TW314646B - - Google Patents
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- TW314646B TW314646B TW085109747A TW85109747A TW314646B TW 314646 B TW314646 B TW 314646B TW 085109747 A TW085109747 A TW 085109747A TW 85109747 A TW85109747 A TW 85109747A TW 314646 B TW314646 B TW 314646B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31426—Real time database management for production control
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32209—Stop production line
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32221—Correlation between defect and measured parameters to find origin of defect
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Control By Computers (AREA)
Description
經濟部中央標準局負工消费合作社印装 314646 A7 _B7_ 五、發明説明(ί ) 技術領域: 本發明係有關控制半導體製程之方法,细言之係使用 失敗分析回授的方式控制半導體製程的方法。 發明背景: —般言之,半導體裝置是在相同製程條件下整批地製 造,然後訴諸個別晶片(die)的電性測試,壊的晶片和 好的晶片被査驗註記及電性分類K決定每批或每Η晶圓的 良率。在某批的半導體製程完成後,失敗分析即被執行Μ 找出會影響最後良率的各單元製程間之相互闞係。 參考圖1 ,所繪者為依前技所得之一失敗分析系統, 此失敗分析糸統包括一儀器資料庫12及一良率資料庫 2 2。在儀器資料庫中,所記錄者為運轉中之半導體儀器 Μ及此次運轉的製程條件像溫度、壓力、冥空度、所用氣 體種類與成份等等(第10站)。在良率資料庫22中, 所記錄者為每批的良率,此良率係經由對每一晶Μ作電性 测試而加註記並分類好晶片與壊晶片而得到(第2 0站) 0 當透過電性晶片分類EDS對每一批成品査驗良率Κ形 成良率資料庫2 2時,異常的晶圓或設備中,良率降低發 生者、瑕疵產生於某细部製程者、抑或因異常的設備狀況 而可預知問題者(24站),皆在搜尋之列(14站)。 另外,正常晶圓或設備被以儀器資料庫12為準作搜尋( 30站),異常儀器資料及正常儀器資料二者藉由分析其 -3- 本紙張尺度適用中國國家梂準(CNS ) A4说格(210X297公釐) 丨 ί I裝-------訂-----1 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局爲工消費合作社印«. A7 _B7_ 五、發明説明(z) 良率、設備及製程條件間的相互關係以彼此互相比較,該 分析係Μ統計學程序諸如重要性測驗(significance test )或視覺分析諸如圖像處理來執行(40站)。然後,導 致良率降低的單元製程儀器經由査驗儀器條件及製程條件 而被搜尋K估計出失敗處(50站)。 然而,在此傳统之失敗分析糸統中,分析失敗耗費頗 長之時間,另外,即使失敗快速地被分析出,該失敗分析 仍僅係Μ已完成之該次運轉情況為基礎所執行者。因此, 雖然該失敗分析已被完成,晶圓製程仍是繼續在異常的製 程條件下·因而無法防止失敗的發生或良率的降低。 發明概述: » 因此,本發明即是鑑於發生於前技中之上述問題而創 作者,同時本發明之一目的係提供一方法Κ控制半導體製 程,該方法使用失敗分析回授,將先前失敗分析的结果與 現在之製程條件即時地作比較並且在具有失敗狀況之製程 條件發生後立即停止相應之製程儀器的浬轉。 如本發明之一樣貌所顯,一方法被提供Κ藉由失敗分 析回授來控制半導體製程,該法包含下列步發!: a)藉由 得到當良率下降或儀器問題發生時每批的良率和半導體儀 器的製程條件之間的相互關係Μ建立具異常製程條件之監 控資料庫;b)藉由即時且連線地得到正在運轉中的半導 體儀器之特別製程條件來建立一儀器資料庫;c)比較即 時獲致的上述半導體儀器之上述特別製程條件Μ及上述監 -4- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) ---------J I裝------訂-----\線 (請先閲讀背面之注意事項再填寫本頁) 314646 A7 B7 五、發明説明()) 控資料庫之異常製程條件;Μ及d)當即時獲致之上述特 別製程條件與上述監控資料庫之上述異常製程條件間的相 似程度超過一預定水準時,停止相應製程中之上述半導體 儀器的運轉。 如本發明之另一樣貌所顯,建立一監控資料庫的步驟 包含下列步驟:e)揀選出良率異常下降或因儀器問題致 引起良率變化時每批之良率資料;f)連结儀器運轉經歷 與闞於上述儀器資料庫之對應儇器编號以分析揀選出之良 率資料的失敗原因;s)對每批成品藉由自上述儀器資料 庫謓取連结之儀器連轉經歷以编集製程條件的資料;以及 h)對應於上述儀器對每批成品以所編集之資料為基礎製 作一報告並顯示出良率的趨勢。 再如本發明之另一樣貌所顯,一方法被提供K藉由失’ 敗分析回授來控制半導體製程,此法包含下列步驟:a) 藉由得到當良率下降或儀器問題發生時每批的良率和半導 體儀器的製程條件之間的相互醑係Μ建立具異常製程條件 之監控資料庫;b)藉由即時且連鑛地得到正在運轉中的 半導體儀器之特別製程條件來建立一儀器資料庫;c)比 較即時獲致的上述半導體儀器之上述特別製程條件以及上 述監控資料庫之異常製程條件;Μ及d)當即時獲致之上 述特別製程條件與正常製程條件間的差異超過一預定水準 時,停止相應製程中之上述半導體儀器的運轉。 由本發明之特點可知,半導體製造線係被連線監控的 本紙張尺度逍用中國國家標準(CNS ) A4規格(210X 297公釐) I.-------f I裝------訂-----1 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央樣準局負工消費合作社印裂 經濟部中央橾率局員工消費合作社印製 A7 _B7_ 五、發明说明(〜) ,Μ卽時建立儀器運轉經歷作為資料庫。正在運轉中之儀 器的異常狀況可藉失敗分析較諸先前建立之監控資料庫而 偵測出。倘若異常的製程條件被偵測出,其將被認定會導 致良率之降低而儀器的運轉即被停止*因反制失敗的即時 反應是可能的。是故,製程問題及良率降低皆可被防止。 圖式簡略說明: 本發明之上述物件、其他的特色與優點在看過Κ下關 於圖式的詳细說明後將更為明顯: 圖1係描繪前技之失敗分析糸統的系統圖形;Κ及 圖2係描繪依本發明之一實施例,藉失敗分析回授控 制半導髖製程的方法之系統圖形。 較佳實施例說明: 在半導體製造中*具有相同圖案的多涸半等體小片, 亦即晶片(d i e ),被製造在同一晶圓上,於沿著包含各 種單元製程如光蝕刻印刷、離子植入、熱處理、蝕刻、沈 積、金靥處理等等的一自動化生產線移動時承受相同的製 程條件。每一單元製程有其包括相懕的儀器與製程條件如 溫度、壓力、真空度、使用氣體之種類與成份等等之一儀 器運轉經歷*對於數批晶片的每一批,儀器理轉經歴皆被 記錄下來,此儀器運轉經歷被一埋線之監控儀器1 0 0即 時地監控制,如圖2所示,對每批晶片所得到的儀器浬轉 經歷被記錄至儀器資料庫1 02。 由Μ上製程製作出的半導體裝置時接受査驗的程序( -6 - 本紙張尺度遑用中國國家標準(CNS ) Α4規格(210Χ297公釐) 丨;-------,-裝------訂-----線 (請先閱讀背面之注意事項再填寫本瓦) 經濟部中央標準局負工消费合作社印製 A7 _____B7 五、發明説明(< ) 200站),在査驗程序中,關於是否晶圓上的晶Μ是好 的或壞的之評斷被啟動,依査驗程序的结果,壊的晶片Κ 墨水標記*同時經由查驗程序所得一批晶片的良率資料被 記錄於良率資料庫2 0 2中,一批異常晶片的良率資料被 揀選出來歸類在異常良率降低或由於儀器問題及類似狀況 導致良率變動下(204站)。為分析失敗的原因,該批 晶片的編號被連结至儀器資料庫10 2中的相應批號( 3 0 0 站)° 然後,該批晶片的製程條件方面的資料藉由自儀器資 料庫102讀取被連结儀器的浬轉經歷而被编集(302 站),而一份報告則由編集的資料印出(304站)同時 對應該批晶片之儀器的良率趨勢亦被顯示出來(3 0 6站 )。 異常的EDS良率降低或由於儀器問題所致的良率異常 變動藉由統計分析程序如回授分析、重要性测驗( significance test )及類似方法並參考報告内容而加Μ 分析(400站),依據分析過的異常儀器與良率的相互 關係所得的儀器製程條件則被記錄至監控資料庫4 0 2。 現在運轉中之儀器的製程條件被連線監控儀器100 即時地與監控之製程條件作比較而參考監控資料庫4 0 2 。倘若比較结果在預定的水準内,儀器繼續運轉,反之, 若比較结果超過預定水準,儀器的運轉則被停止(6 0 0 站)。 本紙張尺度遑用中國國家標準(CNS ) Α4規格(210X297公釐) --------f ·裝------訂-----η線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消费合作社印製 A7 _B7__五、發明説明() 如上所述,依據本發明,半導體製造媒係被連媒監控 的,以即時建立儀器蓮轉經歷作為資料庫。正在運轉中之 儀器的異常狀況可藉失敗分析較諸先前建立之監控資料庫 而偵測出。倘若異常的製程條件被偵測出,其將被認定會 導致良率之降低而儀器的運轉便被停止,因而反制失則的 即時反應是可能的。是故,依本發明所言,製程問題及良 率降低皆可被防止。 雖然本發明已以其較佳實施例為參考而被描述及圖示 說明,本發明之不限於該實施例,及不同的變化與修改乃 可行而不會背離本發明所附申請專利範園所定義之精神與 涵蓋範团的事s懕是可立即理解的。 (請先閲讀背面之注意事項再填寫本頁) .裝. 訂 -8 - 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
Claims (1)
14646 A8 B8 C8 D8 經濟部中央標準局貝工消費合作社印製 六、申請專利範圍 1·一種藉由失敗分析回授來控制一半導體製程之方 法,該方法包括下列步驟: a )藉由獲致當良率降低或儀器問題發生時每一批晶 片之良率與半導體儀器之製程條件的相互關係來建立具有 異常製程條件資料的監控資料庫; b) 藉由即時而連線地獲致運轉中之半導體儀器的特 定製程條件來建立一儀器資料庫; c) 比較即時獲致之上述半導體儀器的上述特定製程 條件和上述監控資料庫的異常製程條件;K及 d) 當即時獲致之上述特定製程條件與上述監控資料 庫之上述異常製程條件間的相似度超過一預定水準時,停 止在相應製程中之上述半導體儀器的運轉。 2·如申請專利範圍第1項所述藉由失敗分析回授以 控制一半導體製程之方法,其中上述建立一監控資料庫之 階段包含以下步驟: a )對每一批晶片分類良率資料*揀選出良率異常降 低者或因儀器問題致良率變動者; b) 連结儀器運轉經歷K及相應之儀器編號,並參考 上述儀器資料庫K分析揀選出之良率資料的失敗原因; c) 對每批晶片藉由自上述儀器資料庫謓取連結之儀 器運轉經歷來編集製程條件之資料;以及 d) 基於所編集之資料製作一報告,並且顯示出每批 晶片相應於上述儀器之良率趨勢。 -1 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ^ 裝 訂 線 (請先閱讀背面之注意事項再填寫本頁) 申請專利範圍 A8 B8 C8 D8 方晶有 特 程 件半 之批具 的 製 條述 程一立 器 定 程上 製每建 儀 特 製之 體時來 體 述 常中 導生係 導 上及正程 半 發關 半 的 Μ 與製 一 題互 之 器.,件應 制 問相 中 儀件條相 控 器的 轉 體條程在 來 儀件.,運.,導程製止 授 或條庫致庫半製定停 回 低程料獲料述常特, 析:降製資地資上異述時 分驟率之控線器之的上準 敗 '步良器監連儀致庫之水 失列當儀的而一獲料致定 由下致體料時立時資獲預 。 藉括獲導資即建即控時一轉 種包由半件由來較監即過運 一 法藉與條藉件比述當超的 . 方} 率程} 條} 上} 異器 3 該 a 良製 b 程 C 和 d 差儀 , 之常 製 件 的體 法 片異 定 條 間導 -----------^------tr------.ii (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950053372A KR100200480B1 (ko) | 1995-12-21 | 1995-12-21 | 불량 분석 피드백에 의한 반도체 제조공정 제어방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW314646B true TW314646B (zh) | 1997-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085109747A TW314646B (zh) | 1995-12-21 | 1996-08-12 |
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| Country | Link |
|---|---|
| US (1) | US5923553A (zh) |
| JP (1) | JPH09180976A (zh) |
| KR (1) | KR100200480B1 (zh) |
| TW (1) | TW314646B (zh) |
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- 1995-12-21 KR KR1019950053372A patent/KR100200480B1/ko not_active Expired - Fee Related
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- 1996-08-12 TW TW085109747A patent/TW314646B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| KR100200480B1 (ko) | 1999-10-01 |
| US5923553A (en) | 1999-07-13 |
| KR970053238A (ko) | 1997-07-31 |
| JPH09180976A (ja) | 1997-07-11 |
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