TW201920577A - 光與濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑 - Google Patents

光與濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑 Download PDF

Info

Publication number
TW201920577A
TW201920577A TW107132388A TW107132388A TW201920577A TW 201920577 A TW201920577 A TW 201920577A TW 107132388 A TW107132388 A TW 107132388A TW 107132388 A TW107132388 A TW 107132388A TW 201920577 A TW201920577 A TW 201920577A
Authority
TW
Taiwan
Prior art keywords
moisture
light
resin composition
meth
curable resin
Prior art date
Application number
TW107132388A
Other languages
English (en)
Chinese (zh)
Inventor
徐坤
結城彰
高橋徹
木田拓身
玉川智一
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW201920577A publication Critical patent/TW201920577A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/302Water
    • C08G18/307Atmospheric humidity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/067Polyurethanes; Polyureas
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/16Catalysts
    • C08G18/18Catalysts containing secondary or tertiary amines or salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/524Esters of phosphorous acids, e.g. of H3PO3
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)
TW107132388A 2017-09-15 2018-09-14 光與濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑 TW201920577A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017177757 2017-09-15
JPJP2017-177757 2017-09-15

Publications (1)

Publication Number Publication Date
TW201920577A true TW201920577A (zh) 2019-06-01

Family

ID=65723401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107132388A TW201920577A (zh) 2017-09-15 2018-09-14 光與濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑

Country Status (5)

Country Link
JP (1) JPWO2019054463A1 (ko)
KR (1) KR20200047444A (ko)
CN (1) CN110650983A (ko)
TW (1) TW201920577A (ko)
WO (1) WO2019054463A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110387031B (zh) * 2019-07-12 2021-06-29 万华化学集团股份有限公司 一种浅色异氰酸酯制备方法
KR20230113551A (ko) * 2020-11-30 2023-07-31 세키스이가가쿠 고교가부시키가이샤 습기 경화성 수지 조성물, 및 전자기기용 접착제
KR102569482B1 (ko) * 2021-11-22 2023-08-24 주식회사 아이델 Uv 경화형 접착제 조성물

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999042525A1 (en) * 1998-02-19 1999-08-26 The Yokohama Rubber Co., Ltd. One-can moisture-curing urethane compositions
JP2001064543A (ja) * 1999-08-27 2001-03-13 Nippon Shokubai Co Ltd 硬化型被覆材用樹脂組成物
JP4433571B2 (ja) * 2000-06-07 2010-03-17 横浜ゴム株式会社 湿気硬化型ポリウレタン組成物
JP2002179753A (ja) * 2000-12-13 2002-06-26 Nippon Shiika Kk 高耐候性ポリウレタン系一液型湿気硬化性組成物
JP4301821B2 (ja) * 2003-01-22 2009-07-22 株式会社カネカ 貯蔵安定性が改善された硬化性組成物
US7834123B2 (en) 2006-05-19 2010-11-16 Henkel Ag & Co. Kgaa Two component polyurethane adhesive
WO2010086924A1 (ja) 2009-01-29 2010-08-05 セメダイン株式会社 耐熱性一液湿気硬化型ポリカーボネート樹脂用接着剤組成物
DE102010010598A1 (de) * 2010-03-08 2011-09-08 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Dual härtende Masse und deren Verwendung
WO2013016133A2 (en) * 2011-07-22 2013-01-31 H.B. Fuller Company A one-component, dual-cure adhesive for use on electronics
US9315695B2 (en) * 2014-06-26 2016-04-19 Dymax Corporation Actinic radiation and moisture dual curable composition
JP2016199672A (ja) * 2015-04-09 2016-12-01 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP6798791B2 (ja) * 2015-04-13 2020-12-09 積水化学工業株式会社 電子部品用接着剤、及び、表示素子用接着剤

Also Published As

Publication number Publication date
KR20200047444A (ko) 2020-05-07
CN110650983A (zh) 2020-01-03
WO2019054463A1 (ja) 2019-03-21
JPWO2019054463A1 (ja) 2020-08-27

Similar Documents

Publication Publication Date Title
CN105637001B (zh) 光湿气固化型树脂组合物、电子部件用粘接剂、以及显示元件用粘接剂
CN106232634B (zh) 固化体、电子部件及显示元件
TWI701310B (zh) 硬化體、電子零件、顯示元件、及光與濕氣硬化型樹脂組成物
TWI666285B (zh) Light and moisture curing resin composition, adhesive for electronic parts, and adhesive for display elements
TWI673571B (zh) 光與濕氣硬化型樹脂組成物、電子零件用接著劑、及顯示元件用接著劑
TWI826354B (zh) 接著劑組成物、硬化體、電子零件及組裝零件
TWI682982B (zh) 光與濕氣硬化型樹脂組成物、電子零件用接著劑、及顯示元件用接著劑
TW201920577A (zh) 光與濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑
CN113286859B (zh) 固化性树脂组合物及固化体
JP6798791B2 (ja) 電子部品用接着剤、及び、表示素子用接着剤
TWI712665B (zh) 光濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑
JP2018002925A (ja) 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
KR102458390B1 (ko) 습기 경화형 수지 조성물 및 조립 부품
TW202309235A (zh) 濕氣硬化型接著劑組成物、及硬化體
TW202309214A (zh) 光與濕氣硬化型接著劑組成物、及硬化體