TW496812B - Eddy current sensing and optical monitoring for chemical mechanical polishing - Google Patents

Eddy current sensing and optical monitoring for chemical mechanical polishing Download PDF

Info

Publication number: TW496812B
Authority: TW; Taiwan
Prior art keywords: grinding; substrate; patent application; scope; item
Prior art date: 2000-05-19

Application number

TW090112035A

Other languages

English (en)

Chinese (zh)

Inventor

Hiroji Hanawa

Nils Johansson

Boguslaw A Swedek

Manoocher Birang

Fritz C Redeker

Original Assignee

Applied Materials Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-05-19

Filing date

2001-08-06

Publication date

2002-08-01

2000-05-19 Priority claimed from US09/574,008 external-priority patent/US6924641B1/en

2001-08-06 Application filed by Applied Materials Inc filed Critical Applied Materials Inc

2002-08-01 Application granted granted Critical

2002-08-01 Publication of TW496812B publication Critical patent/TW496812B/zh

Links

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238000005498 polishing Methods 0.000 title claims abstract description 146
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239000000758 substrate Substances 0.000 claims abstract description 175
238000000227 grinding Methods 0.000 claims description 295
238000000034 method Methods 0.000 claims description 78
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BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims description 3
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QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Polishing Bodies And Polishing Tools (AREA)
Length Measuring Devices With Unspecified Measuring Means (AREA)

TW090112035A 2000-05-19 2001-08-06 Eddy current sensing and optical monitoring for chemical mechanical polishing TW496812B (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US09/574,008 US6924641B1 (en)	2000-05-19	2000-05-19	Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US21722800P	2000-07-10	2000-07-10
US22166800P	2000-07-27	2000-07-27

Publications (1)

Publication Number	Publication Date
TW496812B true TW496812B (en)	2002-08-01

Family

ID=27396396

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW090112035A TW496812B (en)	2000-05-19	2001-08-06	Eddy current sensing and optical monitoring for chemical mechanical polishing

Country Status (7)

Country	Link
EP (1)	EP1294534B2 (de)
JP (4)	JP5542293B2 (de)
KR (1)	KR100827871B1 (de)
AT (1)	ATE315980T1 (de)
DE (3)	DE60132385T2 (de)
TW (1)	TW496812B (de)
WO (1)	WO2001089765A1 (de)

Cited By (2)

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CN104471685A (zh) *	2012-07-25	2015-03-25	应用材料公司	监控扣环厚度及压力控制
US20200276685A1 (en) *	2019-02-28	2020-09-03	Kevin H. Song	Controlling Chemical Mechanical Polishing Pad Stiffness By Adjusting Wetting in the Backing Layer

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JP5495493B2 (ja) *	2008-02-07	2014-05-21	株式会社東京精密	膜厚測定装置、及び膜厚測定方法
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JP5513821B2 (ja) *	2009-09-17	2014-06-04	株式会社荏原製作所	渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法
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JP6779633B2 (ja)	2016-02-23	2020-11-04	株式会社荏原製作所	研磨装置
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JP3907414B2 (ja) *	2000-01-17	2007-04-18	株式会社荏原製作所	ポリッシング装置
JP3916375B2 (ja) *	2000-06-02	2007-05-16	株式会社荏原製作所	ポリッシング方法および装置

2001
- 2001-05-18 DE DE60132385T patent/DE60132385T2/de not_active Expired - Lifetime
- 2001-05-18 JP JP2001585991A patent/JP5542293B2/ja not_active Expired - Fee Related
- 2001-05-18 AT AT01937595T patent/ATE315980T1/de not_active IP Right Cessation
- 2001-05-18 DE DE60116757A patent/DE60116757D1/de not_active Expired - Lifetime
- 2001-05-18 EP EP01937595A patent/EP1294534B2/de not_active Expired - Lifetime
- 2001-05-18 DE DE60116757T patent/DE60116757T4/de not_active Expired - Lifetime
- 2001-05-18 KR KR1020027015632A patent/KR100827871B1/ko not_active Expired - Fee Related
- 2001-05-18 WO PCT/US2001/016290 patent/WO2001089765A1/en not_active Ceased
- 2001-08-06 TW TW090112035A patent/TW496812B/zh not_active IP Right Cessation
2012
- 2012-10-03 JP JP2012221417A patent/JP5778110B2/ja not_active Expired - Lifetime
2014
- 2014-06-13 JP JP2014121991A patent/JP6041833B2/ja not_active Expired - Lifetime
- 2014-06-13 JP JP2014121990A patent/JP5980843B2/ja not_active Expired - Lifetime

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104471685A (zh) *	2012-07-25	2015-03-25	应用材料公司	监控扣环厚度及压力控制
CN104471685B (zh) *	2012-07-25	2018-02-13	应用材料公司	监控扣环厚度及压力控制
US20200276685A1 (en) *	2019-02-28	2020-09-03	Kevin H. Song	Controlling Chemical Mechanical Polishing Pad Stiffness By Adjusting Wetting in the Backing Layer
US12257664B2 (en) *	2019-02-28	2025-03-25	Applied Materials, Inc.	Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer

Also Published As

Publication number	Publication date
EP1294534A1 (de)	2003-03-26
JP5778110B2 (ja)	2015-09-16
JP2014208401A (ja)	2014-11-06
DE60116757T4 (de)	2007-01-18
WO2001089765A1 (en)	2001-11-29
KR20030001529A (ko)	2003-01-06
JP6041833B2 (ja)	2016-12-14
DE60132385D1 (de)	2008-02-21
JP2014209643A (ja)	2014-11-06
JP5980843B2 (ja)	2016-08-31
DE60132385T2 (de)	2008-05-15
EP1294534B1 (de)	2006-01-18
ATE315980T1 (de)	2006-02-15
EP1294534B2 (de)	2006-01-25
JP2013058762A (ja)	2013-03-28
KR100827871B1 (ko)	2008-05-07
DE60116757D1 (de)	2006-04-06
JP5542293B2 (ja)	2014-07-09
JP2003534649A (ja)	2003-11-18
DE60116757T2 (de)	2006-07-27

Legal Events

Date	Code	Title	Description
2002-12-19	GD4A	Issue of patent certificate for granted invention patent
2021-05-01	MM4A	Annulment or lapse of patent due to non-payment of fees

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TW550690B (en)	2003-09-01	Integrated endpoint detection system with optical and eddy current monitoring
US6930478B2 (en)	2005-08-16	Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
US6602724B2 (en)	2003-08-05	Chemical mechanical polishing of a metal layer with polishing rate monitoring
US6878038B2 (en)	2005-04-12	Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US20120276662A1 (en)	2012-11-01	Eddy current monitoring of metal features
CN110177649A (zh)	2019-08-27	基于沟槽深度的电磁感应监测进行的过抛光
US20120276817A1 (en)	2012-11-01	Eddy current monitoring of metal residue or metal pillars
EP1618991A1 (de)	2006-01-25	Verfahren und Vorrichtung zur "in-situ" Überwachung der Dicke während des chemisch-mechanischen Planiervorganges