TW202448780A - 基板收納容器用門 - Google Patents
基板收納容器用門 Download PDFInfo
- Publication number
- TW202448780A TW202448780A TW113120586A TW113120586A TW202448780A TW 202448780 A TW202448780 A TW 202448780A TW 113120586 A TW113120586 A TW 113120586A TW 113120586 A TW113120586 A TW 113120586A TW 202448780 A TW202448780 A TW 202448780A
- Authority
- TW
- Taiwan
- Prior art keywords
- door body
- cover
- peripheral wall
- door
- mounting
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D45/00—Clamping or other pressure-applying devices for securing or retaining closure members
- B65D45/32—Clamping or other pressure-applying devices for securing or retaining closure members for applying radial or radial and axial pressure, e.g. contractible bands encircling closure member
- B65D45/34—Clamping or other pressure-applying devices for securing or retaining closure members for applying radial or radial and axial pressure, e.g. contractible bands encircling closure member lever-operated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023092468 | 2023-06-05 | ||
| JP2023-092468 | 2023-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202448780A true TW202448780A (zh) | 2024-12-16 |
Family
ID=93795341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113120586A TW202448780A (zh) | 2023-06-05 | 2024-06-04 | 基板收納容器用門 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024252868A1 (fr) |
| KR (1) | KR20260018807A (fr) |
| CN (1) | CN121241427A (fr) |
| TW (1) | TW202448780A (fr) |
| WO (1) | WO2024252868A1 (fr) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8540289B2 (en) * | 2005-05-31 | 2013-09-24 | Vantec Co., Ltd. | Opening/closing structure for container for conveying thin plate |
| JP4841383B2 (ja) * | 2006-10-06 | 2011-12-21 | 信越ポリマー株式会社 | 蓋体及び基板収納容器 |
-
2024
- 2024-05-15 CN CN202480037259.5A patent/CN121241427A/zh active Pending
- 2024-05-15 KR KR1020257038404A patent/KR20260018807A/ko active Pending
- 2024-05-15 JP JP2025526019A patent/JPWO2024252868A1/ja active Pending
- 2024-05-15 WO PCT/JP2024/017923 patent/WO2024252868A1/fr not_active Ceased
- 2024-06-04 TW TW113120586A patent/TW202448780A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN121241427A (zh) | 2025-12-30 |
| KR20260018807A (ko) | 2026-02-09 |
| JPWO2024252868A1 (fr) | 2024-12-12 |
| WO2024252868A1 (fr) | 2024-12-12 |
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