole-based hardening catalyst (manufactured by Shikoku Kasei Corporation, product name "2E4MZ", melting point about 40 ° C) 0.1 mass Parts, epoxy silane-treated silica filler as inorganic fine particles [using 3-glycidoxypropane trimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-403", minimum coating area: 330 m ² / g ) A silicon oxide filler (manufactured by ADMATECHS, product name "SO-C2", average particle size: 0. 5 μm, maximum particle size: 2 μm, shape: spherical)) 65 parts by mass, mixed in a 1: 1 mixed solvent of cyclohexanone and methyl ethyl ketone to obtain a solid content concentration It is a coating liquid of 40 mass% of a resin composition.

The coating liquid obtained as described above was applied to one side of a polyethylene terephthalate film (Tg: 67 ° C) as a first supporting sheet, and peeled off using an alkyd-based release agent. The peeled surface of the film (manufactured by LINTEC, product name "PET38AL-5", thickness: 38 μm), and the obtained coating film was dried at 100 ° C. for 90 seconds to obtain a resin composition layer having a thickness of 50 μm and the first layer. Laminates supporting the sheet.

Next, a release film (manufactured by LINTEC Corporation, product name "PET38X", thickness: (38 μm) peeling treatment surface and the surface on the resin composition layer side of the laminated body obtained as described above, to obtain a first support sheet, a resin composition layer, and a second support sheet laminated in this order Resin sheet.

In the obtained resin sheet, the peeling force F1 when the first support sheet is peeled from the resin composition layer and the peeling force F2 when the second support sheet is peeled from the resin composition layer satisfy the relationship of the following formula (1). , F1 / F2> 1 ･ ･ ･ (1).

[Examples 2 to 4] A resin sheet was obtained in the same manner as in Example 1 except that the drying conditions of the coating film were changed as shown in Table 1.

[Comparative Example 1] Except as a first support sheet, a release film (manufactured by LINTEC Corporation, product name "SP- PET382150 ", thickness: 38μm), as the second support sheet, a release film (manufactured by LINTEC Corporation, product name" product " SP-PET381031 ", thickness: 38 µm), and the drying conditions of the coating film were changed in the same manner as in Table 1, and a resin sheet was obtained in the same manner as in Example 1.

[Comparative Examples 2 and 3] A resin sheet was obtained in the same manner as in Example 1 except that the drying conditions of the coating film were changed as shown in Table 1.

[Test Example 1] (Measurement of Volatile Component Concentration) The resin sheet produced in the examples and comparative examples was cut to a size of 10 mm x 50 mm, and then the first support sheet and the second support sheet were peeled to obtain a resin composition layer. As a measurement sample. This measurement sample was sealed in a measurement sample bottle and heated at 120 ° C for 30 minutes. The generated gas was introduced into a gas chromatograph mass spectrometer (manufactured by Shimadzu Corporation, product name "GCMS-QP2010") and measured. The amount of gas produced. This amount is defined as the concentration (ppm) of volatile components. The results are shown in Table 1.

[Experimental Example 2] (Evaluation of Tackiness) The second support sheet was peeled from the resin sheets produced in Examples and Comparative Examples, and the exposed surface of the resin composition layer exposed by finger contact was evaluated on the resin based on the following criteria The tackiness of the surface of the composition layer. The results are shown in Table 1. Adhesive: The surface of the resin composition layer sticks to the fingers. Non-adhesiveness: No sticking of the surface of the resin composition layer to the fingers.

[Experimental Example 3] (Evaluation of floatation during storage) After the resin sheets produced in the examples and comparative examples were stored in an environment at 5 ° C for one week, the floatation at the interface between the resin composition layer and the support sheet was evaluated. Arises. The results are shown in Table 1. A: Floating does not occur at both the interface between the resin composition layer and the first support sheet, and at the interface between the resin composition layer and the second support sheet. B: Some floating occurs at the interface between the resin composition layer and the first support sheet, and at the interface between the resin composition layer and the second support sheet, but there is no problem in practical use. C: Both the interface between the resin composition layer and the first support sheet and the interface between the resin composition layer and the second support sheet have raised practical problems.

[Experimental Example 4] (Evaluation of operability) The second support sheet was peeled from the resin sheets produced in Examples and Comparative Examples, and the exposed area layer of the exposed resin composition layer was after the dummy substrate (500 mm × 400 mm) , The first support sheet is peeled from the resin composition layer. Next, this resin composition layer was heated at 100 ° C for 60 minutes, and then heated at 170 ° C for 60 minutes to harden the resin composition layer and form a cured layer. The operability of the resin sheet in this series of processes was evaluated based on the following criteria. The results are shown in Table 1. A: No defect or crack occurs in the resin composition layer. B: A few defects and cracks occurred in the resin composition layer. C: Although defects and cracks do not occur in the resin composition layer, the surface of the resin composition layer is excessively sticky, and expansion occurs in the hardened layer. D: At least one of a level defect and a crack which causes a practical problem in the resin composition layer.

[Table 1]

As shown in Table 1, the resin sheet of the example can suppress the occurrence of floating during storage and can achieve excellent storage suitability. At the same time, it can suppress the occurrence of defects and cracks in the resin composition layer and has excellent operability. Industrial availability

The resin sheet of the present invention can be suitably used as a sheet for sealing electronic parts or a sheet for forming an insulating film in a method for manufacturing a semiconductor device using a panel-level package.

1‧‧‧ resin sheet

10‧‧‧ resin composition layer

11‧‧‧ the first supporting sheet

12‧‧‧ 2nd support sheet

FIG. 1 is a cross-sectional view of a resin sheet according to an embodiment of the present invention.

Claims (6)

A resin sheet, which is a resin sheet used in a method for manufacturing a semiconductor device using a panel-level package and used for forming a sealing of an electronic part or forming an insulating film, wherein the resin sheet includes a first support sheet and is laminated on the aforementioned sheet. The resin composition layer on one side of the first support sheet and the second support sheet laminated on the side of the resin composition layer opposite to the first support sheet, the resin composition layer is made of a thermosetting resin. , A thermoplastic resin, and a resin composition of inorganic fine particles, wherein the content of the inorganic fine particles in the resin composition is 50% by mass or more, and the content of the thermoplastic resin in the resin composition is 30% by mass or less, The contact surface between the first support sheet and the resin composition layer is not peeled off by a silicone-based release agent, and the resin composition layer is heated at 120 ° C. by gas chromatography mass spectrometry. The volatile component concentration at 30 minutes was 100 ppm or more and 45,000 ppm or less. The resin sheet according to item 1 of the scope of patent application, wherein the thermoplastic resin does not contain an acrylic resin. The resin sheet according to item 1 of the scope of patent application, wherein the surface on the resin composition layer side of the first support sheet is peeled off by an alkyd-based release agent. The resin sheet according to item 1 of the scope of patent application, wherein the first support sheet is provided with a resin support substrate having a glass transition temperature (Tg) of 50 ° C or higher. The resin sheet according to item 1 of the patent application scope, wherein the surface on the resin composition layer side of the second support sheet is peeled off by a release agent. A semiconductor device comprising a hardened layer obtained by hardening a resin composition layer of a resin sheet according to any one of claims 1 to 5 of the scope of patent application.