TW273638B - - Google Patents

Info

Publication number
TW273638B
TW273638B TW084105223A TW84105223A TW273638B TW 273638 B TW273638 B TW 273638B TW 084105223 A TW084105223 A TW 084105223A TW 84105223 A TW84105223 A TW 84105223A TW 273638 B TW273638 B TW 273638B
Authority
TW
Taiwan
Application number
TW084105223A
Other languages
Chinese (zh)
Inventor
Koki Otake
Junichi Kasai
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW273638B publication Critical patent/TW273638B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
TW084105223A 1994-01-20 1995-05-24 TW273638B (cs)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP475194 1994-01-20
JP7003679A JPH07249631A (ja) 1994-01-20 1995-01-13 はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW273638B true TW273638B (cs) 1996-04-01

Family

ID=26337314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105223A TW273638B (cs) 1994-01-20 1995-05-24

Country Status (2)

Country Link
JP (1) JPH07249631A (cs)
TW (1) TW273638B (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489511A (zh) * 2015-11-30 2016-04-13 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3401391B2 (ja) * 1996-04-16 2003-04-28 日本特殊陶業株式会社 半田バンプを有する基板の製造方法
DE19634646A1 (de) * 1996-08-27 1998-03-05 Pac Tech Gmbh Verfahren zur selektiven Belotung
TW344092B (en) * 1996-08-27 1998-11-01 Nippon Steel Corp Semiconductor device provided with low melting point metal bumps and process for producing same
AU3865897A (en) 1997-08-19 1999-03-08 Hitachi Limited Method for forming bump electrode and method for manufacturing semiconductor device
US6653219B2 (en) 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
KR20030070342A (ko) * 2002-02-25 2003-08-30 최록일 반도체 소자의 솔더볼 형성장치 및 그 탑재방법
DE102004041026A1 (de) * 2004-08-25 2005-11-03 Infineon Technologies Ag Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe
JP6225193B2 (ja) * 2013-10-08 2017-11-01 リンテック株式会社 電子部品実装体の製造方法
JP2017157626A (ja) * 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
CN115152007A (zh) * 2019-12-27 2022-10-04 昭和电工材料株式会社 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489511A (zh) * 2015-11-30 2016-04-13 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具
CN105489511B (zh) * 2015-11-30 2019-01-25 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具

Also Published As

Publication number Publication date
JPH07249631A (ja) 1995-09-26

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