TW350077B - Chip-shaped electronic parts and the manufacturing method - Google Patents

Chip-shaped electronic parts and the manufacturing method

Info

Publication number
TW350077B
TW350077B TW086104867A TW86104867A TW350077B TW 350077 B TW350077 B TW 350077B TW 086104867 A TW086104867 A TW 086104867A TW 86104867 A TW86104867 A TW 86104867A TW 350077 B TW350077 B TW 350077B
Authority
TW
Taiwan
Prior art keywords
electronic parts
chip
manufacturing
shaped electronic
layer
Prior art date
Application number
TW086104867A
Other languages
English (en)
Inventor
Takuo Ito
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of TW350077B publication Critical patent/TW350077B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Details Of Resistors (AREA)
  • Ceramic Capacitors (AREA)
TW086104867A 1996-05-14 1997-04-15 Chip-shaped electronic parts and the manufacturing method TW350077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11938296A JP3307533B2 (ja) 1996-05-14 1996-05-14 チップ電子部品とその製造方法、およびサージアブソーバとその製造方法

Publications (1)

Publication Number Publication Date
TW350077B true TW350077B (en) 1999-01-11

Family

ID=14760134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104867A TW350077B (en) 1996-05-14 1997-04-15 Chip-shaped electronic parts and the manufacturing method

Country Status (4)

Country Link
JP (1) JP3307533B2 (zh)
KR (1) KR100292444B1 (zh)
CN (1) CN1129144C (zh)
TW (1) TW350077B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344776A (ja) * 2005-06-09 2006-12-21 Alpha Electronics Corp チップ抵抗器とその製造方法
JP2007294929A (ja) * 2006-03-28 2007-11-08 Mitsui Mining & Smelting Co Ltd 薄膜センサの製造方法、薄膜センサおよび薄膜センサモジュール
JP2014072242A (ja) 2012-09-27 2014-04-21 Rohm Co Ltd チップ部品およびその製造方法
DE102013012842A1 (de) * 2013-08-02 2015-02-05 Epcos Ag Verfahren zur Herstellung einer Vielzahl von Ableitern im Verbund, Ableiter und Ableiterverbund
JP6584574B2 (ja) * 2018-04-10 2019-10-02 ローム株式会社 チップ部品およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258738A (en) * 1991-04-16 1993-11-02 U.S. Philips Corporation SMD-resistor
JP2935143B2 (ja) * 1991-06-21 1999-08-16 ローム株式会社 角形チップ抵抗器及びその製造方法
JPH07183108A (ja) * 1993-12-24 1995-07-21 Rohm Co Ltd チップ抵抗器の製造方法
JPH07201527A (ja) * 1994-01-11 1995-08-04 Mitsubishi Materials Corp 導電性チップ型セラミック素子の製造方法
JPH0897018A (ja) * 1994-09-21 1996-04-12 Rohm Co Ltd チップ型抵抗器の製造方法

Also Published As

Publication number Publication date
KR970077718A (ko) 1997-12-12
CN1129144C (zh) 2003-11-26
JPH09306712A (ja) 1997-11-28
KR100292444B1 (ko) 2001-09-17
JP3307533B2 (ja) 2002-07-24
CN1166036A (zh) 1997-11-26

Similar Documents

Publication Publication Date Title
TW339473B (en) Electronic package with multilevel connections
TW342572B (en) Electroluminescent lamp designs
TW338185B (en) Multi-electronic device package
TW358992B (en) Semiconductor device and method of fabricating the same
TW337030B (en) Multi-stage buried wiring structure and the manufacturing method for Ics
TW243584B (en) Apparatus having inner layers supporting surface-mount components and a method of manufacturing the same
EP0952762A4 (en) PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
EP0813246A3 (en) Semiconductor device comprising two semiconductor substrates
EP1250033A3 (en) Printed circuit board and electronic component
MXPA06000842A (es) Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion.
GB2280783B (en) Method for forming deep conductive feedthroughs and an interconnect layer that includes feedthroughs formed in accordance with the method
EP0615256A3 (en) Manufacturing process of a pattern of an electrically conductive polymer on a substrate surface and metallization process of such a pattern.
TW340243B (en) Manufacturing method of semiconductor elements
TW350072B (en) Chip network resistor and the manufacturing method
EP0398721A3 (en) Thin copper foil for printed wiring board and method of manufacturing same
WO2002093663A3 (en) Luminescent display device and method of manufacturing same
AU2854099A (en) Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device
EP0943430A3 (en) Plastic mask for paste printing and paste printing method
HK1004032A1 (zh) 金属基板和采用该基板的电子设备
MY122218A (en) Multilayer electronic component and manufacturing method therefor
TW344799B (en) Magnetic sensor utilizing impedance variation of a soft magnetic element in dependence upon a magnetic field strength and a method of manufacturing the same
AU2001273849A1 (en) Elastic contact element
EP0362161A3 (en) Method of manufacturing a substrate for microwave integrated circuits
EP0989615A3 (en) Semiconductor device with capacitor and manufacturing method thereof
MY124033A (en) Multi layer ceramic electronic parts having pillar-likeceramic portions