TW344106B - Method for forming bumps - Google Patents

Method for forming bumps

Info

Publication number
TW344106B
TW344106B TW086100090A TW86100090A TW344106B TW 344106 B TW344106 B TW 344106B TW 086100090 A TW086100090 A TW 086100090A TW 86100090 A TW86100090 A TW 86100090A TW 344106 B TW344106 B TW 344106B
Authority
TW
Taiwan
Prior art keywords
wire
ball
bonded
capillary
forming bumps
Prior art date
Application number
TW086100090A
Other languages
English (en)
Inventor
Nobuto Yamazaki
Motoharu Kato
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Application granted granted Critical
Publication of TW344106B publication Critical patent/TW344106B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Wire Bonding (AREA)
TW086100090A 1996-03-15 1997-01-07 Method for forming bumps TW344106B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8087609A JPH09252005A (ja) 1996-03-15 1996-03-15 バンプ形成方法

Publications (1)

Publication Number Publication Date
TW344106B true TW344106B (en) 1998-11-01

Family

ID=13919718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100090A TW344106B (en) 1996-03-15 1997-01-07 Method for forming bumps

Country Status (4)

Country Link
US (1) US5981371A (zh)
JP (1) JPH09252005A (zh)
KR (1) KR100250870B1 (zh)
TW (1) TW344106B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3349886B2 (ja) * 1996-04-18 2002-11-25 松下電器産業株式会社 半導体素子の２段突起形状バンプの形成方法
US6098868A (en) * 1997-05-23 2000-08-08 Masushita Electric Industrial Co., Ltd. Bump forming method and bump bonder
DE19809081A1 (de) * 1998-03-04 1999-09-16 Bosch Gmbh Robert Verfahren und Kontaktstelle zur Herstellung einer elektrischen Verbindung
JP2000150560A (ja) 1998-11-13 2000-05-30 Seiko Epson Corp バンプ形成方法及びバンプ形成用ボンディングツール、半導体ウエーハ、半導体チップ及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
JP3455126B2 (ja) * 1999-03-02 2003-10-14 株式会社新川 ワイヤボンデイング方法
US6386433B1 (en) 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6227437B1 (en) 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
JP2002064118A (ja) * 2000-08-22 2002-02-28 Shinkawa Ltd ワイヤボンディング装置
JP4679427B2 (ja) * 2006-04-24 2011-04-27 株式会社新川 ボンディング装置のテールワイヤ切断方法及びプログラム
JP4467631B1 (ja) * 2009-01-07 2010-05-26 株式会社新川 ワイヤボンディング方法
JP5567657B2 (ja) * 2009-04-01 2014-08-06 クリック アンド ソッファ インダストリーズ、インク． 導電性バンプまたはワイヤループを形成する方法
US8459530B2 (en) * 2009-10-29 2013-06-11 Asm Technology Singapore Pte Ltd Automatic wire feeding method for wire bonders
KR101312148B1 (ko) * 2012-01-04 2013-09-26 앰코 테크놀로지 코리아 주식회사 와이어 본더의 캐필러리 클리닝 방법
RU2510545C1 (ru) * 2012-10-01 2014-03-27 Федеральное государственное унитарное предприятие "Ростовский-на-Дону научно-исследовательский институт радиосвязи" (ФГУП "РНИИРС") Способ вибрационной пайки кристаллов бескорпусных транзисторов
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
KR102854921B1 (ko) * 2020-12-18 2025-09-03 가부시키가이샤 신가와 와이어 본딩 장치, 와이어 절단 방법 및 프로그램

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542662A (en) * 1977-06-08 1979-01-10 Seiko Epson Corp Semiconductor device
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JPH0212919A (ja) * 1988-06-30 1990-01-17 Nec Kansai Ltd バンプ電極の形成方法
US5176310A (en) * 1988-11-28 1993-01-05 Hitachi, Ltd. Method and apparatus for wire bond
JPH03208354A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH0441519A (ja) * 1990-06-07 1992-02-12 Daicel Chem Ind Ltd 単量体を含む反応性組成物およびその製造方法
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5559054A (en) * 1994-12-23 1996-09-24 Motorola, Inc. Method for ball bumping a semiconductor device
US5686353A (en) * 1994-12-26 1997-11-11 Matsushita Electric Industrial Co., Ltd. Semiconductor device and manufacturing method thereof
KR100186752B1 (ko) * 1995-09-04 1999-04-15 황인길 반도체 칩 본딩방법
US5687901A (en) * 1995-11-14 1997-11-18 Nippon Steel Corporation Process and apparatus for forming ball bumps
JP3074517B2 (ja) * 1995-12-05 2000-08-07 株式会社新川 被覆ワイヤのワイヤボンディング方法
US5894983A (en) * 1997-01-09 1999-04-20 Harris Corporation High frequency, low temperature thermosonic ribbon bonding process for system-level applications

Also Published As

Publication number Publication date
KR100250870B1 (ko) 2000-04-01
KR19980053197A (ko) 1998-09-25
US5981371A (en) 1999-11-09
JPH09252005A (ja) 1997-09-22

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