TW311274B - - Google Patents

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Publication number
TW311274B
TW311274B TW085108263A TW85108263A TW311274B TW 311274 B TW311274 B TW 311274B TW 085108263 A TW085108263 A TW 085108263A TW 85108263 A TW85108263 A TW 85108263A TW 311274 B TW311274 B TW 311274B
Authority
TW
Taiwan
Prior art keywords
terminal
resistive
patent application
item
terminals
Prior art date
Application number
TW085108263A
Other languages
English (en)
Chinese (zh)
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Application granted granted Critical
Publication of TW311274B publication Critical patent/TW311274B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Protection Of Static Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW085108263A 1995-09-20 1996-07-09 TW311274B (mo)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53096895A 1995-09-20 1995-09-20

Publications (1)

Publication Number Publication Date
TW311274B true TW311274B (mo) 1997-07-21

Family

ID=24115727

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085108263A TW311274B (mo) 1995-09-20 1996-07-09

Country Status (2)

Country Link
JP (1) JPH09121450A (mo)
TW (1) TW311274B (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502721B (zh) * 2013-02-05 2015-10-01 Himax Tech Ltd 晶片靜電放電保護裝置及其靜電放電保護方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502721B (zh) * 2013-02-05 2015-10-01 Himax Tech Ltd 晶片靜電放電保護裝置及其靜電放電保護方法

Also Published As

Publication number Publication date
JPH09121450A (ja) 1997-05-06

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