TW297210B - - Google Patents

Download PDF

Info

Publication number: TW297210B
Authority: TW; Taiwan
Prior art keywords: reducing; patent application; agent; item; resin layer
Prior art date: 1994-12-02

Application number

TW84112145A

Other languages

English (en)

Chinese (zh)

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-12-02

Filing date

1995-11-16

Publication date

1997-02-01

1995-11-16 Application filed by Motorola Inc filed Critical Motorola Inc

1997-02-01 Application granted granted Critical

1997-02-01 Publication of TW297210B publication Critical patent/TW297210B/zh

Links

229920005989 resin Polymers 0.000 claims description 52
239000011347 resin Substances 0.000 claims description 52
239000002245 particle Substances 0.000 claims description 29
238000000034 method Methods 0.000 claims description 26
230000003197 catalytic effect Effects 0.000 claims description 17
239000003638 chemical reducing agent Substances 0.000 claims description 14
229910044991 metal oxide Inorganic materials 0.000 claims description 11
150000004706 metal oxides Chemical class 0.000 claims description 11
UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 10
229910010277 boron hydride Inorganic materials 0.000 claims description 10
239000003795 chemical substances by application Substances 0.000 claims description 10
229910052751 metal Inorganic materials 0.000 claims description 9
239000002184 metal Substances 0.000 claims description 9
239000000758 substrate Substances 0.000 claims description 9
230000003647 oxidation Effects 0.000 claims description 8
238000007254 oxidation reaction Methods 0.000 claims description 8
238000001465 metallisation Methods 0.000 claims description 7
238000002156 mixing Methods 0.000 claims description 4
239000002738 chelating agent Substances 0.000 claims description 3
238000006243 chemical reaction Methods 0.000 claims description 3
238000009434 installation Methods 0.000 claims description 2
239000007864 aqueous solution Substances 0.000 claims 4
239000000243 solution Substances 0.000 claims 4
XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims 2
XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
239000004020 conductor Substances 0.000 description 17
239000010949 copper Substances 0.000 description 17
BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 13
229910052802 copper Inorganic materials 0.000 description 11
238000004519 manufacturing process Methods 0.000 description 11
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
239000012279 sodium borohydride Substances 0.000 description 10
229910000033 sodium borohydride Inorganic materials 0.000 description 10
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical group OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 9
KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 9
229940112669 cuprous oxide Drugs 0.000 description 9
238000007747 plating Methods 0.000 description 7
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
239000007788 liquid Substances 0.000 description 6
239000000463 material Substances 0.000 description 6
FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical group [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
238000007772 electroless plating Methods 0.000 description 5
238000009713 electroplating Methods 0.000 description 5
238000011282 treatment Methods 0.000 description 5
238000005507 spraying Methods 0.000 description 4
239000002585 base Substances 0.000 description 3
238000009826 distribution Methods 0.000 description 3
239000000945 filler Substances 0.000 description 3
229910021645 metal ion Inorganic materials 0.000 description 3
239000000203 mixture Substances 0.000 description 3
229910052763 palladium Inorganic materials 0.000 description 3
239000000126 substance Substances 0.000 description 3
230000004913 activation Effects 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
239000002131 composite material Substances 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
238000000151 deposition Methods 0.000 description 2
238000004090 dissolution Methods 0.000 description 2
239000011810 insulating material Substances 0.000 description 2
239000004033 plastic Substances 0.000 description 2
235000009518 sodium iodide Nutrition 0.000 description 2
229920005992 thermoplastic resin Polymers 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
229920000877 Melamine resin Polymers 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
229920006397 acrylic thermoplastic Polymers 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
150000001340 alkali metals Chemical class 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000013078 crystal Substances 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000001514 detection method Methods 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
239000000806 elastomer Substances 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
239000012530 fluid Substances 0.000 description 1
238000005984 hydrogenation reaction Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
239000002650 laminated plastic Substances 0.000 description 1
238000005259 measurement Methods 0.000 description 1
JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
238000005121 nitriding Methods 0.000 description 1
231100000989 no adverse effect Toxicity 0.000 description 1
238000000399 optical microscopy Methods 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
238000001020 plasma etching Methods 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
230000005588 protonation Effects 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
239000010454 slate Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
230000004222 uncontrolled growth Effects 0.000 description 1
229920006305 unsaturated polyester Polymers 0.000 description 1
229920002554 vinyl polymer Polymers 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

TW84112145A 1994-12-02 1995-11-16 TW297210B (2)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US08/348,697 US5545430A (en)	1994-12-02	1994-12-02	Method and reduction solution for metallizing a surface

Publications (1)

Publication Number	Publication Date
TW297210B true TW297210B (2)	1997-02-01

Family

ID=23369148

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW84112145A TW297210B (2)	1994-12-02	1995-11-16

Country Status (8)

Country	Link
US (1)	US5545430A (2)
JP (1)	JPH08225952A (2)
KR (1)	KR960021516A (2)
DE (1)	DE19544514C2 (2)
FR (1)	FR2727640A1 (2)
GB (1)	GB2295624B (2)
SG (1)	SG73952A1 (2)
TW (1)	TW297210B (2)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5773089A (en) *	1996-12-18	1998-06-30	E. I. Du Pont De Nemours And Company	Process for treating aramid surfaces to be plated
GB2320728A (en) *	1996-12-30	1998-07-01	Coates Brothers Plc	Depositing a metallic film involving pretreatment
US20040031404A1 (en) *	2002-08-19	2004-02-19	John Dixon	Seamless embossing shim
DE10254927B4 (de) *	2002-11-25	2012-11-22	Infineon Technologies Ag	Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger und Verwendung des Verfahrens
US6905979B2 (en) *	2002-12-23	2005-06-14	Intel Corporation	Apparatus and method for improving AC coupling on circuit boards
TWI412452B (zh) *	2009-04-20	2013-10-21	Unimicron Technology Corp	複合材料結構、包含複合材料之電路板結構與形成複合材料電路板結構的方法
TWI388122B (zh) *	2009-04-20	2013-03-01	Unimicron Technology Corp	形成複合材料電路板結構的方法
US9005854B1 (en) *	2013-11-05	2015-04-14	Eastman Kodak Company	Electroless plating method using halide

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA968908A (en) *	1971-07-29	1975-06-10	Photocircuits Division Of Kollmorgen Corporation	Sensitized substrates for chemical metallization
US3962494A (en) *	1971-07-29	1976-06-08	Photocircuits Division Of Kollmorgan Corporation	Sensitized substrates for chemical metallization
US4002778A (en) *	1973-08-15	1977-01-11	E. I. Du Pont De Nemours And Company	Chemical plating process
US4450190A (en) *	1977-05-13	1984-05-22	Kollmorgen Technologies Corporation	Process for sensitizing articles for metallization and resulting articles
SE441530B (sv) *	1980-12-09	1985-10-14	Ericsson Telefon Ab L M	Sett och bad for att utfora stromlos forkoppring
FR2518126B1 (fr) *	1981-12-14	1986-01-17	Rhone Poulenc Spec Chim	Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
US4450191A (en) *	1982-09-02	1984-05-22	Omi International Corporation	Ammonium ions used as electroless copper plating rate controller
US4424241A (en) *	1982-09-27	1984-01-03	Bell Telephone Laboratories, Incorporated	Electroless palladium process
DE3574270D1 (en) *	1984-06-29	1989-12-21	Hitachi Chemical Co Ltd	Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
US4790876A (en) *	1986-07-01	1988-12-13	Nippondenso Co., Ltd.	Chemical copper-blating bath
US5260170A (en) *	1990-01-08	1993-11-09	Motorola, Inc.	Dielectric layered sequentially processed circuit board
JPH0496293A (ja) *	1990-08-03	1992-03-27	Risho Kogyo Co Ltd	多層印刷回路用基板の製造法
US5162144A (en) *	1991-08-01	1992-11-10	Motorola, Inc.	Process for metallizing substrates using starved-reaction metal-oxide reduction

1994
- 1994-12-02 US US08/348,697 patent/US5545430A/en not_active Expired - Fee Related
1995
- 1995-11-16 TW TW84112145A patent/TW297210B/zh active
- 1995-11-23 FR FR9513954A patent/FR2727640A1/fr active Pending
- 1995-11-29 GB GB9524407A patent/GB2295624B/en not_active Expired - Fee Related
- 1995-11-29 DE DE1995144514 patent/DE19544514C2/de not_active Expired - Fee Related
- 1995-12-01 SG SG1995001995A patent/SG73952A1/en unknown
- 1995-12-01 KR KR1019950046004A patent/KR960021516A/ko not_active Ceased
- 1995-12-01 JP JP33791295A patent/JPH08225952A/ja active Pending

Also Published As

Publication number	Publication date
KR960021516A (ko)	1996-07-18
US5545430A (en)	1996-08-13
GB2295624A (en)	1996-06-05
JPH08225952A (ja)	1996-09-03
SG73952A1 (en)	2000-07-18
DE19544514A1 (de)	1996-06-05
DE19544514C2 (de)	1997-07-10
FR2727640A1 (fr)	1996-06-07
GB2295624B (en)	1998-07-29
GB9524407D0 (en)	1996-01-31

Publication	Publication Date	Title
US5162144A (en)	1992-11-10	Process for metallizing substrates using starved-reaction metal-oxide reduction
TW312080B (2)	1997-08-01
US6212769B1 (en)	2001-04-10	Process for manufacturing a printed wiring board
US4217182A (en)	1980-08-12	Semi-additive process of manufacturing a printed circuit
JPS59207234A (ja)	1984-11-24	樹脂と金属導電体との複合製品とその製法
KR100471332B1 (ko)	2005-03-07	배선 기판, 그 제조 방법 및 그것에 이용하는 무전해구리도금액
TWI291221B (en)	2007-12-11	Printed circuit board, flip chip ball grid array board and method of fabricating the same
JPS59104197A (ja)	1984-06-15	過マンガン酸塩および苛性処理溶液を使用してプリント回路板の孔を浄化する加工法
TW297210B (2)	1997-02-01
TW201322835A (zh)	2013-06-01	導電線路的製備方法及具有導電線路的基材
US5065228A (en)	1991-11-12	G-TAB having particular through hole
KR20080069250A (ko)	2008-07-25	프린트 배선 기판, 그 제조 방법 및 그 사용 방법
WO2003043393A1 (en)	2003-05-22	Circuit board and its manufacturing method
US5545429A (en)	1996-08-13	Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
TW511438B (en)	2002-11-21	Process for producing a circuitry comprising conducting tracks, pads and microvias
KR900003158B1 (ko)	1990-05-09	기판상의 전기회로 형성방법
KR100992569B1 (ko)	2010-11-05	전자파 차폐용 초박막 도전 테이프 및 그 제조 방법
CN1318644C (zh)	2007-05-30	电子设备的层叠结构和无电镀金方法
KR101626295B1 (ko)	2016-06-13	선택적 무전해 도금을 이용한 센서 스트립 제조 방법
TW411748B (en)	2000-11-11	Production method for multi-layer wiring board
TW200938048A (en)	2009-09-01	Method for manufacturing wire substrate
JP2000151096A (ja)	2000-05-30	プリント配線板の製造方法
CN101662881B (zh)	2011-12-07	电路板及其制作方法
TW293984B (2)	1996-12-21
TW499501B (en)	2002-08-21	Member having metallic layer, its manufacturing method