TW483075B - Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet - Google Patents

Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet Download PDF

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Publication number
TW483075B
TW483075B TW089113633A TW89113633A TW483075B TW 483075 B TW483075 B TW 483075B TW 089113633 A TW089113633 A TW 089113633A TW 89113633 A TW89113633 A TW 89113633A TW 483075 B TW483075 B TW 483075B
Authority
TW
Taiwan
Prior art keywords
microchip
substrate
adhesive material
scope
patent application
Prior art date
Application number
TW089113633A
Other languages
English (en)
Chinese (zh)
Inventor
Wolfgang Wehl
Original Assignee
Ekra Eduard Kraft Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekra Eduard Kraft Gmbh filed Critical Ekra Eduard Kraft Gmbh
Application granted granted Critical
Publication of TW483075B publication Critical patent/TW483075B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
TW089113633A 1999-07-06 2000-07-31 Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet TW483075B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19931113A DE19931113A1 (de) 1999-07-06 1999-07-06 Verfahren zum Aufbringen von Verbindungsmaterialien für eine Verbindung zwischen einem Mikrochip und einem Substrat, Verfahren zum Herstellen einer elektrischen und mechanischen Verbindung zwischen einem Mikrochip und einem Substrat sowie Verwendung eines nach dem Tintendruckprinzip arbeitenden Druckkopfes

Publications (1)

Publication Number Publication Date
TW483075B true TW483075B (en) 2002-04-11

Family

ID=7913787

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089113633A TW483075B (en) 1999-07-06 2000-07-31 Process for applying connecting materials for a connection between a microchip and a substrate, process for producing an electrical and mechanical connection between a microchip and a substrate, and use of a printing head working according to the ink-jet

Country Status (4)

Country Link
AU (1) AU6432500A (fr)
DE (1) DE19931113A1 (fr)
TW (1) TW483075B (fr)
WO (1) WO2001003183A2 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10141753A1 (de) * 2001-08-29 2003-03-20 Orga Kartensysteme Gmbh Verfahren zur Montage eines elektronischen Bauelementes auf einer Trägerstuktur in Face-Down-Technik
WO2005087497A2 (fr) * 2004-03-12 2005-09-22 Siemens Aktiengesellschaft Structuration a jet d'encre en 3d de surfaces hautement topographiques
US7354794B2 (en) 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors
CN118431087B (zh) * 2024-04-26 2024-12-06 扬州君瑞得科技有限公司 应用于集成封装芯片焊盘强度改善方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3107079A1 (de) * 1981-02-25 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Partielle beschichtung von kontaktbauteilen mit edelmetallen
DE3637631C1 (de) * 1986-11-05 1987-08-20 Philips Patentverwaltung Verfahren zum Aufbringen kleiner schmelzfluessiger,tropfenfoermiger Lotmengen aus einer Duese auf zu benetzende Flaechen und Vorrichtung zur Durchfuehrung des Verfahrens
DE3910201A1 (de) * 1989-03-30 1990-10-04 Asea Brown Boveri Bondeinrichtung
US5152456A (en) * 1989-12-12 1992-10-06 Bespak, Plc Dispensing apparatus having a perforate outlet member and a vibrating device
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5415679A (en) * 1994-06-20 1995-05-16 Microfab Technologies, Inc. Methods and apparatus for forming microdroplets of liquids at elevated temperatures
US5560543A (en) * 1994-09-19 1996-10-01 Board Of Regents, The University Of Texas System Heat-resistant broad-bandwidth liquid droplet generators
US5783867A (en) * 1995-11-06 1998-07-21 Ford Motor Company Repairable flip-chip undercoating assembly and method and material for same
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus

Also Published As

Publication number Publication date
AU6432500A (en) 2001-01-22
WO2001003183A2 (fr) 2001-01-11
DE19931113A1 (de) 2001-01-25
WO2001003183A3 (fr) 2001-05-25

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