TW483832B - Silicone rubber composition for key pad and key pad made thereform - Google Patents

Silicone rubber composition for key pad and key pad made thereform Download PDF

Info

Publication number
TW483832B
TW483832B TW88115237A TW88115237A TW483832B TW 483832 B TW483832 B TW 483832B TW 88115237 A TW88115237 A TW 88115237A TW 88115237 A TW88115237 A TW 88115237A TW 483832 B TW483832 B TW 483832B
Authority
TW
Taiwan
Prior art keywords
minutes
silicone rubber
rubber composition
hollow
composition
Prior art date
Application number
TW88115237A
Other languages
English (en)
Chinese (zh)
Inventor
Noriyuki Meguriya
Nobumasa Tomizawa
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of TW483832B publication Critical patent/TW483832B/zh

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
TW88115237A 1999-04-26 1999-09-03 Silicone rubber composition for key pad and key pad made thereform TW483832B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11841199A JP2000309710A (ja) 1999-04-26 1999-04-26 キーパッド用シリコーンゴム組成物及びキーパッド

Publications (1)

Publication Number Publication Date
TW483832B true TW483832B (en) 2002-04-21

Family

ID=14735991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88115237A TW483832B (en) 1999-04-26 1999-09-03 Silicone rubber composition for key pad and key pad made thereform

Country Status (2)

Country Link
JP (1) JP2000309710A (ja)
TW (1) TW483832B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4762389B2 (ja) * 1998-10-15 2011-08-31 信越化学工業株式会社 中空フィラー含有シリコーンゴム組成物
JP2001164111A (ja) * 1999-12-10 2001-06-19 Dow Corning Toray Silicone Co Ltd シリコーンゴム組成物、およびキーパッド用シリコーンゴム組成物
JP2004101851A (ja) * 2002-09-09 2004-04-02 Sony Corp 表示装置および表示装置を有する電子機器
JP4114050B2 (ja) * 2002-10-15 2008-07-09 信越化学工業株式会社 電子機器用シリコーン断熱シート及びこれを用いた断熱方法
JP2016023259A (ja) * 2014-07-23 2016-02-08 信越化学工業株式会社 硬化性シリコーンゴム組成物及びシリコーンゴム部材

Also Published As

Publication number Publication date
JP2000309710A (ja) 2000-11-07

Similar Documents

Publication Publication Date Title
TW555794B (en) Method for the preparation of low specific gravity silicone rubber elastomers
TW500766B (en) Thermal conductive silicone rubber compositions and method of making
JP3543663B2 (ja) 熱伝導性シリコーンゴム組成物及びその製造方法
JP5015436B2 (ja) 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
TW574094B (en) Hollow filler-containing silicone rubber and method of production
TWI225080B (en) Silicone rubber compositions
TWI513770B (zh) Thermally conductive silicone rubber composition
JP6194861B2 (ja) 熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物
JP4144998B2 (ja) 放熱用部材
US9403982B2 (en) Curable silicone composition and cured product thereof
JP2011089079A (ja) 熱伝導性シリコーン組成物及びその硬化物
JPH06155517A (ja) 熱伝導性複合シートの製造方法
TW200813137A (en) High-open cell-content silicone rubber sponge
TWI477559B (zh) Thermally conductive silicone oxygen elastomer and method of manufacturing the same
JP5115716B2 (ja) 低比重シリコーンゴム接着剤組成物
JP3521781B2 (ja) 放熱部材
TW483832B (en) Silicone rubber composition for key pad and key pad made thereform
CN101273106A (zh) 导热有机硅弹性体、导热有机硅弹性体组合物和导热介质
JP7466266B2 (ja) 成形品
JP2000086897A (ja) 免震積層体用硬化性シリコーン組成物
JP2003147207A (ja) 低比重液状シリコーンゴム組成物および低比重シリコーンゴム成形物
JP6919634B2 (ja) キーパッド作製用シリコーンゴム組成物及びキーパッド
TWI679245B (zh) 硬化性聚矽氧烷橡膠組成物及聚矽氧烷橡膠構件
JP2007119589A (ja) 熱伝導性シリコーンゴム組成物
JP2001315135A (ja) 低比重シリコーンゴム弾性体の製造方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees