TW293984B - - Google Patents

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Info

Publication number: TW293984B
Authority: TW; Taiwan
Prior art keywords: precious metal; ionic; patent application; metal solution; copper
Prior art date: 1994-10-28

Application number

TW084110519A

Other languages

English (en)

Chinese (zh)

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-10-28

Filing date

1995-10-06

Publication date

1996-12-21

1995-10-06 Application filed by Motorola Inc filed Critical Motorola Inc

1996-12-21 Application granted granted Critical

1996-12-21 Publication of TW293984B publication Critical patent/TW293984B/zh

Links

238000000034 method Methods 0.000 claims description 17
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
229910052802 copper Inorganic materials 0.000 claims description 10
239000010949 copper Substances 0.000 claims description 10
239000010970 precious metal Substances 0.000 claims description 10
239000002184 metal Substances 0.000 claims description 8
229910052751 metal Inorganic materials 0.000 claims description 8
239000003054 catalyst Substances 0.000 claims description 7
238000004519 manufacturing process Methods 0.000 claims description 4
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
239000005751 Copper oxide Substances 0.000 claims description 3
229910000431 copper oxide Inorganic materials 0.000 claims description 3
230000008021 deposition Effects 0.000 claims description 3
239000000758 substrate Substances 0.000 claims description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
238000004898 kneading Methods 0.000 claims description 2
230000003197 catalytic effect Effects 0.000 claims 4
238000000151 deposition Methods 0.000 claims 2
230000001112 coagulating effect Effects 0.000 claims 1
238000002242 deionisation method Methods 0.000 claims 1
239000010408 film Substances 0.000 claims 1
229910000510 noble metal Inorganic materials 0.000 claims 1
239000010409 thin film Substances 0.000 claims 1
239000011347 resin Substances 0.000 description 13
229920005989 resin Polymers 0.000 description 13
239000000243 solution Substances 0.000 description 8
238000009713 electroplating Methods 0.000 description 7
239000002245 particle Substances 0.000 description 5
239000004020 conductor Substances 0.000 description 4
238000007772 electroless plating Methods 0.000 description 4
238000007747 plating Methods 0.000 description 3
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
239000000945 filler Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
229910044991 metal oxide Inorganic materials 0.000 description 2
150000004706 metal oxides Chemical class 0.000 description 2
239000000126 substance Substances 0.000 description 2
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
239000012266 salt solution Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
125000006850 spacer group Chemical group 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

TW084110519A 1994-10-28 1995-10-06 TW293984B (2)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US33047394A	1994-10-28	1994-10-28

Publications (1)

Publication Number	Publication Date
TW293984B true TW293984B (2)	1996-12-21

Family

ID=23289937

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW084110519A TW293984B (2)	1994-10-28	1995-10-06

Country Status (6)

Country	Link
JP (1)	JPH08213738A (2)
KR (1)	KR960014396A (2)
DE (1)	DE19540122C2 (2)
FR (1)	FR2726205B1 (2)
GB (1)	GB2294476B (2)
TW (1)	TW293984B (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2885113B2 (ja) *	1995-01-30	1999-04-19	日本電気株式会社	印刷配線板およびその製造方法
US7588835B2 (en)	2005-03-11	2009-09-15	Hitachi Chemical Company, Ltd.	Method of treating the surface of copper and copper

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2939804A (en) *	1958-01-23	1960-06-07	Uarco Inc	Resin particle coated with metal
GB1003575A (en) *	1962-04-19	1965-09-08	Sperry Gyroscope Co Ltd	Chemical plating process
US3372037A (en) *	1965-06-30	1968-03-05	Ibm	Magnetic materials
GB1322081A (en) *	1970-06-03	1973-07-04	Shipley Co	Electroless nickel solution
US3857724A (en) *	1971-08-20	1974-12-31	Ibm	Primer for electroless plating
GB1360592A (en) *	1973-02-14	1974-07-17	Rca Corp	Electroless cobalt plating bath
US4640718A (en) *	1985-10-29	1987-02-03	International Business Machines Corporation	Process for accelerating Pd/Sn seeds for electroless copper plating
JPH0713304B2 (ja) *	1987-12-14	1995-02-15	日立化成工業株式会社	銅の表面処理法
US5110633A (en) *	1989-09-01	1992-05-05	Ciba-Geigy Corporation	Process for coating plastics articles
US5162144A (en) *	1991-08-01	1992-11-10	Motorola, Inc.	Process for metallizing substrates using starved-reaction metal-oxide reduction
EP0530144A3 (en) *	1991-08-23	1994-08-24	Ciba Geigy Ag	Process for metallising plastic articles
US5212138A (en) *	1991-09-23	1993-05-18	Applied Electroless Concepts Inc.	Low corrosivity catalyst for activation of copper for electroless nickel plating

1995
- 1995-10-02 FR FR9511552A patent/FR2726205B1/fr not_active Expired - Fee Related
- 1995-10-06 TW TW084110519A patent/TW293984B/zh active
- 1995-10-16 GB GB9521107A patent/GB2294476B/en not_active Expired - Fee Related
- 1995-10-19 KR KR1019950036104A patent/KR960014396A/ko not_active Ceased
- 1995-10-24 JP JP7298869A patent/JPH08213738A/ja active Pending
- 1995-10-27 DE DE19540122A patent/DE19540122C2/de not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE19540122A1 (de)	1996-05-02
DE19540122C2 (de)	1997-08-21
FR2726205B1 (fr)	1997-09-26
FR2726205A1 (fr)	1996-05-03
GB2294476B (en)	1998-03-11
KR960014396A (ko)	1996-05-22
GB9521107D0 (en)	1995-12-20
JPH08213738A (ja)	1996-08-20
GB2294476A (en)	1996-05-01

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DE69020796T2 (de)	1996-03-14	Direkt-Elektroplattieren von Durchgangslöchern.
US5380560A (en)	1995-01-10	Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition
US5139818A (en)	1992-08-18	Method for applying metal catalyst patterns onto ceramic for electroless copper deposition
JPS6167988A (ja)	1986-04-08	相互接続をもつ電子回路板を選択的に金属化するための改良した方法
US5817405A (en)	1998-10-06	Circuitized substrate with same surface conductors of different resolutions
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JPS634075A (ja)	1988-01-09	無電解メツキ用シ−ドの形成方法
CA1177579A (en)	1984-11-06	Adhesive removal from printed circuit boards
JP3357473B2 (ja)	2002-12-16	電気鍍金方法
US3791340A (en)	1974-02-12	Method of depositing a metal pattern on a surface
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JPH04231475A (ja)	1992-08-20	新規金属促進剤
TW293984B (2)	1996-12-21
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