TW418263B - Process and apparatus for electrolytic deposition of metal layers - Google Patents

Process and apparatus for electrolytic deposition of metal layers Download PDF

Info

Publication number: TW418263B
Authority: TW; Taiwan
Prior art keywords: anode; metal; plating; plating solution; cathode
Prior art date: 1993-12-24

Application number

TW084106215A

Other languages

English (en)

Chinese (zh)

Inventor

Rolf Dr Schumacher

Original Assignee

Atotech Deutschland Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-12-24

Filing date

1995-06-16

Publication date

2001-01-11

1995-06-16 Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh

2001-01-11 Application granted granted Critical

2001-01-11 Publication of TW418263B publication Critical patent/TW418263B/zh

Links

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238000000034 method Methods 0.000 title claims abstract description 62
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238000007747 plating Methods 0.000 claims abstract description 201
229910021645 metal ion Inorganic materials 0.000 claims abstract description 118
150000001875 compounds Chemical class 0.000 claims abstract description 96
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 75
229910052802 copper Inorganic materials 0.000 claims abstract description 74
239000010949 copper Substances 0.000 claims abstract description 74
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Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

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Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Automation & Control Theory (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating Methods And Accessories (AREA)
Electrolytic Production Of Metals (AREA)
Electroplating And Plating Baths Therefor (AREA)
Physical Vapour Deposition (AREA)

TW084106215A 1993-12-24 1995-06-16 Process and apparatus for electrolytic deposition of metal layers TW418263B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE4344387A DE4344387C2 (de)	1993-12-24	1993-12-24	Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens

Publications (1)

Publication Number	Publication Date
TW418263B true TW418263B (en)	2001-01-11

Family

ID=6506149

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW084106215A TW418263B (en)	1993-12-24	1995-06-16	Process and apparatus for electrolytic deposition of metal layers

Country Status (10)

Country	Link
US (1)	US5976341A (de)
EP (1)	EP0690934B1 (de)
JP (1)	JP3436936B2 (de)
AT (1)	ATE167532T1 (de)
CA (1)	CA2156407C (de)
DE (2)	DE4344387C2 (de)
ES (1)	ES2118549T3 (de)
SG (1)	SG52609A1 (de)
TW (1)	TW418263B (de)
WO (1)	WO1995018251A1 (de)

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1993
- 1993-12-24 DE DE4344387A patent/DE4344387C2/de not_active Expired - Fee Related
1994
- 1994-12-23 AT AT95904386T patent/ATE167532T1/de active
- 1994-12-23 ES ES95904386T patent/ES2118549T3/es not_active Expired - Lifetime
- 1994-12-23 SG SG1996006707A patent/SG52609A1/en unknown
- 1994-12-23 WO PCT/DE1994/001542 patent/WO1995018251A1/de not_active Ceased
- 1994-12-23 DE DE59406281T patent/DE59406281D1/de not_active Expired - Lifetime
- 1994-12-23 JP JP51772495A patent/JP3436936B2/ja not_active Expired - Lifetime
- 1994-12-23 EP EP95904386A patent/EP0690934B1/de not_active Expired - Lifetime
- 1994-12-23 CA CA002156407A patent/CA2156407C/en not_active Expired - Fee Related
- 1994-12-23 US US08/507,499 patent/US5976341A/en not_active Expired - Lifetime
1995
- 1995-06-16 TW TW084106215A patent/TW418263B/zh not_active IP Right Cessation

Cited By (2)

* Cited by examiner, † Cited by third party
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CN106591932A (zh) *	2016-12-30	2017-04-26	宁波工程学院	用于深孔电镀的电镀制具及电镀方法
CN106591932B (zh) *	2016-12-30	2023-09-29	宁波工程学院	用于深孔电镀的电镀制具及电镀方法

Also Published As

Publication number	Publication date
JP3436936B2 (ja)	2003-08-18
EP0690934B1 (de)	1998-06-17
ES2118549T3 (es)	1998-09-16
DE59406281D1 (de)	1998-07-23
DE4344387A1 (de)	1995-06-29
CA2156407C (en)	2003-09-02
ATE167532T1 (de)	1998-07-15
DE4344387C2 (de)	1996-09-05
US5976341A (en)	1999-11-02
SG52609A1 (en)	1998-09-28
WO1995018251A1 (de)	1995-07-06
JPH08507106A (ja)	1996-07-30
CA2156407A1 (en)	1995-07-06
EP0690934A1 (de)	1996-01-10

Legal Events

Date	Code	Title	Description
2001-05-08	GD4A	Issue of patent certificate for granted invention patent
2015-08-01	MK4A	Expiration of patent term of an invention patent

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