TW202423573A - 銅粉及含此之銅漿以及導電膜之製造方法 - Google Patents

銅粉及含此之銅漿以及導電膜之製造方法 Download PDF

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Publication number
TW202423573A
TW202423573A TW112137528A TW112137528A TW202423573A TW 202423573 A TW202423573 A TW 202423573A TW 112137528 A TW112137528 A TW 112137528A TW 112137528 A TW112137528 A TW 112137528A TW 202423573 A TW202423573 A TW 202423573A
Authority
TW
Taiwan
Prior art keywords
copper
particles
copper particles
particle
mass
Prior art date
Application number
TW112137528A
Other languages
English (en)
Chinese (zh)
Inventor
秋澤瑞樹
澤本裕樹
佐佐木隆史
Original Assignee
日商三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三井金屬鑛業股份有限公司 filed Critical 日商三井金屬鑛業股份有限公司
Publication of TW202423573A publication Critical patent/TW202423573A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09—Mixtures of metallic powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
TW112137528A 2022-09-29 2023-09-28 銅粉及含此之銅漿以及導電膜之製造方法 TW202423573A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-157049 2022-09-29
JP2022157049 2022-09-29

Publications (1)

Publication Number Publication Date
TW202423573A true TW202423573A (zh) 2024-06-16

Family

ID=90478056

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112137528A TW202423573A (zh) 2022-09-29 2023-09-28 銅粉及含此之銅漿以及導電膜之製造方法

Country Status (5)

Country Link
EP (1) EP4596142A4 (fr)
JP (1) JP7498378B1 (fr)
CN (1) CN119816388A (fr)
TW (1) TW202423573A (fr)
WO (1) WO2024071303A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070074A1 (fr) * 2023-09-28 2025-04-03 古河ケミカルズ株式会社 Procédé de production de poudre de cuivre et procédé de production de pâte conductrice

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4227373B2 (ja) 2001-08-07 2009-02-18 三井金属鉱業株式会社 フレーク銅粉及びそのフレーク銅粉を用いた銅ペースト
JP2007234330A (ja) * 2006-02-28 2007-09-13 Tdk Corp 導電体ペーストおよび電子部品
TWI487581B (zh) * 2010-11-12 2015-06-11 Mitsui Mining & Smelting Co Low carbon copper particles and methods for producing the same
WO2015122251A1 (fr) 2014-02-14 2015-08-20 三井金属鉱業株式会社 Poudre de cuivre
JP5941082B2 (ja) * 2014-03-10 2016-06-29 三井金属鉱業株式会社 銅粉
WO2018168186A1 (fr) * 2017-03-15 2018-09-20 日立化成株式会社 Pâte métallique pour liaison, corps lié ainsi que procédé de fabrication de celui-ci, et dispositif à semi-conducteurs ainsi que procédé de fabrication de celui-ci
SG11202109544SA (en) * 2019-03-29 2021-10-28 Mitsui Mining & Smelting Co Bonding material and bonded structure
JP7315408B2 (ja) * 2019-08-08 2023-07-26 三井金属鉱業株式会社 銅粒子
CN115348907B (zh) * 2020-03-31 2024-08-23 三井金属矿业株式会社 铜颗粒及其制造方法

Also Published As

Publication number Publication date
EP4596142A4 (fr) 2026-01-21
WO2024071303A1 (fr) 2024-04-04
CN119816388A (zh) 2025-04-11
JP7498378B1 (ja) 2024-06-11
EP4596142A1 (fr) 2025-08-06
JPWO2024071303A1 (fr) 2024-04-04

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