TW459010B - Cross-linker for photoresist, and photoresist composition comprising the same - Google Patents
Cross-linker for photoresist, and photoresist composition comprising the same Download PDFInfo
- Publication number
- TW459010B TW459010B TW088120825A TW88120825A TW459010B TW 459010 B TW459010 B TW 459010B TW 088120825 A TW088120825 A TW 088120825A TW 88120825 A TW88120825 A TW 88120825A TW 459010 B TW459010 B TW 459010B
- Authority
- TW
- Taiwan
- Prior art keywords
- branched
- photoresist
- chemical formula
- linear
- hydroxyl group
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- 239000004971 Cross linker Substances 0.000 title claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 60
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 32
- 150000001875 compounds Chemical class 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 19
- 150000002148 esters Chemical class 0.000 claims abstract description 13
- 150000002576 ketones Chemical class 0.000 claims abstract description 13
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 11
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 7
- 239000001257 hydrogen Substances 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920001577 copolymer Polymers 0.000 claims abstract description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 30
- -1 poly (3,3-dimethoxypropene butadiene anhydride Chemical class 0.000 claims description 15
- 239000000243 solution Substances 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 235000010290 biphenyl Nutrition 0.000 claims description 10
- 239000004305 biphenyl Substances 0.000 claims description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 10
- OBWGMYALGNDUNM-UHFFFAOYSA-N 3,3-dimethoxyprop-1-ene Chemical compound COC(OC)C=C OBWGMYALGNDUNM-UHFFFAOYSA-N 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- 150000001241 acetals Chemical class 0.000 claims description 8
- 230000002079 cooperative effect Effects 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- MCIPQLOKVXSHTD-UHFFFAOYSA-N 3,3-diethoxyprop-1-ene Chemical compound CCOC(C=C)OCC MCIPQLOKVXSHTD-UHFFFAOYSA-N 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 125000006267 biphenyl group Chemical group 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 4
- ZKAQPLNHUKYWLG-UHFFFAOYSA-N 1-methyl-2,3-diphenyl-4-(trifluoromethyl)benzene Chemical compound C1(=CC=CC=C1)C=1C(=C(C=CC1C(F)(F)F)C)C1=CC=CC=C1 ZKAQPLNHUKYWLG-UHFFFAOYSA-N 0.000 claims description 3
- VUBUXALTYMBEQO-UHFFFAOYSA-N 2,2,3,3,3-pentafluoro-1-phenylpropan-1-one Chemical compound FC(F)(F)C(F)(F)C(=O)C1=CC=CC=C1 VUBUXALTYMBEQO-UHFFFAOYSA-N 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 claims description 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 claims description 2
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 claims description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 150000003871 sulfonates Chemical class 0.000 claims 1
- 238000010884 ion-beam technique Methods 0.000 abstract description 2
- 238000000206 photolithography Methods 0.000 abstract description 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 abstract 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 238000004132 cross linking Methods 0.000 description 16
- 239000002253 acid Substances 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 12
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- CJAKOKNRERXHMN-UHFFFAOYSA-N 4-(2-hydroxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2CC(C(O)=O)C1(CCO)C=C2 CJAKOKNRERXHMN-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- PPWHTZKZQNXVAE-UHFFFAOYSA-N Tetracaine hydrochloride Chemical compound Cl.CCCCNC1=CC=C(C(=O)OCCN(C)C)C=C1 PPWHTZKZQNXVAE-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- UFZALZPARUNQMW-UHFFFAOYSA-N trifluoromethanesulfonate;triphenylphosphanium Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 UFZALZPARUNQMW-UHFFFAOYSA-N 0.000 description 2
- FFPNHPOZVCXHSE-UHFFFAOYSA-N (2-butylphenyl) trifluoromethanesulfonate Chemical compound CCCCC1=CC=CC=C1OS(=O)(=O)C(F)(F)F FFPNHPOZVCXHSE-UHFFFAOYSA-N 0.000 description 1
- YINGOXPFQFTXIX-UHFFFAOYSA-N 1,1-dimethoxy-2-methylpropane Chemical compound COC(OC)C(C)C YINGOXPFQFTXIX-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- XYJXZLHRRNRNHF-UHFFFAOYSA-N 3,3-diethoxy-2-methylprop-1-ene Chemical compound CCOC(C(C)=C)OCC XYJXZLHRRNRNHF-UHFFFAOYSA-N 0.000 description 1
- BLPXLJDOCJAVEE-UHFFFAOYSA-N C1(=CC=CC=C1)C=1C(=C(C=CC1CC(C)C)C(F)(F)F)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C=1C(=C(C=CC1CC(C)C)C(F)(F)F)C1=CC=CC=C1 BLPXLJDOCJAVEE-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- MRPIAQKOHAEADS-UHFFFAOYSA-N FC(S(=O)(=O)O)(F)F.C1(=CC=CC=C1)C(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound FC(S(=O)(=O)O)(F)F.C1(=CC=CC=C1)C(C1=CC=CC=C1)C1=CC=CC=C1 MRPIAQKOHAEADS-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/38—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an acetal or ketal radical
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/30—Compounds having groups
- C07C43/303—Compounds having groups having acetal carbon atoms bound to acyclic carbon atoms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
A7 五、發明説明(/) 發明領域 本發明係有關適合用於光阻劑組成物中之交聯劑(交 (請先閣讀背面之注意事項再一本頁) 聯劑),其聚合物,及含其之光阻劑組成物。更特定言之 ,本發明係有關用於光阻劑中之交聯劑,該光阻劑係適合 使用KrF ( 248奈米),ArF(193奈米),E-束,離子束或 EUV光源之光微影成像法所用者。其係用以製備高積體半 導體元件的微電路者;及有關採用該交聯之光阻劑組成物 〇 發明背暑 最近,化學擴大型DUV(深紫外光)光阻劑業經證明可 於半導體製造中在製備微電路所用方法中達到高敏感性。 彼等光阻劑係經由將光酸產生劑(photoacid generator)與具有 酸不安定性構造的聚合物基質巨分子摻合而製備成。 經濟部智慧財產局員工消費合作社印製 根據彼等光阻劑的反應機制,該光酸產生劑在受到光 源的照射時會產生酸,而該聚合的基質巨分子所含主鏈或 枝鏈會與所產生的酸交聯形成交聯構造。如此,暴露到光 源的部份不會被顯像溶液所溶解而保留未改變,由是產生 光罩在基材上的負影像。於石版印刷術程序中,解析率 (Vesohmon)係與光源所具波長有關-波長愈短,可形成的 圖樣愈小。不過,在將光源的波長減小以期形成微圖樣〔 例如,在使用193奈米波長或EUV(極紫外)光〕之時,會 有不利之處亦即曝光裝置的透鏡會被光源所變形因而減短 其壽命。 三聚氣胺(melamice)--種習用的交聯劑一具有有限數 本紙張尺度適用中國國家揉準(0^)六4規格(210父297公釐> Λ59〇^ 0 Α7 Β7 五、發明説明(>) (請先閲讀背面之注意事項再一,,.,¾本頁) 目(三個)可與酸形成交聯鍵結之官能基。再者,在使用 三聚氰胺作爲交聯劑時,因爲酸會被交聯反應所消耗’所 以必須產生大量的酸。其結果爲對於彼等交聯劑需要使用 高能量光之曝光β 爲了克服上述缺點,宜於採用可與光阻劑樹脂交聯且. 使用較低量的能量之化學擴大型化合物’不過’彼等化學 擴大型交聯劑至今尙未被開發出。 再者,於高積體率圖樣中,顯像溶液可能浸透劑經交 聯的部位內而使該經交聯部位膨脹起來°因此’爲了形成 較高積體率之圖樣,需要摻加可更精緻地實施交聯之新穎 交聯劑。 圖丨顯示出一種光阻圖樣其係經由使用包括一習用交 聯劑的光阻劑組成的所形成的U.Photopolymer Science and Technology, Vol.11, No.3,1998,507-512)。該圖樣係以採用 ArF光源的影印石版術和單體型交聯劑所製得之0.225微米 L/S圖樣。 如從圖1可看出者,於傳統光阻劑圖樣中有發生膨脹 現象,使得難以得到小於0.225微米L/S之圖樣。 經濟部智慧財產局員工消費合作社印製 發明槪述 本發明的目的提供一種光阻劑交聯劑,及其製備方法 〇 本發明的另一項目的爲提供一種光阻劑組成物,其包 括該交聯劑,及一種製備該組成物的方法。 本發明的又另一項目的爲提供一種經由使用該光阻劑 5 本紙張尺度通用中國國家標準(CNS〉A4規格(2[〇x297公釐) A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(3 ) 組成物製造之半導體元件。 爲了達到這些目的’本發明提供一種交聯劑單體’其 包括一種由下面化學式1所表示之化合物。 <化學式1> R3 I CH2 = C 人 0 0 I I Ri R2 其中,Ri與R2個別表示直鏈或枝鏈Cm。烷基’直鏈或枝鏈 Cm。酯,直鏈或枝鏈CiM酮,直鏈或枝鏈Cwo羧酸,直鏈 或枝鏈Ch。縮醛,包括至少一個羥基之直鏈或枝鏈Cm。 烷基,包括至少一個羥基之直鏈或枝鏈Cw。酯,包括至少 —個羥基之直鏈或枝鏈Ch。酮’包括至少一個羥基直鏈或 枝鏈之Cm。羧酸,及包括至少一個羥基之直鏈或枝鏈(:_ 縮醒;及Rj表示氫或甲基。 爲了達到本發明另一目的’乃提出一種光阻劑組成物 ,其包括⑴一光阻劑聚合物,⑴)上述光阻劑交聯劑,(iii) 光酸產生劑及(W)有機溶劑。 圖..式之簡略說明 圖1顯示經由使用傳統交聯劑製得之光阻圖案。 圖2至圖12顯示出使用根據本發明的交聯劑製得之光 阻圖案。 發明之詳細說曰月 本案發明人業已實施徹底的硏究以達成上文所述本發 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再!本頁) -裝. 訂 線
A A7 B7 五、發明説明(γ) 明諸目的,且發現以下面化學式1所表示的化合物具有恰 當性質以在負光阻劑聚合物的形成中作爲交聯單體。 <化學式1> R3
I
CHj = C 於該式中,:^與R2個別表示直鏈或枝鏈Cw。烷基,直鏈或 枝鏈Cm。酯,直鏈或枝鏈Cm。酮,直鏈或枝鏈。羧酸, 直鏈或枝鏈Cm。縮醛,包括至少一個羥基之直鏈或枝鏈 Cwo烷基,包括至少一個羥基之直鏈或枝鏈Cm。酯,包括 至少一個羥基之直鏈或枝鏈Ci.i。酮,包括至少一個羥基之 直鏈或枝鏈Chm羧酸,及包括至少一個羥基之直鏈或枝鏈 Cl-ι。縮醒;及R3表示氫或甲基。 具有從化學式1化合物衍生出的重複單位之交聯劑聚 合物可在酸存在下與具有羥基的光阻劑樹脂反應,以在光 阻劑聚合物之間誘發交聯反應。該化合物爲一種化學擴大 型交聯劑,因而可再與光阻劑樹脂組合產生酸(H+)而誘導 出連續的鏈型交聯反應。因此,在半導體製造方法的後一 烘烤步驟之過程中,光阻劑樹脂的曝光部份可被硬化到高 密度,藉以獲得一優異的圖案。 根據本發明的光阻劑交聯劑可爲化學式1所表示之化* 合物的同元聚合物;不過,更佳爲該交聯劑爲一種包括: ⑴化學式1所表示的化合物及(ii)一或多種選自包括:丙燦 酸、甲基丙烯酸與順丁烯二酸酐之化合物的共聚物°於此 7 _ 本紙張尺度逋用中國固家標準(CNS〉A4規格(210X297公釐) ^^^1- ^^^1 ^—41— nn ^^^1 —^ϋ n (請先閲讀背面之注意事項再1,.¾本頁) 訂· 線 經濟部智慧財產局員工消費合作社印製 A7 B7 五'發明説明(f) 情況中’根據本發明的交聯劑可以下面化學式2或化學式 3表示: <化學式2>
其中,1與R2個別表示直鏈或枝鏈烷基,直鏈或枝鏈 Cm。酯,直鏈或枝鏈Cm。酮,直鏈或枝鏈Cu。羧酸,直鏈 或枝鏈G.U)縮醛,包括至少一個羥基之直鏈或枝鏈Ct.u»烷 基,包括至少一個羥基之直鏈或枝鏈Cm。酯,包括至少一 個羥基之直鏈或枝鏈Ο.,。酮,包括至少一個羥基之直鏈或 枝鏈Cm。羧酸,及包括至少一個羥基之直鏈或枝鏈縮 醛:且R;和R4個別表示氫或甲基;且a : b=10-100莫耳 % : 0-90 莫耳%。 <化學式3> d· m·-- I - 請先聞讀背面之注意事項再r-烏本頁 訂 線- 經濟部智慧財產局員工消費合作社印製
其中,1與R:個別表示直鏈或枝鏈Cm。烷基’直鏈或枝鏈 Cm。酯,直鏈或枝鏈Cm。酮,直鏈或枝鏈Cmc)羧酸’直鏈 8 本紙浪尺度適用中國國家標隼(CNS ) A4规格(2丨〇><297公釐) 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(L) 或枝鏈Cm。縮醛,包括至少一個羥基之直鏈或枝鏈Cu。烷 基,包括至少一個羥基之直鏈或枝鏈Gw酯,包括至少一 個羥基之直鏈或枝鏈Cm。酮,包括至少一個羥基之直鏈或 枝鏈Cwo羧酸,及包括至少一個羥基之直鏈或枝鏈Cm。縮 '醛;及R3和R4個別表示氫或甲基;且a : b=10-90莫耳% :10-90 莫耳%。 下文要參照下面所示反應流程圖1說明根據本發明的 交聯劑之反應機制。 首先,將根據本發明的交聯劑混合一光阻劑樹脂,並 將該混合物塗覆在一習用的半導體基材上(階段1)。然後, 於將該基材的預定區曝光時,曝光部份會產生酸(階段2 )。由於曝光部份產生的酸所致,本發明交聯劑會與光阻 劑組合在一起,且彼等交聯反應會繼續產生酸,藉以進行 連續的鏈型交聯反應(階段3)。 請先閲讀背面之注意事項為本頁 -裝 訂 線 本紙張尺度適用中國國家標隼(CNS ) A4規格(2iOX297公釐> A7 B7 五、發明説明( <反應流程圖1>
交聯劑 八 0 0 I I Ri Rs
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OH OH GH OH 具有羧基之光阻劑聚合物 曝光時酸產生
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m 0Ή OH OH 經濟部智慧財產局8工消費合作社印製
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RaGH 作爲催化劑,因爲在交聯之後酸再次被產生 (化學擴大型之交聯劑) 本紙張尺度適用中國國家標準(CNS ) A4現格(210X297公釐) ,N A7 B7 五、發明説明(士) 交聯劑之製備 本發明交聯劑之製備要在下面的實施例1至8中明確 (請先閲讀背面之注意事項再fijr本頁 地說明。 於實施例1至8中,係使用AIBN作爲聚合起始劑, '不過別的習用自由基聚合起始劑例如過氧化月桂基也可以 取代使用。 於諸實施例中,係使用四氫呋喃作爲聚合反應溶劑, 不過其它的溶劑例如丙二醇、甲基、甲醚和乙酸酯也可以 取代使用。 光阻劑組成物之製備 使用本發明交聯劑製備負型光阻劑組成物之方法說明 於下: 由於本發明交聯劑爲化學擴大型交聯劑,因此本發明 光阻劑組成物包括⑴負型光阻劑樹脂,(ii)根據本發明之交 聯劑,及(in)光酸產生劑,以及(iv)將這些物質混合到其中 之有機溶劑。 經濟部智慧財產局員工消費合作社印製 有關光酸產生劑,較佳者爲使用硫化物或鎗型 (oniumtype)化合物。例如,該光酸產生劑可爲一或多種選 自包括:碘化二苯基六氧磷酸鹽(diphenyl iodide hexafluorophosphate),碘化二苯基六氟砷酸鹽,碘化二苯基 六氟銻酸鹽,二苯基對-甲基苯基三氟甲烷磺酸鹽,二苯 基對-甲苯基三氟甲烷磺酸鹽,二苯基對_異丁基苯基三 氟甲烷磺酸鹽,二苯酯對-第三丁基苯基三氟甲烷磺酸鹽 ,三苯基銃六氟磷酸鹽,三苯基毓六氟砷酸鹽,三苯基毓 11 本紙張尺度適用中國國家榇隼{ CNS ) A4規格(210X297公釐) d59〇'0 經濟部智慧財產局員工消費合作社印製 五、發明説明(1) 六氟銻酸鹽,三苯基銃三氟甲烷磺酸鹽和二丁基萘基銃三 氟甲烷磺酸鹽之化合物。 有關有機溶劑,可以使用環己酮,3-甲氧基丙酸甲酯 ,3-乙氧基丙酸乙酯,丙二醇甲基醚乙酸酯,或其它習用 的有機溶劑。 光阻劑圖樣之形成 將根據本發明製得之光阻劑組成物施塗在矽晶圓上以 形成一薄膜,並將該膜置於70至200°C,較佳者80至150 t的烘箱內或電熱板上“軟烤”(soft-boked) 1至5分鐘。 然後使用一深紫外光曝光器或激生分子雷射曝光器(exdmei: laser exposer)將該光阻膜曝光,再置於10至200°C,更佳 者100至2CKTC下“後-烘烤”(post-baked)。有關其光源, 可以使用ArF光、KrF光、E-束、X-射線、EUV(極紫外光) 、DUV(深紫外光)或類似者。曝光能量較佳者爲0.1至100 毫焦耳/平方厘米。 將曝光過的晶圓經由將晶圓浸漬於一鹼性顯像溶液例 如2.38重量%或2.5重量%氫氧化四甲銨(TMAH)水溶液內 —般預定之時間,較佳者1.5分鐘,予以顯影而得到超微 米圖案(圖2)。 在光阻劑組成物係經由使用根據本發明的新穎交聯劑 製備時,該光阻劑樹脂在曝光部份與未曝光部份之間有明 顯的硬化性差異,由是得到具有更優異輪廓(profile)之光阻 劑圖案。再者,由於本發明交聯劑爲化學擴大型。因此只 要使用少量的光酸產生劑,該交聯劑即可達到足夠之結果 12 本紙法尺度適用中國國家樣準(CNS ) M規潘(210X297公釐) A7 B7___ 五、發明説明(Λ) -------·-----裝—— 、' (請先聞讀背面之注項再flpr本頁 。因此,可克服使用大量光酸產生劑所引起的問題。該光 阻劑組成物顯示出優良的光敏感性,所以採用低照射能量 來曝光即可達到充分的曝光,因此之故’其適合用於採用 極短波長的光源,例如ArF(193奈米)之光微影成像法。 駿佳實施例之詳細說明 本發明藉由參照下面的實施例更詳細地說明,但必須 特別提及者本發明不受彼等實施例所限制。 實施例1 :聚(3,3-二甲氣某丙烯)之合成 訂 將以下面化學式4所表示的丙烯醛(30克),AIBN(0.6 克)和四氫呋喃(75克)置於一 200-毫升燒瓶中,並在65°C氮 氣或氬氣大氣下反應8小時。於聚合反應完成之後,用乙 醚沉澱出聚丙烯醛(產率:60%)。 線 將如此得到之聚丙烯醛(20克)和甲醇(200克)置於一 500毫升圓底燒瓶中,並予以密切地混合。於其中加入三 氟甲烷磺酸(0.5克),並將所得混合物於80°C下回流加熱24 小時,再用TMAH溶液中和到PH7-8。之後,使用旋轉蒸 發器將反應混合物濃縮,並用蒸餾水沉澱剩餘物。將沉澱 物真空乾燥而得化學式5之聚0,3-二甲氧基丙烯)樹脂 經濟部智慧財產局員工消費合作社印製 (產率:60%)。化學式5化合物係經由其NMR光譜從 在8至9ppm處的醛譜峰之消失而確定的。化學式5化合物 的分子量較佳在4,000至6,000範圍之內。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) A7 _______Β7 五、發明説明(/ /) <化學式4> c=o <化學式5>
經濟部智慧財產局員工消費合作社印製 於式中’ η表示參與同元聚合的單元數目。 實施例2 :聚(3,3-二甲氧某丙烯/丙烯酸)之合成 將化學式4的丙烯醛(3〇克),丙烯酸(3克), ΑΙΒΝ(0.66克)和四氫呋喃(80克)置於一200-毫升燒瓶中, 並在6CTC氮氣或氬氣大氣下將混合反應8小時。於聚合反 應完成之後,用水沉澱而得聚合物(16克,產率:50%)。 將如此得到之聚合物(16克)和甲醇(300克)置於一圓底燒瓶 中’並予以密切地混合。於其中加入三氟甲烷磺酸(0,8毫 克),並將所得混合物於80°C下回流加熱8小時,再用 TMAH溶液中和到ρΗ7·8。之後,使用旋轉蒸發器將反應混 合物濃縮’並將所得溶液溶解於氯仿(300克)之中。將該溶 液置於一分液漏斗內,並於其中加入蒸餾水(300克)。分離 出蒸餾水層並在減壓下蒸發濃縮而得化學式6之聚(3,3-二 甲氧基丙烯/丙烯酸)樹脂(產率:70%,分子量:4,000至 7,000) ° 14
In· - - —l·— n n (請先閱讀背面之注意事項再^¾本頁) *π 本纸張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) A7 B7 五、發明説明(/丄) <化學式6>
'式中,a和b個別表示各共單體的聚合比例。 實例3 :聚(3、3-二乙氧某丙烯)之合成 重複實施例1之步驟但使用乙醇取代甲醇,以獲化學 式7所表的化合物,聚(3,3-二乙氧基丙烯)(產率;67%)。 <化學式7> (請先閱讀背面之注意事項He,¾本頁
經濟部智慧財產局員工消費合作社印製 式中,η表示參與同元聚合的單體之數目。 實施例4 :聚Π.3-二乙氣基丙烯/丙烯酸)之合成 重複實施例2之步驟但使用乙醇取代甲醇,以獲化學 式8表示的化合物,聚(3,3-二乙氧基丙烯/丙烯酸)(產率: 67%)。 <化學式8>
式中,a和b個別表示各共單體的聚合比例。 15 本紙張尺度適用中國國家楳準(CNS ) A4規格(2[OX297公釐> r 459 01 Ο A7 B7 五、發明説明(丨3 ) 實施例5 :聚Π.3-二甲氣基丙烯/順丁烯二酸酐)之合成 將化學式9的3,3-二甲氧基丙烯(0.3莫耳),順丁烯二 酸酐(0.1莫耳),AIBN(0.8克)和四氫呋喃(42)克置於一 100-毫升燒瓶中,並在65°C氮氣或氬氣大氣下反應8小時。於 聚合反應完成之後,用乙醚沉澱出聚合物。將聚合物沉澱 物真空乾燥以獲得下面化學式1〇所表示之純樹脂: <化學式9> λ CH3 CH3 <化學式10> f—1---:----裝-- (請先閱讀背面之注意事項再ir-為本頁)
、-a 其中,a和b個別表示各共單體的聚合比例。 實施例6 :聚G.3-二乙氬某丙烯/順丁烯二酸酐)之合成 重複實施例5之步驟但使用化學式11的3,3-二乙氧基 丙烯(0.3莫耳)取代化學式9的3,3-二甲氧基丙烯(0.3莫耳) ,以獲得得化學式12所表的化合物(產率:51%)。 <化學式11 > 線 經濟部智慧財產局員工消費合作社印製
2HJ ο-C-C 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) Α7 Β7 五、發明説明(//) <化學式12>
CHj CH3 實施例7 :聚GJ-二甲氬基-2-甲某丙烯)之含成 重複實施例1之程序但使用甲基丙烯醛取代丙烯醛以 獲得化學式13所表示的化合物,聚(3,3-二甲氧基-2-甲基丙 嫌)。 <化學式13> 請先閱讀背面之注意事項h.'4本頁)
經濟部智慧財產局員工消費合作社印製 式中η表示參與同元聚合的單體之數目。 實施例8 :聚(3.3-二乙氬基-2-甲基丙烯)之合成 重複實施例3之步驟C但使用甲基丙烯醛取代丙烯醛 以獲得化學式14所表示的化合物,聚(3,3-二乙氧基-2-甲基 丙烯)。 <化學式14>
式中η表示參與同元聚合的單體之數目。 實施例9 17 本紙張尺度適用中國國家標準(CNS > A4規格(2IOX297公釐) Α7 Β7 五、發明説明(ίί) 將⑴下面化學式15所表示的光阻劑樹脂,亦即,聚( 雙環[2,2,1]庚-5-烯/2-羥基乙基雙環[2,2,1]庚-5-烯2-羧酸/順 丁烯二酸酐)(20克),(U)本發明實施例1所得之聚(3,3-二甲 氧基丙烯)交聯劑(5克)及(iii)作爲光酸產生劑的三氟甲烷磺 酸三苯基銃(0.6克)溶解在作爲有機溶劑的丙二醇甲醚乙酸 酯(200克)中,以製備光阻劑組成物。 <化學式15>
將如此製得之光阻劑組成物塗覆在一矽晶圓上,並在 110°C下軟烤90秒,使用ArF曝光器予以曝光,在ll〇°C下 後-烘烤90秒,然後用2.38重量%TMAH顯影溶液顯影。 其結果得到0.13微米L/S超微米負圖案,如圖3中所示者 9 此時的曝光能量爲18毫焦耳/平方厘米。該光阻劑組 成物的硬化敏感度於此種微小強度的曝光能量下很是優良 ,如圖1中所示者,未觀察到膨脹現象。彼等結果是由於 聚(3,3-二甲氧基丙烯)樹脂之非常優良的硬化性,根據本發 明的交聯劑,及彼等所導致的密切交聯。因此,該超微米 圖案顯示出優異的圖案輪廓。 實施例10 18 (請先閱讀背面之注意事項再f烏本頁 -裝. 訂 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) A7 ___B7 五、發明説明( 將⑴化學式15所表示的光阻劑樹脂,亦即,聚(雙_ [2,2,1]庚·5-嫌/2·羥基乙基雙環[2.2.1]庚-5-烯2-羧酸醋/順丁 烯二酸酐,(20克),(ii)本發明實施例2所得之聚(3,3_二甲 氧基丙烯/丙烯酸)交聯劑(20克),和(iU)作爲光酸產生劑的 三氟甲烷磺酸三苯基銃(0.7克)溶解在作爲有機溶劑的丙二 醇甲醚乙酸酯(200克)中而製得光阻劑組成物。 ' 將如此製得之光阻劑組成物塗覆在矽晶圓上, 110°C下軟烤90秒,使用ArF曝光器予以曝光,在U(rcT 後-烘烤90秒,然後用2.38重量%TMAH顯影溶液予以顯 影而得-0.13微米L/S超微米負型圖案。此外同樣地,雖貝fJ 曝光能量如同實施例1 一般非常微弱(18毫焦耳/平方厘平) ,但仍得到具有優良圖案輪廓之超微米圖案(圖4)。 眚施例11-16 重複相同的步驟,使用實施例3至實施例8所得交聯 劑,其結果,得到如同實施例9和10 —般優異之微圖案( 圖5至圖10)。 奮施例17 將⑴化學式16所表示的光阻劑樹脂(20克), 經濟部智慧財產局員工消費合作社印製 明實施例2所得之聚(3,3-二甲氧基丙烯/丙烯酸)交聯齊 克),及(iii)作爲光酸產生劑的三氟甲烷磺酸三苯基綺(〇.6 克)溶解在作爲有機溶劑的丙二醇甲基醚乙酸酯(2〇〇克)巾 ,以製備光阻劑組成物。 將如此製得之光阻劑組成物塗覆在矽晶圓上,於11〇 °C下軟烤90秒,使用ArF曝光器予以曝光,在供 19 本紙張尺度適用中國國家標準(CNS >从規格(210Χ297公釐> 經濟部智慧財產局員工消費合作社印製 A7 _B7_ 五、發明説明(ι7 ) 烤90秒,然後用2.38重量%ΤΜΑΗ顯影溶液予以顯影,而 得0.13微米L/S超微米負圖案。此時同樣地,雖則曝光能 量如同實施例1中般非常弱(15毫焦耳/平方厘米),但仍得 到具有優異圖案輪廓之超微圖案(圖11)。
CH2
OH 實施例18 重複根據實施例17之步驟但使用化學式17之光阻劑 樹脂取代化學式16之樹脂以製得0.18微米L/S超微負圖案 (圖 12)。
ch2 c=o on i
I CH.
I CK.
I
OH 實施例19 重複根據實施例17之步驟但使用化學式18之光阻劑 樹脂取代化學式16之樹脂以製得0.20微米L/S超微負圖案 〇 <化學式18> 20 ---l·------裝------訂------線 I- ^ (請先閱讀背面之注意事項再垆寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐} 五、發明説明(ΐίΓ )
CH-, l _ OH A7 B7 C=0
CH, I ' CH2 CH2 OH 實施例20 重複根據實施例Π之步驟但使用化學式19之光阻劑 樹脂取代化學式16之樹脂而製得-0.20微米L/S超微負圖 案。 <化學式19>
o=c c=o I I OH OH C=0
CHi 1 ~ CHZ OH 請 先 鬩 讀 背 意 事 項 再 % 本 頁 裝 訂 經濟部智慧財產局員工消費合作社印製 眚施例21 重複根據實施例Π之步驟但使用化學式20之光阻劑 樹脂取代化學式16之樹脂而製得-0,20微米L/S超微負圖 案。 <化學式20> 21 本紙張尺度適用中國國家標準(〇^)八4規格(210'乂297公釐) 線 459010 A7 B7 五、發明説明(/?)
I CH-. I ^ CH-, r CH-i ' OH OH OH 〇 — 訂 線 f ί (請先閱讀背面之注意事項再妒寫本頁) 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用中國國家標準(CNS) A4規格(210X297公釐}
Claims (1)
- 經濟部智慧財產局員工消費合作社印製 :-L· * 453 0 - 0 § if D8 · ' Λ I I·::···: I .... 六、申請專利範圍 1. 一種光阻劑交聯劑單體,其包括下面化學式1所表 示之化合物: <化學式1> R3 I CH2 = C 人 〇 〇 I I Ri Rs 其中,1與R2個別表直鏈或枝鏈型Cmo烷基,直鏈或枝鏈 Cho酯,直鏈或枝鏈CLH)酮,直鏈或枝鏈Cuw羧酸,直鏈 或枝鏈CH。縮醛,包括至少一個羥基之直鏈或枝鏈Cm。烷 基,包括至少一個羥基之直鏈或枝鏈〇.1()酯,包括至少一 個羥基直鏈或枝鏈Cwo酮,包括至少一個羥基之直鏈或枝 鏈Cw。羧酸,及包括至少一個羥基之直鏈或枝鏈Ch。縮醛 ;且R3表氫或甲基。 2. —種光阻劑交聯劑,其包括化學式1所表示之化合 物的同元聚合物或共聚物。 3. 如申請專利範圍第2項之光阻劑交聯劑,其中該共 聚物更包括一或多種選自包括丙烯酸,甲基丙烯酸和順丁 烯二酸酐所構成之化合物。 4. 如申請專利範圍第2項之光阻劑交聯劑,其係選自 包括:聚(3,3-二甲氧基丙烯);聚(3,3-二乙氧基丙烯);聚 (3,3-二甲氧基丙烯/丙烯酸);聚0,3-二乙氧基丙烯/丙烯酸) ;聚(3,3-二甲氧基丙烯顯丁烯二酸酐);聚0,3-二乙氧基丙 烯/順丁烯二酸酐);聚(3,3-二甲氧基-2-甲基丙烯):聚(3,3-二乙氧基-2-甲基丙烯)。 -1-- 本紙張尺度逋用中國國家棣準(CNS ) A4規格(210X297公釐) .—I * 裝 , 訂 線 (請先閔讀背面之注意事項再氣 4頁) ί 申請專利範圍 A8 B8 C8 D8 5. 〜種光阻劑組成物,其包括ω—光阻劑聚合物’(ii) 如申請專利範圍第2項之矣聯劑,(iii)光酸產生劑及(iv)有 機溶劑。 6. 如申請專利範圍第5項之光阻劑組成物’其中該光 阻劑聚合物包括羥基。 7. 如申請專利範圍第6項之光阻劑組成物’其中該光 阻劑聚合物係選自包括下列化學式15至20所表示之化合 物: <化學式15>^ 厂、^ k (。==^。^=〇》 :=0 7> 經濟部智慧財產局員工消費合作社印製 {hj ch2 OH <化學式16>本紙張尺度適用中國國家椟率(CNS ) A4«l格(210x297公釐) n n I 1— I 1♦1 n n n I I n n T n I n U3 、趸 期 <請先閲讀背面之注意事項再1 4頁) 一 A8 BS C8 D8 申請專利範圍 <化學式18>CH, I -0H r° CH. I CH, I CH2 OH r <化學式19> ο 0 o气宁=0 OH OH C=0 1 0 I c沁 1 " ch2 b (請先閩讀背面之注意事項再^-4頁) OH0 I CH-»I CH, I ' OH 經濟部智慧財產局員工消費合作社印製 8.如申請專利範圍第5項之光阻劑組成物,其中該光 酸產生劑爲一或多種選自包括:碘化二苯基六氟磷酸鹽 (diphenyl iodide hexafluorophosphate),碘化二苯基六氟砷酸 鹽,碘化二苯基六氟銻酸鹽,二苯基對-甲基苯基三氟甲 本紙張尺度適用中國國家揉準(CNS ) Μ規格(210Χ297公釐) 六、申請專利範圍 院磺酸鹽,二苯基對一甲苯基三氟甲烷磺酸鹽’二苯基對 -異丁基苯基三氟甲烷磺酸鹽,二苯酯對一第三丁基苯基 三氟甲烷磺酸鹽,三苯基銃六氟磷酸鹽’三苯基錡六氟砷 酸鹽,三苯基銃六氟銻酸鹽,三苯基銃三氟甲烷磺酸鹽和 二丁基蔡基錡三氟甲烷磺酸鹽之化合物。 9. 如申請專利範圍第5項之光阻劑組成物’其中該有 機溶劑選自包括:環己酮,3-甲氧基丙酸甲酯’ 3-乙氧基 丙酸乙酯和丙二醇甲基醚乙酸酯。 10. —種形成光阻圖案之方法,其包括下列步驟:⑷將 如申請專利範圍第5項之組成物塗覆在一晶圓上’(b)丨吏用 曝光器使該晶圚曝光’及(c)將曝光過的晶圓顯影。 11. 如申請專利範圍第10項之方法,其中該光源彳系選 自包括:ArF光(193奈米)、KrF光(248奈米)' E-束、χ-射 線、EUV和DUV(深紫外光)。 12. 如申請專利範圍第10項之方法,其中該顯像步,驟 係使用鹼性顯影溶液進行的。 經濟部智慧財產局員工消費合作社印製 13. 如申請專利範圍第12項之方法,其中該顯像溶液 爲2.38重量%或2.5重量%的ΤΜΑΗ水溶液。 14. 一種半導體元件,其係由如申請專利範圍第10項 之方法製造。 本紙張尺度適用中國困家棣車(CNS ) Α4规格(210X297公釐)
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| GB695789A (en) | 1950-02-11 | 1953-08-19 | Distillers Co Yeast Ltd | Oxygen containing propene derivatives |
| US2866813A (en) * | 1956-03-29 | 1958-12-30 | Union Carbide Corp | Aldehyde diacylates and process for producing the same |
| US3468857A (en) | 1965-10-04 | 1969-09-23 | Ashland Oil Inc | Thermosetting polymers of unsaturated acetals |
| US4476033A (en) | 1982-07-30 | 1984-10-09 | Phillips Petroleum Company | Method and compositions for acidizing and fracturing wells |
| US4562009A (en) * | 1983-11-28 | 1985-12-31 | The Dow Chemical Company | Halonitriles, their preparation and use to make halopyridines |
| DE3346266A1 (de) * | 1983-12-21 | 1985-07-11 | Lentia Gmbh | Verfahren zur herstelung von glyoxal, alkylglyoxalen und von deren acetalen |
| DE3403426A1 (de) * | 1984-02-01 | 1985-08-01 | Degussa Ag, 6000 Frankfurt | Verfahren zur herstellung von acetalen |
| NZ222979A (en) * | 1986-12-23 | 1990-09-26 | Biopolymers Ltd | Polymeric biocidal or biostatic compounds and compositions |
| DE3714276C2 (de) | 1987-04-29 | 2002-09-19 | Celanese Ventures Gmbh | Hydrophile, vernetzte Polymerisate, Verfahren zu ihrer Herstellung und ihre Verwendung |
| US5200051A (en) * | 1988-11-14 | 1993-04-06 | I-Stat Corporation | Wholly microfabricated biosensors and process for the manufacture and use thereof |
| EP0720052A1 (en) * | 1994-12-27 | 1996-07-03 | Mitsubishi Chemical Corporation | Photosensitive composition and photosensitive lithographic printing plate |
| US5958995A (en) * | 1996-08-29 | 1999-09-28 | Xerox Corporation | Blends containing photosensitive high performance aromatic ether curable polymers |
| US6121399A (en) * | 1997-10-23 | 2000-09-19 | Eastman Chemical Company | Polymers of 3-butene esters, their preparation and use |
-
1999
- 1999-11-24 US US09/448,916 patent/US6368773B1/en not_active Expired - Fee Related
- 1999-11-24 DE DE19956531A patent/DE19956531A1/de not_active Withdrawn
- 1999-11-24 GB GB9927637A patent/GB2344104B/en not_active Expired - Fee Related
- 1999-11-26 FR FR9914920A patent/FR2786491B1/fr not_active Expired - Fee Related
- 1999-11-26 NL NL1013685A patent/NL1013685C2/nl not_active IP Right Cessation
- 1999-11-26 IT IT1999TO001042A patent/IT1308659B1/it active
- 1999-11-26 TW TW088120825A patent/TW459010B/zh active
- 1999-11-26 CN CNB991258568A patent/CN1163796C/zh not_active Expired - Fee Related
- 1999-11-29 JP JP33865999A patent/JP4127941B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| NL1013685C2 (nl) | 2001-06-21 |
| GB2344104B (en) | 2004-04-07 |
| CN1255652A (zh) | 2000-06-07 |
| GB2344104A (en) | 2000-05-31 |
| CN1163796C (zh) | 2004-08-25 |
| DE19956531A1 (de) | 2000-05-31 |
| JP2000181064A (ja) | 2000-06-30 |
| FR2786491B1 (fr) | 2003-04-18 |
| ITTO991042A1 (it) | 2001-05-26 |
| FR2786491A1 (fr) | 2000-06-02 |
| GB9927637D0 (en) | 2000-01-19 |
| ITTO991042A0 (it) | 1999-11-26 |
| IT1308659B1 (it) | 2002-01-09 |
| JP4127941B2 (ja) | 2008-07-30 |
| US6368773B1 (en) | 2002-04-09 |
| NL1013685A1 (nl) | 2000-05-30 |
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