TW314646B - - Google Patents

Download PDF

Info

Publication number
TW314646B
TW314646B TW085109747A TW85109747A TW314646B TW 314646 B TW314646 B TW 314646B TW 085109747 A TW085109747 A TW 085109747A TW 85109747 A TW85109747 A TW 85109747A TW 314646 B TW314646 B TW 314646B
Authority
TW
Taiwan
Prior art keywords
instrument
yield
process conditions
database
batch
Prior art date
Application number
TW085109747A
Other languages
English (en)
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW314646B publication Critical patent/TW314646B/zh

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31426Real time database management for production control
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32209Stop production line
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32221Correlation between defect and measured parameters to find origin of defect
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Control By Computers (AREA)

Description

經濟部中央標準局負工消费合作社印装 314646 A7 _B7_ 五、發明説明(ί ) 技術領域: 本發明係有關控制半導體製程之方法,细言之係使用 失敗分析回授的方式控制半導體製程的方法。 發明背景: —般言之,半導體裝置是在相同製程條件下整批地製 造,然後訴諸個別晶片(die)的電性測試,壊的晶片和 好的晶片被査驗註記及電性分類K決定每批或每Η晶圓的 良率。在某批的半導體製程完成後,失敗分析即被執行Μ 找出會影響最後良率的各單元製程間之相互闞係。 參考圖1 ,所繪者為依前技所得之一失敗分析系統, 此失敗分析糸統包括一儀器資料庫12及一良率資料庫 2 2。在儀器資料庫中,所記錄者為運轉中之半導體儀器 Μ及此次運轉的製程條件像溫度、壓力、冥空度、所用氣 體種類與成份等等(第10站)。在良率資料庫22中, 所記錄者為每批的良率,此良率係經由對每一晶Μ作電性 测試而加註記並分類好晶片與壊晶片而得到(第2 0站) 0 當透過電性晶片分類EDS對每一批成品査驗良率Κ形 成良率資料庫2 2時,異常的晶圓或設備中,良率降低發 生者、瑕疵產生於某细部製程者、抑或因異常的設備狀況 而可預知問題者(24站),皆在搜尋之列(14站)。 另外,正常晶圓或設備被以儀器資料庫12為準作搜尋( 30站),異常儀器資料及正常儀器資料二者藉由分析其 -3- 本紙張尺度適用中國國家梂準(CNS ) A4说格(210X297公釐) 丨 ί I裝-------訂-----1 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局爲工消費合作社印«. A7 _B7_ 五、發明説明(z) 良率、設備及製程條件間的相互關係以彼此互相比較,該 分析係Μ統計學程序諸如重要性測驗(significance test )或視覺分析諸如圖像處理來執行(40站)。然後,導 致良率降低的單元製程儀器經由査驗儀器條件及製程條件 而被搜尋K估計出失敗處(50站)。 然而,在此傳统之失敗分析糸統中,分析失敗耗費頗 長之時間,另外,即使失敗快速地被分析出,該失敗分析 仍僅係Μ已完成之該次運轉情況為基礎所執行者。因此, 雖然該失敗分析已被完成,晶圓製程仍是繼續在異常的製 程條件下·因而無法防止失敗的發生或良率的降低。 發明概述: » 因此,本發明即是鑑於發生於前技中之上述問題而創 作者,同時本發明之一目的係提供一方法Κ控制半導體製 程,該方法使用失敗分析回授,將先前失敗分析的结果與 現在之製程條件即時地作比較並且在具有失敗狀況之製程 條件發生後立即停止相應之製程儀器的浬轉。 如本發明之一樣貌所顯,一方法被提供Κ藉由失敗分 析回授來控制半導體製程,該法包含下列步發!: a)藉由 得到當良率下降或儀器問題發生時每批的良率和半導體儀 器的製程條件之間的相互關係Μ建立具異常製程條件之監 控資料庫;b)藉由即時且連線地得到正在運轉中的半導 體儀器之特別製程條件來建立一儀器資料庫;c)比較即 時獲致的上述半導體儀器之上述特別製程條件Μ及上述監 -4- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) ---------J I裝------訂-----\線 (請先閲讀背面之注意事項再填寫本頁) 314646 A7 B7 五、發明説明()) 控資料庫之異常製程條件;Μ及d)當即時獲致之上述特 別製程條件與上述監控資料庫之上述異常製程條件間的相 似程度超過一預定水準時,停止相應製程中之上述半導體 儀器的運轉。 如本發明之另一樣貌所顯,建立一監控資料庫的步驟 包含下列步驟:e)揀選出良率異常下降或因儀器問題致 引起良率變化時每批之良率資料;f)連结儀器運轉經歷 與闞於上述儀器資料庫之對應儇器编號以分析揀選出之良 率資料的失敗原因;s)對每批成品藉由自上述儀器資料 庫謓取連结之儀器連轉經歷以编集製程條件的資料;以及 h)對應於上述儀器對每批成品以所編集之資料為基礎製 作一報告並顯示出良率的趨勢。 再如本發明之另一樣貌所顯,一方法被提供K藉由失’ 敗分析回授來控制半導體製程,此法包含下列步驟:a) 藉由得到當良率下降或儀器問題發生時每批的良率和半導 體儀器的製程條件之間的相互醑係Μ建立具異常製程條件 之監控資料庫;b)藉由即時且連鑛地得到正在運轉中的 半導體儀器之特別製程條件來建立一儀器資料庫;c)比 較即時獲致的上述半導體儀器之上述特別製程條件以及上 述監控資料庫之異常製程條件;Μ及d)當即時獲致之上 述特別製程條件與正常製程條件間的差異超過一預定水準 時,停止相應製程中之上述半導體儀器的運轉。 由本發明之特點可知,半導體製造線係被連線監控的 本紙張尺度逍用中國國家標準(CNS ) A4規格(210X 297公釐) I.-------f I裝------訂-----1 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央樣準局負工消費合作社印裂 經濟部中央橾率局員工消費合作社印製 A7 _B7_ 五、發明说明(〜) ,Μ卽時建立儀器運轉經歷作為資料庫。正在運轉中之儀 器的異常狀況可藉失敗分析較諸先前建立之監控資料庫而 偵測出。倘若異常的製程條件被偵測出,其將被認定會導 致良率之降低而儀器的運轉即被停止*因反制失敗的即時 反應是可能的。是故,製程問題及良率降低皆可被防止。 圖式簡略說明: 本發明之上述物件、其他的特色與優點在看過Κ下關 於圖式的詳细說明後將更為明顯: 圖1係描繪前技之失敗分析糸統的系統圖形;Κ及 圖2係描繪依本發明之一實施例,藉失敗分析回授控 制半導髖製程的方法之系統圖形。 較佳實施例說明: 在半導體製造中*具有相同圖案的多涸半等體小片, 亦即晶片(d i e ),被製造在同一晶圓上,於沿著包含各 種單元製程如光蝕刻印刷、離子植入、熱處理、蝕刻、沈 積、金靥處理等等的一自動化生產線移動時承受相同的製 程條件。每一單元製程有其包括相懕的儀器與製程條件如 溫度、壓力、真空度、使用氣體之種類與成份等等之一儀 器運轉經歷*對於數批晶片的每一批,儀器理轉經歴皆被 記錄下來,此儀器運轉經歷被一埋線之監控儀器1 0 0即 時地監控制,如圖2所示,對每批晶片所得到的儀器浬轉 經歷被記錄至儀器資料庫1 02。 由Μ上製程製作出的半導體裝置時接受査驗的程序( -6 - 本紙張尺度遑用中國國家標準(CNS ) Α4規格(210Χ297公釐) 丨;-------,-裝------訂-----線 (請先閱讀背面之注意事項再填寫本瓦) 經濟部中央標準局負工消费合作社印製 A7 _____B7 五、發明説明(< ) 200站),在査驗程序中,關於是否晶圓上的晶Μ是好 的或壞的之評斷被啟動,依査驗程序的结果,壊的晶片Κ 墨水標記*同時經由查驗程序所得一批晶片的良率資料被 記錄於良率資料庫2 0 2中,一批異常晶片的良率資料被 揀選出來歸類在異常良率降低或由於儀器問題及類似狀況 導致良率變動下(204站)。為分析失敗的原因,該批 晶片的編號被連结至儀器資料庫10 2中的相應批號( 3 0 0 站)° 然後,該批晶片的製程條件方面的資料藉由自儀器資 料庫102讀取被連结儀器的浬轉經歷而被编集(302 站),而一份報告則由編集的資料印出(304站)同時 對應該批晶片之儀器的良率趨勢亦被顯示出來(3 0 6站 )。 異常的EDS良率降低或由於儀器問題所致的良率異常 變動藉由統計分析程序如回授分析、重要性测驗( significance test )及類似方法並參考報告内容而加Μ 分析(400站),依據分析過的異常儀器與良率的相互 關係所得的儀器製程條件則被記錄至監控資料庫4 0 2。 現在運轉中之儀器的製程條件被連線監控儀器100 即時地與監控之製程條件作比較而參考監控資料庫4 0 2 。倘若比較结果在預定的水準内,儀器繼續運轉,反之, 若比較结果超過預定水準,儀器的運轉則被停止(6 0 0 站)。 本紙張尺度遑用中國國家標準(CNS ) Α4規格(210X297公釐) --------f ·裝------訂-----η線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局負工消费合作社印製 A7 _B7__五、發明説明() 如上所述,依據本發明,半導體製造媒係被連媒監控 的,以即時建立儀器蓮轉經歷作為資料庫。正在運轉中之 儀器的異常狀況可藉失敗分析較諸先前建立之監控資料庫 而偵測出。倘若異常的製程條件被偵測出,其將被認定會 導致良率之降低而儀器的運轉便被停止,因而反制失則的 即時反應是可能的。是故,依本發明所言,製程問題及良 率降低皆可被防止。 雖然本發明已以其較佳實施例為參考而被描述及圖示 說明,本發明之不限於該實施例,及不同的變化與修改乃 可行而不會背離本發明所附申請專利範園所定義之精神與 涵蓋範团的事s懕是可立即理解的。 (請先閲讀背面之注意事項再填寫本頁) .裝. 訂 -8 - 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)

Claims (1)

14646 A8 B8 C8 D8 經濟部中央標準局貝工消費合作社印製 六、申請專利範圍 1·一種藉由失敗分析回授來控制一半導體製程之方 法,該方法包括下列步驟: a )藉由獲致當良率降低或儀器問題發生時每一批晶 片之良率與半導體儀器之製程條件的相互關係來建立具有 異常製程條件資料的監控資料庫; b) 藉由即時而連線地獲致運轉中之半導體儀器的特 定製程條件來建立一儀器資料庫; c) 比較即時獲致之上述半導體儀器的上述特定製程 條件和上述監控資料庫的異常製程條件;K及 d) 當即時獲致之上述特定製程條件與上述監控資料 庫之上述異常製程條件間的相似度超過一預定水準時,停 止在相應製程中之上述半導體儀器的運轉。 2·如申請專利範圍第1項所述藉由失敗分析回授以 控制一半導體製程之方法,其中上述建立一監控資料庫之 階段包含以下步驟: a )對每一批晶片分類良率資料*揀選出良率異常降 低者或因儀器問題致良率變動者; b) 連结儀器運轉經歷K及相應之儀器編號,並參考 上述儀器資料庫K分析揀選出之良率資料的失敗原因; c) 對每批晶片藉由自上述儀器資料庫謓取連結之儀 器運轉經歷來編集製程條件之資料;以及 d) 基於所編集之資料製作一報告,並且顯示出每批 晶片相應於上述儀器之良率趨勢。 -1 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ^ 裝 訂 線 (請先閱讀背面之注意事項再填寫本頁) 申請專利範圍 A8 B8 C8 D8 方晶有 特 程 件半 之批具 的 製 條述 程一立 器 定 程上 製每建 儀 特 製之 體時來 體 述 常中 導生係 導 上及正程 半 發關 半 的 Μ 與製 一 題互 之 器.,件應 制 問相 中 儀件條相 控 器的 轉 體條程在 來 儀件.,運.,導程製止 授 或條庫致庫半製定停 回 低程料獲料述常特, 析:降製資地資上異述時 分驟率之控線器之的上準 敗 '步良器監連儀致庫之水 失列當儀的而一獲料致定 由下致體料時立時資獲預 。 藉括獲導資即建即控時一轉 種包由半件由來較監即過運 一 法藉與條藉件比述當超的 . 方} 率程} 條} 上} 異器 3 該 a 良製 b 程 C 和 d 差儀 , 之常 製 件 的體 法 片異 定 條 間導 -----------^------tr------.ii (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
TW085109747A 1995-12-21 1996-08-12 TW314646B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950053372A KR100200480B1 (ko) 1995-12-21 1995-12-21 불량 분석 피드백에 의한 반도체 제조공정 제어방법

Publications (1)

Publication Number Publication Date
TW314646B true TW314646B (zh) 1997-09-01

Family

ID=19442322

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085109747A TW314646B (zh) 1995-12-21 1996-08-12

Country Status (4)

Country Link
US (1) US5923553A (zh)
JP (1) JPH09180976A (zh)
KR (1) KR100200480B1 (zh)
TW (1) TW314646B (zh)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6594598B1 (en) * 1997-10-08 2003-07-15 Matsushita Electronics Corporation Method for controlling production line
KR100272256B1 (ko) * 1997-10-31 2001-03-02 윤종용 반도체장비와호스트컴퓨터의동시제어방법
US6154714A (en) * 1997-11-17 2000-11-28 Heuristic Physics Laboratories Method for using wafer navigation to reduce testing times of integrated circuit wafers
KR100278600B1 (ko) * 1998-01-14 2001-01-15 윤종용 반도체 제조설비 관리시스템의 설비유닛의 상태 관리방법
KR100319208B1 (ko) * 1998-01-14 2002-03-21 윤종용 반도체제조설비관리시스템의설비사전예방유지의주기관리방법
KR100269941B1 (ko) * 1998-01-14 2001-01-15 윤종용 반도체 제조설비 관리시스템에서 설비의 비상상태관리방법
KR100269942B1 (ko) * 1998-02-03 2000-10-16 윤종용 반도체제조설비관리방법
JP3739201B2 (ja) * 1998-03-06 2006-01-25 富士通株式会社 半導体チップの相関解析方法及び装置、半導体チップ歩留まり調整方法並びに記憶媒体
US6261470B1 (en) 1998-04-23 2001-07-17 Sandia Corporation Method and apparatus for monitoring plasma processing operations
US6123983A (en) * 1998-04-23 2000-09-26 Sandia Corporation Method and apparatus for monitoring plasma processing operations
US6405094B1 (en) * 1998-07-10 2002-06-11 Tokyo Electron Limited Apparatus and method of collecting substrates abnormally processed or processed previous to ordinary processing
US6240329B1 (en) * 1998-11-09 2001-05-29 Chin-Yang Sun Method and apparatus for a semiconductor wafer inspection system using a knowledge-based system
KR100303321B1 (ko) 1999-05-20 2001-09-26 박종섭 반도체 라인 자동화 시스템에서의 오류발생 로트 제어 장치 및그 방법
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6427093B1 (en) * 1999-10-07 2002-07-30 Advanced Micro Devices, Inc. Method and apparatus for optimal wafer-by-wafer processing
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
AU1942701A (en) * 1999-12-30 2001-07-16 General Electric Company Method and system for monitoring production data
US6405144B1 (en) * 2000-01-18 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for programmed latency for improving wafer-to-wafer uniformity
JP3555859B2 (ja) * 2000-03-27 2004-08-18 広島日本電気株式会社 半導体生産システム及び半導体装置の生産方法
US6434725B1 (en) * 2000-06-26 2002-08-13 Infineon Technologies Richmond, Lp Method and system for semiconductor testing using yield correlation between global and class parameters
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US6615101B1 (en) * 2000-10-17 2003-09-02 Promos Technologies, Inc. Method for identifying the best tool in a semiconductor manufacturing process
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
DE10060631C1 (de) * 2000-12-06 2002-07-11 Infineon Technologies Ag Verfahren zum automatischen Überwachen der Herstellung von integrierten Schaltkreisen abhängig von der Anzahl ausgeführter Bearbeitungszyklen
DE10108920A1 (de) * 2001-02-23 2002-09-12 Infineon Technologies Ag Verfahren zum Überwachen einer Fertigung unter Verwendung von justierten Werten sowie zugehörige Komponenten
US7127409B2 (en) * 2001-03-01 2006-10-24 General Electric Company Methods and systems for aviation nonconformance component management
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6950716B2 (en) 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
KR100439841B1 (ko) * 2001-10-05 2004-07-12 삼성전자주식회사 반도체 제조설비의 공정불량 방지방법
US6792386B2 (en) * 2001-12-28 2004-09-14 Texas Instruments Incorporated Method and system for statistical comparison of a plurality of testers
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US8321048B1 (en) * 2002-06-28 2012-11-27 Advanced Micro Devices, Inc. Associating data with workpieces and correlating the data with yield data
US7069103B1 (en) * 2002-06-28 2006-06-27 Advanced Micro Devices, Inc. Controlling cumulative wafer effects
US6778873B1 (en) * 2002-07-31 2004-08-17 Advanced Micro Devices, Inc. Identifying a cause of a fault based on a process controller output
KR20050026099A (ko) 2002-08-01 2005-03-14 어플라이드 머티어리얼즈 인코포레이티드 고급 처리 제어 시스템 내의 부정확한 계측 데이터의 취급방법, 시스템 및 매체
US7117057B1 (en) 2002-09-10 2006-10-03 Taiwan Semiconductor Manufacturing Co. Ltd. Yield patrolling system
WO2004046835A2 (en) 2002-11-15 2004-06-03 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20040215605A1 (en) * 2003-04-25 2004-10-28 Detroit Diesel Corporation System and method for managing a distributed equipment unit service reporting function over a network
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
JP3913715B2 (ja) 2003-06-18 2007-05-09 株式会社東芝 不良検出方法
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
TW200516686A (en) * 2003-11-10 2005-05-16 Renesas Tech Corp Manufacturing method for semiconductor integrated circuit device
US7035770B2 (en) * 2003-12-18 2006-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Fuzzy reasoning model for semiconductor process fault detection using wafer acceptance test data
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US7089514B2 (en) 2004-08-10 2006-08-08 International Business Machines Corporation Defect diagnosis for semiconductor integrated circuits
US8055370B1 (en) * 2006-06-23 2011-11-08 Novellus Systems, Inc. Apparatus and methods for monitoring health of semiconductor process systems
KR100773350B1 (ko) 2006-08-29 2007-11-05 삼성전자주식회사 설비의 이상패턴 규명을 위한 기준정보형성방법 및 이를이용한 반도체 제조설비의 모니터링 방법
JP4786505B2 (ja) * 2006-11-13 2011-10-05 株式会社東芝 不良検出方法
US8279072B2 (en) * 2008-03-17 2012-10-02 Mrl Industries Inc. System to monitor a consumable part and method to monitor performance life and predict maintenance thereof
WO2010092588A2 (en) * 2008-05-23 2010-08-19 Nitin Gupta Method and system for measuring and analyzing the production data directly from machine
JP2010087459A (ja) * 2008-09-08 2010-04-15 Toshiba Corp 故障原因特定装置および方法
US9058034B2 (en) 2012-08-09 2015-06-16 International Business Machines Corporation Integrated circuit product yield optimization using the results of performance path testing
USD814488S1 (en) 2014-10-10 2018-04-03 Lam Research Corporation Display screen with graphical user interface for supporting service maintenance and tracking activities in semiconductor tool
WO2016057551A1 (en) * 2014-10-10 2016-04-14 Lam Research Corporation Mobile connectivity and control of semiconductor manufacturing equipment
KR102521159B1 (ko) 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
JP6860406B2 (ja) * 2017-04-05 2021-04-14 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
KR102006357B1 (ko) * 2017-05-10 2019-10-08 주식회사 유비덤 품질개선을 위한 스마트 바스켓 시스템 및 방법
US11029673B2 (en) 2017-06-13 2021-06-08 Pdf Solutions, Inc. Generating robust machine learning predictions for semiconductor manufacturing processes
US11022642B2 (en) 2017-08-25 2021-06-01 Pdf Solutions, Inc. Semiconductor yield prediction
US10318700B2 (en) 2017-09-05 2019-06-11 International Business Machines Corporation Modifying a manufacturing process of integrated circuits based on large scale quality performance prediction and optimization
KR102489762B1 (ko) * 2017-12-29 2023-01-18 비컴솔루션 주식회사 패턴인식에 의한 공정 이상 감지 시스템 및 그 방법
US11775714B2 (en) 2018-03-09 2023-10-03 Pdf Solutions, Inc. Rational decision-making tool for semiconductor processes
US11029359B2 (en) 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
US10777470B2 (en) 2018-03-27 2020-09-15 Pdf Solutions, Inc. Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
US11669079B2 (en) * 2021-07-12 2023-06-06 Tokyo Electron Limited Tool health monitoring and classifications with virtual metrology and incoming wafer monitoring enhancements
KR102777239B1 (ko) * 2022-06-03 2025-03-05 한국핵융합에너지연구원 반도체 장비를 통합 관리하기 위한 지능형 시스템
CN119903430B (zh) * 2024-12-31 2025-12-12 民航成都物流技术有限公司 故障运维知识图谱结合故障树的复杂产线可靠性分析方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751647A (en) * 1971-09-22 1973-08-07 Ibm Semiconductor and integrated circuit device yield modeling
US4571685A (en) * 1982-06-23 1986-02-18 Nec Corporation Production system for manufacturing semiconductor devices
US5047947A (en) * 1990-07-25 1991-09-10 Grumman Aerospace Corporation Method of modeling the assembly of products to increase production yield
US5196997A (en) * 1991-01-22 1993-03-23 International Business Machines Corporation Method and apparatus for quality measure driven process control
US5479340A (en) * 1993-09-20 1995-12-26 Sematech, Inc. Real time control of plasma etch utilizing multivariate statistical analysis
US5526293A (en) * 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing

Also Published As

Publication number Publication date
KR100200480B1 (ko) 1999-10-01
US5923553A (en) 1999-07-13
KR970053238A (ko) 1997-07-31
JPH09180976A (ja) 1997-07-11

Similar Documents

Publication Publication Date Title
TW314646B (zh)
KR102521159B1 (ko) 반도체 제조 공정을 위한 개선된 공정 제어 기술
TW448483B (en) System and method capable of finding tools having defects in semiconductor plant
US7117057B1 (en) Yield patrolling system
JP3024760B2 (ja) 半導体ウエハ製作プロセスのリアルタイム・インシチュ監視方法およびシステム
US6766208B2 (en) Automatic production quality control method and system
JPWO1997035337A1 (ja) プロセス管理システム
JP2010226125A (ja) 半導体テストのための方法および装置
JPH0616475B2 (ja) 物品の製造システム及び物品の製造方法
TWI639203B (zh) 診斷半導體晶圓之方法以及系統
US6563300B1 (en) Method and apparatus for fault detection using multiple tool error signals
TW521365B (en) Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system
JP3099932B2 (ja) インテリジェントテストラインシステム
CN111653500A (zh) 判断晶圆良率损失的方法
US7100081B1 (en) Method and apparatus for fault classification based on residual vectors
JPH10274626A (ja) 画像処理装置
US6792386B2 (en) Method and system for statistical comparison of a plurality of testers
US6821792B1 (en) Method and apparatus for determining a sampling plan based on process and equipment state information
US6754593B1 (en) Method and apparatus for measuring defects
US6539272B1 (en) Electric device inspection method and electric device inspection system
US6697691B1 (en) Method and apparatus for fault model analysis in manufacturing tools
CN120221426A (zh) 一种加工检测方法、装置、设备及计算机存储介质
US20040241885A1 (en) Method, device, computer-readable storage medium and computer program element for the monitoring of a manufacturing process of a plurality of physical objects
US20050098779A1 (en) Production process for producing semiconductor devices, semiconductor devices produced thereby, and test system for carrying out yield-rate test in production of such semiconductor devices
US6697696B1 (en) Fault detection control system using dual bus architecture, and methods of using same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees