TW202100687A - 黏著薄片、黏著薄片之製造方法及半導體裝置之製造方法 - Google Patents

黏著薄片、黏著薄片之製造方法及半導體裝置之製造方法 Download PDF

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Publication number
TW202100687A
TW202100687A TW109110523A TW109110523A TW202100687A TW 202100687 A TW202100687 A TW 202100687A TW 109110523 A TW109110523 A TW 109110523A TW 109110523 A TW109110523 A TW 109110523A TW 202100687 A TW202100687 A TW 202100687A
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TW
Taiwan
Prior art keywords
adhesive layer
adhesive
adhesive sheet
energy
component
Prior art date
Application number
TW109110523A
Other languages
English (en)
Chinese (zh)
Inventor
阿久津高志
Original Assignee
日商琳得科股份有限公司
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Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202100687A publication Critical patent/TW202100687A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
TW109110523A 2019-03-28 2020-03-27 黏著薄片、黏著薄片之製造方法及半導體裝置之製造方法 TW202100687A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019064614 2019-03-28
JP2019-064614 2019-03-28

Publications (1)

Publication Number Publication Date
TW202100687A true TW202100687A (zh) 2021-01-01

Family

ID=72611502

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109110523A TW202100687A (zh) 2019-03-28 2020-03-27 黏著薄片、黏著薄片之製造方法及半導體裝置之製造方法

Country Status (2)

Country Link
TW (1) TW202100687A (fr)
WO (1) WO2020196758A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023037914A1 (fr) * 2021-09-10 2023-03-16
CN119855880A (zh) * 2022-09-22 2025-04-18 琳得科株式会社 粘合片

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
KR101950051B1 (ko) * 2011-09-20 2019-02-19 닛토덴코 가부시키가이샤 전자 부품 절단용 가열 박리형 점착 시트 및 전자 부품 절단 방법
JP2013159743A (ja) * 2012-02-07 2013-08-19 Nitto Denko Corp 粘着剤積層物の剥離方法およびそれに用いる粘着剤層
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法

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Publication number Publication date
WO2020196758A1 (fr) 2020-10-01

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