TW432463B - A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus - Google Patents

A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus Download PDF

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Publication number
TW432463B
TW432463B TW087103564A TW87103564A TW432463B TW 432463 B TW432463 B TW 432463B TW 087103564 A TW087103564 A TW 087103564A TW 87103564 A TW87103564 A TW 87103564A TW 432463 B TW432463 B TW 432463B
Authority
TW
Taiwan
Prior art keywords
cassette
loading
entrance
patent application
scope
Prior art date
Application number
TW087103564A
Other languages
English (en)
Chinese (zh)
Inventor
Yoji Iizuka
Teruo Asakawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW432463B publication Critical patent/TW432463B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
TW087103564A 1997-03-13 1998-03-11 A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus TW432463B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9078914A JPH10256346A (ja) 1997-03-13 1997-03-13 カセット搬出入機構及び半導体製造装置

Publications (1)

Publication Number Publication Date
TW432463B true TW432463B (en) 2001-05-01

Family

ID=13675123

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087103564A TW432463B (en) 1997-03-13 1998-03-11 A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus

Country Status (3)

Country Link
JP (1) JPH10256346A (ja)
KR (1) KR19980080191A (ja)
TW (1) TW432463B (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100646906B1 (ko) 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
JP4260298B2 (ja) * 1999-07-27 2009-04-30 株式会社ルネサステクノロジ 半導体部品の製造方法
JP4505924B2 (ja) * 2000-02-07 2010-07-21 株式会社安川電機 半導体製造装置
US6506009B1 (en) * 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
US6641350B2 (en) 2000-04-17 2003-11-04 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
US6364593B1 (en) * 2000-06-06 2002-04-02 Brooks Automation Material transport system
KR100788068B1 (ko) * 2000-08-23 2007-12-21 동경 엘렉트론 주식회사 피처리체의 처리시스템
JP4838293B2 (ja) * 2000-09-27 2011-12-14 株式会社日立国際電気 基板処理方法、半導体装置の製造方法および基板処理装置
JP2002246432A (ja) * 2001-02-13 2002-08-30 Hitachi Kokusai Electric Inc 基板処理装置
US7243003B2 (en) 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
KR101058597B1 (ko) * 2002-08-31 2011-08-22 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 툴에 기판을 공급하는 방법 및 장치
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7506746B2 (en) 2002-08-31 2009-03-24 Applied Materials, Inc. System for transporting substrate carriers
US7077264B2 (en) 2003-01-27 2006-07-18 Applied Material, Inc. Methods and apparatus for transporting substrate carriers
US7611318B2 (en) 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7578647B2 (en) 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
US7556334B2 (en) 2004-11-04 2009-07-07 Applied Materials, Inc. Methods and apparatus for aligning print heads
KR100699154B1 (ko) * 2005-11-08 2007-03-21 동부일렉트로닉스 주식회사 스탠더드 메케니컬 인터페이스 장치
US8814488B2 (en) 2007-04-02 2014-08-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
JP6014982B2 (ja) * 2011-09-28 2016-10-26 シンフォニアテクノロジー株式会社 サイド用ロードポート、ｅｆｅｍ

Also Published As

Publication number Publication date
KR19980080191A (ko) 1998-11-25
JPH10256346A (ja) 1998-09-25

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MM4A Annulment or lapse of patent due to non-payment of fees