TW332321B - Diluted nitrogen trifluoride thermal cleaning process - Google Patents

Diluted nitrogen trifluoride thermal cleaning process

Info

Publication number
TW332321B
TW332321B TW085100659A TW85100659A TW332321B TW 332321 B TW332321 B TW 332321B TW 085100659 A TW085100659 A TW 085100659A TW 85100659 A TW85100659 A TW 85100659A TW 332321 B TW332321 B TW 332321B
Authority
TW
Taiwan
Prior art keywords
nitrogen trifluoride
cleaning process
surface zone
thermal cleaning
diluted nitrogen
Prior art date
Application number
TW085100659A
Other languages
English (en)
Chinese (zh)
Inventor
Anthony Schneider Charles
James Gibson R
Martin Engle George
Alan Huling Bruce
Original Assignee
Air Prod & Chem
Aspect Systems Inc
Gec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem, Aspect Systems Inc, Gec Inc filed Critical Air Prod & Chem
Application granted granted Critical
Publication of TW332321B publication Critical patent/TW332321B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/12—Cleaning before device manufacture, i.e. Begin-Of-Line process by dry cleaning only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Chemical Vapour Deposition (AREA)
TW085100659A 1995-02-17 1996-02-15 Diluted nitrogen trifluoride thermal cleaning process TW332321B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/390,716 US5714011A (en) 1995-02-17 1995-02-17 Diluted nitrogen trifluoride thermal cleaning process

Publications (1)

Publication Number Publication Date
TW332321B true TW332321B (en) 1998-05-21

Family

ID=23543624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085100659A TW332321B (en) 1995-02-17 1996-02-15 Diluted nitrogen trifluoride thermal cleaning process

Country Status (5)

Country Link
US (1) US5714011A (fr)
EP (1) EP0731497A3 (fr)
JP (1) JPH08255778A (fr)
KR (1) KR960030980A (fr)
TW (1) TW332321B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817575A (en) * 1996-01-30 1998-10-06 Advanced Micro Devices, Inc. Prevention of clogging in CVD apparatus
US5861065A (en) * 1997-01-21 1999-01-19 Air Products And Chemicals, Inc. Nitrogen trifluoride-oxygen thermal cleaning process
US5868852A (en) * 1997-02-18 1999-02-09 Air Products And Chemicals, Inc. Partial clean fluorine thermal cleaning process
WO1999006611A1 (fr) * 1997-08-01 1999-02-11 Applied Komatsu Technology, Inc. Procede et dispositif servant a nettoyer une chambre
WO1999064780A1 (fr) * 1998-06-08 1999-12-16 Advanced Delivery & Chemical Systems, Ltd. Systeme d'apport chimique avec dispositif d'evacuation utilisant diverses techniques de purge
JP4730572B2 (ja) * 2000-08-21 2011-07-20 株式会社アルバック プラズマ成膜装置及びそのクリーニング方法
US6585830B2 (en) * 2000-11-30 2003-07-01 Agere Systems Inc. Method for cleaning tungsten from deposition wall chambers
US20030216041A1 (en) * 2002-05-08 2003-11-20 Herring Robert B. In-situ thermal chamber cleaning
US6818566B2 (en) 2002-10-18 2004-11-16 The Boc Group, Inc. Thermal activation of fluorine for use in a semiconductor chamber
US6897162B2 (en) * 2003-10-20 2005-05-24 Wafermasters, Inc. Integrated ashing and implant annealing method
US20050252529A1 (en) * 2004-05-12 2005-11-17 Ridgeway Robert G Low temperature CVD chamber cleaning using dilute NF3
US20080142046A1 (en) * 2006-12-13 2008-06-19 Andrew David Johnson Thermal F2 etch process for cleaning CVD chambers
US20090041925A1 (en) * 2007-06-13 2009-02-12 Advanced Refurbishment Technologies Llc System and Method for Endpoint Detection of a Process in a Chamber
JP6196925B2 (ja) * 2014-03-26 2017-09-13 東京エレクトロン株式会社 薄膜形成装置の立ち上げ方法、及び、薄膜形成装置
JP6371738B2 (ja) * 2015-05-28 2018-08-08 株式会社東芝 成膜装置
US20220331846A1 (en) * 2021-04-16 2022-10-20 BWXT Isotope Technology Group, Inc. Clean-in-place and product recovery method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488506A (en) * 1981-06-18 1984-12-18 Itt Industries, Inc. Metallization plant
JPS60198394A (ja) * 1984-03-21 1985-10-07 Anelva Corp 真空処理装置の排気装置
GB2183204A (en) * 1985-11-22 1987-06-03 Advanced Semiconductor Mat Nitrogen trifluoride as an in-situ cleaning agent
FR2616884B1 (fr) * 1987-06-19 1991-05-10 Air Liquide Procede de traitement d'effluents gazeux provenant de la fabrication de composants electroniques et appareil d'incineration pour sa mise en oeuvre
JPH01306580A (ja) * 1988-06-01 1989-12-11 Mitsubishi Electric Corp エツチング装置
JP3004696B2 (ja) * 1989-08-25 2000-01-31 アプライド マテリアルズ インコーポレーテッド 化学的蒸着装置の洗浄方法
JP3140068B2 (ja) * 1991-01-31 2001-03-05 東京エレクトロン株式会社 クリーニング方法
JP2618817B2 (ja) * 1993-07-09 1997-06-11 岩谷産業株式会社 半導体製造装置でのノンプラズマクリーニング方法
TW241375B (fr) * 1993-07-26 1995-02-21 Air Prod & Chem
US5421957A (en) * 1993-07-30 1995-06-06 Applied Materials, Inc. Low temperature etching in cold-wall CVD systems

Also Published As

Publication number Publication date
EP0731497A2 (fr) 1996-09-11
US5714011A (en) 1998-02-03
JPH08255778A (ja) 1996-10-01
KR960030980A (ko) 1996-09-17
EP0731497A3 (fr) 1996-12-27

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