TW201938468A - 基板翻轉裝置 - Google Patents

基板翻轉裝置 Download PDF

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Publication number
TW201938468A
TW201938468A TW108100376A TW108100376A TW201938468A TW 201938468 A TW201938468 A TW 201938468A TW 108100376 A TW108100376 A TW 108100376A TW 108100376 A TW108100376 A TW 108100376A TW 201938468 A TW201938468 A TW 201938468A
Authority
TW
Taiwan
Prior art keywords
substrate
adsorption
plate body
suction
guide rail
Prior art date
Application number
TW108100376A
Other languages
English (en)
Chinese (zh)
Inventor
西尾仁孝
高松生芳
上野勉
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201938468A publication Critical patent/TW201938468A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Specific Conveyance Elements (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW108100376A 2018-01-31 2019-01-04 基板翻轉裝置 TW201938468A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018015693A JP7085743B2 (ja) 2018-01-31 2018-01-31 基板反転装置
JPJP2018-015693 2018-01-31

Publications (1)

Publication Number Publication Date
TW201938468A true TW201938468A (zh) 2019-10-01

Family

ID=67443729

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108100376A TW201938468A (zh) 2018-01-31 2019-01-04 基板翻轉裝置

Country Status (4)

Country Link
JP (1) JP7085743B2 (ja)
KR (1) KR20190093152A (ja)
CN (1) CN110092172A (ja)
TW (1) TW201938468A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110491817B (zh) * 2019-09-03 2024-04-26 罗博特科智能科技股份有限公司 一种可调式翻片装置
CN111660266B (zh) * 2020-06-15 2023-07-28 潍坊路加精工有限公司 一种翻转装置
CN115055340A (zh) * 2022-05-12 2022-09-16 无锡奥特维科技股份有限公司 一种电池片施胶装置及电池片施胶设备
CN115285642B (zh) * 2022-08-24 2025-05-06 浙江中烟工业有限责任公司 一种翻箱机旋转曲臂位置调节方法
CN116119357B (zh) * 2022-12-15 2025-09-02 永州市亿达自动化机械有限公司 一种玻璃加工用上料装置
CN117607056B (zh) * 2024-01-24 2024-06-14 宁波九纵智能科技有限公司 一种双边多工位正反面外观检测装置及其检测方法
CN117800056B (zh) * 2024-01-29 2024-06-11 江苏云塑海绵制品有限公司 一种发泡海绵运输装置
CN119008500B (zh) * 2024-10-21 2025-01-07 沈阳芯达科技有限公司 一种半导体基板清洁装置及方法
CN120081186B (zh) * 2025-04-30 2025-07-01 深圳市泰科思特精密工业有限公司 一种板材油墨固化加工卸载装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03279116A (ja) * 1990-03-23 1991-12-10 Olympus Optical Co Ltd ワーク反転装置
JPH05301212A (ja) * 1992-04-27 1993-11-16 Hitachi Electron Eng Co Ltd グリーンシートの非接触反転装置
JPH06191638A (ja) * 1992-12-28 1994-07-12 Matsushita Electron Corp 半導体装置の表裏反転装置及び表裏反転方法
JP2002099095A (ja) * 2000-09-25 2002-04-05 Orc Mfg Co Ltd 自動両面露光装置およびその方法
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
JP4197129B2 (ja) 2003-03-19 2008-12-17 シャープ株式会社 ワーク搬送装置
US20080190981A1 (en) * 2003-12-04 2008-08-14 Yasutomo Okajima Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate
JP4467367B2 (ja) * 2004-06-22 2010-05-26 大日本スクリーン製造株式会社 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
JP5334443B2 (ja) 2008-04-02 2013-11-06 日本メクトロン株式会社 板状ワーク反転装置
JP5318482B2 (ja) 2008-07-23 2013-10-16 ジャパンマリンユナイテッド株式会社 板状体の反転装置及び方法
CN101844702B (zh) * 2010-06-21 2012-11-28 深南电路有限公司 翻板机
DE102011055255A1 (de) 2010-11-12 2012-05-16 Schott Solar Ag Verfahren und Vorrichtung zum Transportieren und Wenden von flächigen Gegenständen
KR102007042B1 (ko) * 2012-09-19 2019-08-02 도쿄엘렉트론가부시키가이샤 박리 장치
JP2014080336A (ja) 2012-10-17 2014-05-08 Mitsuboshi Diamond Industrial Co Ltd 基板分断装置
JP6059565B2 (ja) * 2013-03-13 2017-01-11 三星ダイヤモンド工業株式会社 吸着反転装置
CN103754608B (zh) * 2014-01-07 2015-12-02 福耀玻璃工业集团股份有限公司 一种玻璃翻转装置
JP6560572B2 (ja) * 2015-09-14 2019-08-14 株式会社荏原製作所 反転機および基板研磨装置
CN205204160U (zh) * 2015-12-10 2016-05-04 卓达新材料科技集团有限公司 一种自动翻板机
JP6271683B2 (ja) * 2016-11-17 2018-01-31 三星ダイヤモンド工業株式会社 吸着反転装置
CN106956898B (zh) * 2017-03-08 2018-12-04 燕山大学 用于复合板六面探伤的三步式检测装置及方法
CN206679858U (zh) * 2017-03-29 2017-11-28 京东方科技集团股份有限公司 一种翻转机构

Also Published As

Publication number Publication date
CN110092172A (zh) 2019-08-06
KR20190093152A (ko) 2019-08-08
JP2019131372A (ja) 2019-08-08
JP7085743B2 (ja) 2022-06-17

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