TW317072B - - Google Patents
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- Publication number
- TW317072B TW317072B TW86100034A TW86100034A TW317072B TW 317072 B TW317072 B TW 317072B TW 86100034 A TW86100034 A TW 86100034A TW 86100034 A TW86100034 A TW 86100034A TW 317072 B TW317072 B TW 317072B
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- copper
- uncontaminated
- component
- edge
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 98
- 229910052802 copper Inorganic materials 0.000 claims description 60
- 239000010949 copper Substances 0.000 claims description 60
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 53
- 229910052782 aluminium Inorganic materials 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 40
- 239000011889 copper foil Substances 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 30
- 239000011888 foil Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000005253 cladding Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 3
- 241000446313 Lamella Species 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 230000002079 cooperative effect Effects 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010413 gardening Methods 0.000 claims 1
- 238000009941 weaving Methods 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
- 238000002955 isolation Methods 0.000 description 11
- 238000003825 pressing Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 10
- 238000005498 polishing Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000010903 husk Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 102100029469 WD repeat and HMG-box DNA-binding protein 1 Human genes 0.000 description 1
- 101710097421 WD repeat and HMG-box DNA-binding protein 1 Proteins 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58382396A | 1996-01-09 | 1996-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW317072B true TW317072B (fr) | 1997-10-01 |
Family
ID=24334718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW86100034A TW317072B (fr) | 1996-01-09 | 1997-01-04 |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU1529097A (fr) |
| TW (1) | TW317072B (fr) |
| WO (1) | WO1997025841A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI710295B (zh) * | 2020-01-02 | 2020-11-11 | 峻立科技股份有限公司 | 塑膠元件與電路板的結合方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19831461C1 (de) * | 1998-07-14 | 2000-02-24 | Dieter Backhaus | Verfahren zur partiellen Verbindung von Kupferfolien und Trennblechen (CuAI-Verfahren) |
| DE19859613C2 (de) | 1998-12-23 | 2001-09-06 | Buerkle Gmbh Robert | Presspaketaufbau und Verfahren zu dessen Herstellung |
| ITMI20120194A1 (it) | 2012-02-13 | 2013-08-14 | Cedal Equipment Srl | Miglioramenti nella fabbricazione di pile di laminati plastici multistrato per circuiti stampati |
| JP6460285B1 (ja) * | 2017-06-02 | 2019-01-30 | 日立金属株式会社 | 板材および板材の製造方法 |
| CN115519850B (zh) * | 2022-09-20 | 2024-09-10 | 宁波甬强科技有限公司 | 覆铜板制造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4875283A (en) * | 1986-11-13 | 1989-10-24 | Johnston James A | Method for manufacturing printed circuit boards |
| US5153050A (en) * | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
| AU2442092A (en) * | 1992-05-05 | 1993-11-29 | Cedal S.R.L. | Process for producing plastic laminates with metal laminae, especially for printed circuits |
-
1997
- 1997-01-04 TW TW86100034A patent/TW317072B/zh active
- 1997-01-06 AU AU15290/97A patent/AU1529097A/en not_active Abandoned
- 1997-01-06 WO PCT/US1997/000216 patent/WO1997025841A1/fr not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI710295B (zh) * | 2020-01-02 | 2020-11-11 | 峻立科技股份有限公司 | 塑膠元件與電路板的結合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU1529097A (en) | 1997-08-01 |
| WO1997025841A1 (fr) | 1997-07-17 |
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