TW350077B - Chip-shaped electronic parts and the manufacturing method - Google Patents

Chip-shaped electronic parts and the manufacturing method

Info

Publication number
TW350077B
TW350077B TW086104867A TW86104867A TW350077B TW 350077 B TW350077 B TW 350077B TW 086104867 A TW086104867 A TW 086104867A TW 86104867 A TW86104867 A TW 86104867A TW 350077 B TW350077 B TW 350077B
Authority
TW
Taiwan
Prior art keywords
electronic parts
chip
manufacturing
shaped electronic
layer
Prior art date
Application number
TW086104867A
Other languages
Chinese (zh)
Inventor
Takuo Ito
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of TW350077B publication Critical patent/TW350077B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Details Of Resistors (AREA)
  • Ceramic Capacitors (AREA)

Abstract

A sort of chip-shaped electronic parts, having the electronic parts layer formed on the substrate surface, formed said electronic parts layer on the electrode layers on both sides of the substrate and in electrical connection with the surface of the electrode layer.
TW086104867A 1996-05-14 1997-04-15 Chip-shaped electronic parts and the manufacturing method TW350077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11938296A JP3307533B2 (en) 1996-05-14 1996-05-14 Chip electronic component and its manufacturing method, and surge absorber and its manufacturing method

Publications (1)

Publication Number Publication Date
TW350077B true TW350077B (en) 1999-01-11

Family

ID=14760134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104867A TW350077B (en) 1996-05-14 1997-04-15 Chip-shaped electronic parts and the manufacturing method

Country Status (4)

Country Link
JP (1) JP3307533B2 (en)
KR (1) KR100292444B1 (en)
CN (1) CN1129144C (en)
TW (1) TW350077B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344776A (en) * 2005-06-09 2006-12-21 Alpha Electronics Corp Chip resistor and its manufacturing process
JP2007294929A (en) * 2006-03-28 2007-11-08 Mitsui Mining & Smelting Co Ltd Thin film sensor manufacturing method, thin film sensor, and thin film sensor module
JP2014072242A (en) 2012-09-27 2014-04-21 Rohm Co Ltd Chip component and process of manufacturing the same
DE102013012842A1 (en) * 2013-08-02 2015-02-05 Epcos Ag Process for the production of a large number of arresters in the compound, arrester and arrester composite
JP6584574B2 (en) * 2018-04-10 2019-10-02 ローム株式会社 Chip component and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258738A (en) * 1991-04-16 1993-11-02 U.S. Philips Corporation SMD-resistor
JP2935143B2 (en) * 1991-06-21 1999-08-16 ローム株式会社 Square chip resistor and method of manufacturing the same
JPH07183108A (en) * 1993-12-24 1995-07-21 Rohm Co Ltd Manufacture of chip resistor
JPH07201527A (en) * 1994-01-11 1995-08-04 Mitsubishi Materials Corp Method for manufacturing conductive chip type ceramic element
JPH0897018A (en) * 1994-09-21 1996-04-12 Rohm Co Ltd Manufacture of chip resistor

Also Published As

Publication number Publication date
KR970077718A (en) 1997-12-12
CN1129144C (en) 2003-11-26
JPH09306712A (en) 1997-11-28
KR100292444B1 (en) 2001-09-17
JP3307533B2 (en) 2002-07-24
CN1166036A (en) 1997-11-26

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