TW202448819A - 半導體元件被覆用材料及半導體元件被覆用燒結體 - Google Patents

半導體元件被覆用材料及半導體元件被覆用燒結體 Download PDF

Info

Publication number
TW202448819A
TW202448819A TW113121200A TW113121200A TW202448819A TW 202448819 A TW202448819 A TW 202448819A TW 113121200 A TW113121200 A TW 113121200A TW 113121200 A TW113121200 A TW 113121200A TW 202448819 A TW202448819 A TW 202448819A
Authority
TW
Taiwan
Prior art keywords
glass
sio
zno
semiconductor element
sintered body
Prior art date
Application number
TW113121200A
Other languages
English (en)
Chinese (zh)
Inventor
廣瀬将行
Original Assignee
日商日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW202448819A publication Critical patent/TW202448819A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Glass Compositions (AREA)
TW113121200A 2023-06-08 2024-06-07 半導體元件被覆用材料及半導體元件被覆用燒結體 TW202448819A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023094621 2023-06-08
JP2023-094621 2023-06-08

Publications (1)

Publication Number Publication Date
TW202448819A true TW202448819A (zh) 2024-12-16

Family

ID=93796013

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113121200A TW202448819A (zh) 2023-06-08 2024-06-07 半導體元件被覆用材料及半導體元件被覆用燒結體

Country Status (3)

Country Link
JP (1) JPWO2024253095A1 (fr)
TW (1) TW202448819A (fr)
WO (1) WO2024253095A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060944A (ja) * 1983-09-08 1985-04-08 Nippon Electric Glass Co Ltd 半導体被覆用ガラス
JPH03153545A (ja) * 1989-11-13 1991-07-01 Nippon Electric Glass Co Ltd 半導体被覆用ガラス
WO2012133217A1 (fr) * 2011-03-25 2012-10-04 日本山村硝子株式会社 Composition de verre pour scellement, et matériau d'étanchéité
JP7216323B2 (ja) * 2019-01-29 2023-02-01 日本電気硝子株式会社 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料
CN115038674A (zh) * 2020-01-21 2022-09-09 日本山村硝子株式会社 低热膨胀性封接/被覆用玻璃
WO2024004711A1 (fr) * 2022-06-29 2024-01-04 日本電気硝子株式会社 Verre pour recouvrir un élément semi-conducteur, matériau pour recouvrir un élément semi-conducteur, et corps fritté pour recouvrir un élément semi-conducteur

Also Published As

Publication number Publication date
JPWO2024253095A1 (fr) 2024-12-12
WO2024253095A1 (fr) 2024-12-12

Similar Documents

Publication Publication Date Title
JPS6238300B2 (fr)
CN102741185B (zh) 半导体覆盖用玻璃和使用该玻璃形成的半导体覆盖用材料
TWI809240B (zh) 半導體元件被覆用玻璃及使用其之半導體被覆用材料
TWI821422B (zh) 半導體元件被覆用玻璃及使用此的半導體被覆用材料
TW201309612A (zh) 半導體元件被覆用玻璃
JP5773327B2 (ja) 半導体被覆用ガラス
TWI907380B (zh) 半導體元件被覆用玻璃及使用此的半導體被覆用材料
TW202411171A (zh) 半導體元件覆蓋用玻璃、半導體元件覆蓋用材料以及半導體元件覆蓋用燒結體
TWI819109B (zh) 半導體元件被覆用玻璃及使用此的半導體被覆用材料
TW202448819A (zh) 半導體元件被覆用材料及半導體元件被覆用燒結體
TWI900767B (zh) 半導體元件被覆用玻璃及使用其之半導體元件被覆用材料
TWI850460B (zh) 半導體元件被覆用玻璃及使用其之半導體元件被覆用材料
TW202517596A (zh) 半導體元件被覆用玻璃及使用其之半導體元件被覆用材料
TWI830068B (zh) 半導體元件被覆用玻璃及使用此之半導體被覆用材料
TW202502677A (zh) 半導體元件被覆用玻璃及半導體元件被覆用燒結體
TW202532360A (zh) 玻璃在鈍化電子元件方面的應用及鈍化之電子元件