511453 經濟部智慧財產局員工消費合作社印制衣 A7 B7 五、發明說明（1 ) 【發明領域】： 本發明係關於一種防電磁干擾裝置之製造方法，尤指 一種利用金屬粉末燒結方式形成之防電磁干擾裝置及其製 造方法。 【發明背景】： 近年由於工業技術不斷進步以及日常生活水準的提 高’促使電子、電機、資訊及通訊等電子產品發展遽增； 然而這些電子產品產生的高密度電磁波儼然形成一新的公 害問題。電磁輻射若無法有效隔離，將會引發電器設備間 之相互干擾，導致運作錯誤甚至失效，對於人體長期曝露 於電磁輻射環境下，亦可能造成生理上之危害。隨著產品 走向日益朝向小體積、高功能、低功率與低電位發展，電 磁輻射產生的問題更趨嚴重，防治電磁波干擾遂成為業界 面臨的極大挑戰。 一般電路設計對於200 MHz以上工作頻率之電磁波已 很難消除，為有效地避免電磁波干擾，通常針對電路設計 或以電磁屏蔽方式著手；其中，最直接的電磁波干擾防治 方法即係利用導電金屬外殼進行電磁遮蔽俾以完全阻隔電 子裝置本身散出或外界傳入之電磁輻射。以下遂針對多項 現行技術進行比較： 飯金成型之金屬外殼技術雖然具有最佳電磁屏蔽效 果’然具有形狀複雜不易製作、須再進行防蝕與塗漆處理 以及成品重量增加等問題；相對於鈑金成型金屬外殼，塑 膠優異的加工性使其具備精巧細緻的外觀特色，但塑膠本 I tiP 裝·— (請先閱讀背面之注意事項再填寫本頁) 訂------ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1 16277 511453 經濟>智產局員工消費合作社印製 A7 B7 五、發明說明（2 ) 身不導電而難以阻隔電磁波，為使塑膠外殼具有電磁屏蔽 作用’傳統方法係於外殼喷塗導電漆，然其塗層容易脫落 而易造成漏波或元件短路且需再施以二次加工（填孔、防 蝕及塗漆處理）；如係以塑膠外殼真空濺鍍金屬層或以金 屬填充塑膠射出成型，亦恐有加工治具設計不易以及成本 昂貴等困境有待克服。 目前業界開發出一種適用於如數據機（Modem)或行 動電話等無線傳輸器材之碎鐵薄板。當一電路板上完成電 路佈局後，須根據該電路設計之屏蔽區域開設適用的模 具，復以傳統沖壓方式（Stamping )將矽鐵薄板製成多個 尺寸不一的矽鐵板集波蓋，此等集波蓋係為頂部與四壁一 體成型之密封金屬蓋俾以作為隔絕電路運作時之電磁輻射 屏蔽；惟該等集波蓋的形狀、尺寸須配合電路板上不同電 子元件式樣設計組裝，每塊集波蓋尺寸不一且須逐一配合 相對的電路屏蔽區域對應組裝，此舉將明顯增加裝配作業 的複雜性；同時，裝配至印刷電路板後該等集波蓋接置部 位係形成 體密封結構，故當該處電路發生問題時，因 毀損之集波蓋無法復原而須將整塊電路板淘故，導致印刷 電路板製造成本大幅提昇且不符合經濟效益。 【發明概要】： 本發明之主要目的在提供一種避免不同電子元件間產 生電磁干擾（EMI )之防電磁干擾裝置及其製法。 本發明之另一主要目的係提供一種裝配簡易且可降低 裝配製程繁瑣性之防電磁干擾裝置及其製法。 — — — — — — — · I I I n ! I I ·11111!11 (請先閱讀背面之注意事項再填寫本頁)511453 Printed clothing A7 B7 of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) [Field of the Invention]: The present invention relates to a method for manufacturing an anti-electromagnetic interference device, and particularly to a protective method formed by sintering a metal powder. Electromagnetic interference device and manufacturing method thereof. [Background of the Invention]: In recent years, due to the continuous advancement of industrial technology and the improvement of the standard of daily life, the development of electronic products such as electronics, electrical machinery, information and communications has increased; however, the high-density electromagnetic waves generated by these electronic products have become a new problem of pollution. If electromagnetic radiation cannot be effectively isolated, it will cause mutual interference between electrical equipment, resulting in operational errors or even failure. It may also cause physiological harm to the human body exposed to electromagnetic radiation for a long time. With the development of products increasingly towards small size, high function, low power and low potential, the problems caused by electromagnetic radiation become more serious, and prevention of electromagnetic wave interference has become a great challenge facing the industry. In general circuit design, it is difficult to eliminate electromagnetic waves with a working frequency above 200 MHz. To effectively avoid electromagnetic wave interference, the circuit design or electromagnetic shielding is usually used. Among them, the most direct method for preventing and controlling electromagnetic interference is to use a conductive metal case. Electromagnetic shielding can completely block the electromagnetic radiation emitted by the electronic device itself or from the outside. The following is a comparison of a number of current technologies: Although the metal shell technology of Fanjin has the best electromagnetic shielding effect, it has problems such as complex shapes and difficult to manufacture, anti-corrosion and paint treatment, and increased weight of the finished product. Compared to sheet metal molding, The metal case and the excellent plasticity of plastic make it have a delicate and detailed appearance, but the plastic I tiP package · — (Please read the precautions on the back before filling this page) Order ------ This paper size applies to China National Standard (CNS) A4 Specification (210 X 297 mm) 1 16277 511453 Economy> Printed by the Intellectual Property Bureau Employee Cooperative Cooperative A7 B7 V. Description of the Invention (2) The body is not conductive and it is difficult to block electromagnetic waves. The traditional method of electromagnetic shielding is to spray conductive paint on the shell, but the coating is easy to fall off, which may cause leakage waves or short circuit of the component, and requires secondary processing (hole filling, corrosion prevention and painting treatment); Plastic shells are vacuum-sputtered with metal layers or metal-filled plastics are injection molded. There are also some difficulties that need to be overcome, such as the design of processing fixtures that are not easy and expensive. At present, the industry has developed a thin iron plate suitable for wireless transmission equipment such as modems or mobile phones. After the circuit layout is completed on a circuit board, an appropriate mold must be opened according to the shield area of the circuit design, and the ferrosilicon thin plate is made into multiple ferrosilicon plate wave collection covers of different sizes by traditional stamping. These wave collection covers are sealed metal covers with the top and four walls integrally formed to shield electromagnetic radiation during the operation of the isolated circuit; however, the shape and size of these wave collection covers must be designed and assembled with different electronic component designs on the circuit board. Each collection cover has different sizes and must be assembled correspondingly to the corresponding circuit shielding area one by one. This will significantly increase the complexity of the assembly operation. At the same time, the connection parts of the collection covers are formed after assembly to the printed circuit board. The body is sealed structure, so when a problem occurs in the circuit there, the entire circuit board must be panned because the damaged wave collecting cover cannot be restored, resulting in a significant increase in the manufacturing cost of the printed circuit board and it is not economically efficient. [Summary of the Invention]: The main object of the present invention is to provide an electromagnetic interference prevention device and a method for preventing the generation of electromagnetic interference (EMI) between different electronic components. Another main object of the present invention is to provide an anti-electromagnetic interference device and a manufacturing method thereof which can be easily assembled and reduce the complexity of the assembly process. — — — — — — — · I I I n! I I · 11111! 11 (Please read the notes on the back before filling out this page)
16277 51145316277 511453
本發明之再一目的係提供一種當印刷電路板上屏蔽之 電路發生局部損壞時得以重新修復使用而無須將整塊電路 (請先閱讀背面之注意事項再填寫本頁) 板淘汰，遂能有效地減省印刷電路板製作成本之防電磁 擾裝置及其製法。 鑒於上述及其他目的，本發明之防電磁干擾裝置製造 方法係包括：預先備妥一完成電路佈局並提供多數電子元 件佈設之印刷電路板；依據該印刷電路板上需要屏蔽之電 子元件個數繪擬一具有相對應個數開口之金屬框架；按該 金屬框架原型轉拓開模以形成一相對應模具，復進行粉末 燒結製作一金屬框架實物俾以焊接至該印刷電路板上；最 後以複數片金屬箔封閉該金屬框架開口，使得該印刷電路 板上形成多個電磁遮蔽空間故而形成一防電磁干擾裝置。 相較於習知組接式集波蓋之種種缺失，本發明之防電 磁干擾裝置係以純鐵、鐵磷、鐵鎳、鐵鈷、鐵矽混合物及 類似合金等金屬粉末燒結製得，遂能對於印刷電路板上不 同電子元件產生之電磁輻射提供屏蔽而免於電磁波 (EMI )干擾。 經濟部智慧財產局員工消費合作社印製 同時’該金屬框架原係按照印刷電路板上之電路佈局 完整轉拓模壓製得，因此僅須一次裝配至印刷電路板上無 須再行組接；另外，當電磁遮蔽區域内電路局部發生故障 時’只須撕除待修部位表面之金屬箔即可整修，修復完成 後更新金屬箔即能重新使用，除降低印刷電路板之製造成 本外，此項製程技術進行自動化安裝之可行性亦大為提 高0 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 3 16277 511453 經濟部智^^產局員工消費合作社印製 A7 B7 五、發明說明（4 ) 【圖式簡單說明】： 以下茲以較佳具體例配合所附圖式進一步詳述本發明 之特點及功效： 第1圖係為本發明防電磁干擾裝置安裝於印刷電路板 上之剖面示意圖； 第2圖係為本發明防電磁干擾裝置之金屬框架原型轉 拓前之上視示意圖； 第3圖係為用以本發明中金屬框架之模具上視透視 圖；以及， 第4圖係為本發明防電磁干擾裝置之金屬框架之立體 不意圖。 【發明詳細說明】： 參閱第1圖，本發明之防電磁干擾裝置丨係包含：一 印刷電路板18，其具有一提供多數電子元件11()舖設之 電路面180; —具有多數開口之金屬框架12，該框架12 係以開口 122容納對應電子元件i 1〇方式固設於該印刷電 路板18上；以及，複數片用以封閉金屬框架12開口 122 之金屬笛19。以下即配合圖式詳細說明本發明實施例， 惟此處各圖俱為簡化之圖式，僅以示意方式顯示出與本發 明有關之結構單it，其實際具體實施例之元㈣目與佈局 型態可能更形複雜。 首先，備妥一電路佈局完成之印刷電路板18，如第2 圖所示’該印刷電路板18 H藉由錢個不同電路圖 塊H (Circuitous Pattern)組合構成之電路面18〇以供多 n n i n i I ϋ n (ϋ i n I · I- - ϋ« nf - - I fn n f n If 15 — I am -I s I I (請先閲讀背面之注意事項再填寫‘本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 4 16277 經濟部智慧財產局員工消費合作社印製 511453 A7 一-—-~~-__— 五、發明說明（5 ) 數電子元件11〇(如内部電路（Internal Circuits)或被動 元件（Passive Components ))安置其上執行電訊傳遞工作； 根據該印刷電路板18之電路佈局繪製一用以屏蔽該等電 子το件110之金屬框架12，即得依該金屬框架12原型進 行實物製作。 按該金屬框架原型（未圖式）以j : i等比例轉拓開模 製作-適用模I !3。第3圖係指該模具之上視透視圖。、 如圖所不，於該模具13内進行添粉、壓密、燒結等粉末 冶金技術形成一金屬框架12實體；該模具製作及粉末冶 金技術倶屬習知，故不予重複贅述，惟形成該金屬框架Μ 之金屬粉末14係包括純鐵、鐵磷、鐵鎳、鐵鈷、鐵矽混 合物及類似合金等材質適用之。 第4圖係顯示金屬框架12之立體示意圖。如圖所示， 該金屬框架12具有一頂面120及一相對之底面121，且 該金屬框架12上依照該印刷電路板（未圖示）上需要屏 蔽之電子元件110個數對應而開設有複數個開口 122 ;框 架設計式樣係完全符合該印刷電路板之電路佈局。如第j 圖所示，成型完成之金屬框架12得藉其底面121穩固焊 接於該印刷電路板18之電路面180上，再將多數略大於 該框架12開口 122之金屬箔19 (如鋼箔、鋁箔等）以其 周邊貼接於開口 口緣方式貼封至該金屬框架12頂面120， 即能於該印刷電路板1 8上形成多個電磁輻射的遮蔽空間 而構成一防電磁干擾裝置1。 本發明之該金屬框架12係依欲遮蔽電路之佈局態樣等 , -----» ! I ! ^ ----- (請先閱讀背面之注意事項再填寫本頁) '華· 本紙張尺度適用中國國家標準（CNS)A4規格⑵0 x 297公爱） 5 16277 511453 經濟>智慧％產局員工消費合作社印製 A7 五、發明說明（6 ) 比例模製形成，故裝配該框架i 2至印刷電路板丨8時無須 拼裝，簡化裝配之製程複雜性；同時，如欲整修電礤 遮蔽區域之電路時，僅須撕除待修部位表面之金屬箱ο 即可檢修，相較於傳統無法修復逕行棄置方式，本發明得 大幅降低印刷電路板18之製造成本。 以上所述僅為本發明之較佳實施例而已，並非用以限 定本發明之實質技術内容範圍。本發明之實質技術内容係 廣義地定義於下述之申請專利範圍t，任何他Λ完成之技 術實體或方法，若與下述之申請專利範圍所定義者係完全 相同或為一種等效之變更，均將視為涵蓋於此專利範圍 中0 • ammt He n n ·ϋ ϋ §9 n Al·— n ·ϋ I n· n nv n tmm§ n 訂i —δ n n I SI I --vtt先閱讀背面之注意事項再填寫本頁) 【符號標號說明】： I 防電磁干擾裝置 II 電路圖塊 no 電子元件 12 金屬框架 120 框架頂面 121 框架底面 122 框架開口 13 模具 14 金屬粉末 18 印刷電路板 180 電路面 19 金屬箔 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 6 16277Yet another object of the present invention is to provide a circuit that can be repaired and re-used when the shielded circuit on the printed circuit board is partially damaged without having to eliminate the entire circuit (please read the precautions on the back before filling out this page). The board can be effective. The electromagnetic interference prevention device and method for reducing printed circuit board manufacturing cost. In view of the above and other objectives, the manufacturing method of the anti-electromagnetic interference device of the present invention includes: preparing a printed circuit board that completes the circuit layout in advance and provides the layout of most electronic components; drawing according to the number of electronic components that need to be shielded on the printed circuit board A metal frame with a corresponding number of openings is proposed; the mold is opened and opened to form a corresponding mold according to the metal frame prototype, and powder sintering is performed to make a metal frame physical body to be soldered to the printed circuit board; A sheet of metal foil closes the opening of the metal frame, so that a plurality of electromagnetic shielding spaces are formed on the printed circuit board, thereby forming an electromagnetic interference prevention device. Compared with the various defects of the conventional assembling wave collecting cover, the electromagnetic interference prevention device of the present invention is made by sintering metal powders such as pure iron, iron phosphorus, iron nickel, iron cobalt, iron-silicon mixture, and similar alloys. Provide shielding for electromagnetic radiation generated by different electronic components on printed circuit boards from electromagnetic wave (EMI) interference. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. At the same time, the metal frame was originally pressed in accordance with the circuit layout of the printed circuit board. Therefore, it only needs to be assembled to the printed circuit board at one time and no further assembly is required. When the circuit in the electromagnetic shielding area has a local failure, it can be repaired by only removing the metal foil on the surface of the part to be repaired. After the repair is completed, the metal foil can be reused after renewal. In addition to reducing the manufacturing cost of the printed circuit board, this process The feasibility of automated installation by technology is also greatly improved. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 3 16277 511453 Ministry of Economic Affairs ^^ Production Bureau employee consumer cooperative printed A7 B7 V. Description of the invention (4) [Brief description of the drawings]: The following is a detailed description of the features and effects of the present invention with better specific examples in conjunction with the attached drawings: Figure 1 shows the anti-electromagnetic interference device of the present invention installed on a printed circuit board Figure 2 is a schematic top view; Figure 2 is a schematic top view before the metal frame prototype of the anti-electromagnetic interference device of the present invention is transferred; Figure 3 is for In the present invention, perspective view of an upper mold of the metal frame; and, FIG. 4 of the present invention based anti perspective view of the metal frame of the apparatus is not intended to electromagnetic interference. [Detailed description of the invention]: Referring to FIG. 1, the anti-electromagnetic interference device of the present invention includes: a printed circuit board 18 having a circuit surface 180 for providing a plurality of electronic components 11 ();-a metal having a plurality of openings The frame 12 is fixed on the printed circuit board 18 with the opening 122 accommodating the corresponding electronic component i 10; and a plurality of metal flutes 19 are used to close the opening 122 of the metal frame 12. The following is a detailed description of the embodiments of the present invention in conjunction with the drawings, but the drawings here are simplified diagrams, and the structure sheet it related to the present invention is shown in a schematic manner only, and the elements and layout of the actual specific embodiment The pattern may be more complex. First, prepare a printed circuit board 18 with a completed circuit layout, as shown in FIG. 2 'The printed circuit board 18 H is composed of a circuit surface 18 formed by a combination of different circuit blocks H (Circuitous Pattern) for multi-nnini I ϋ n (ϋ in I · I--ϋ «nf--I fn nfn If 15 — I am -I s II (Please read the precautions on the back before filling in this page) This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) 4 16277 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 511453 A7 A ---- ~~ -__- V. Description of the invention (5) Number of electronic components 11 (such as internal circuit (Internal Circuits) or Passive Components (Passive Components) are placed on it to perform telecommunications transmission work; according to the circuit layout of the printed circuit board 18, draw a metal frame 12 to shield the electronic το pieces 110, according to the metal The prototype of frame 12 is made in kind. According to the prototype of the metal frame (not shown), the mold is made at an equal proportion of j: i-applicable mold I! 3. Figure 3 refers to the perspective view of the mold. As shown in the figure, powder is added in the mold 13 Powder metallurgy technologies such as compaction and sintering form a metal frame 12 entity; the mold making and powder metallurgy technology are familiar and will not be repeated here, but the metal powder 14 forming the metal frame M includes pure iron and iron phosphorus , Iron-nickel, iron-cobalt, iron-silicon mixture, and similar alloys are suitable. Figure 4 shows a three-dimensional schematic view of the metal frame 12. As shown in the figure, the metal frame 12 has a top surface 120 and an opposite bottom surface 121. And, the metal frame 12 is provided with a plurality of openings 122 corresponding to the number of 110 electronic components that need to be shielded on the printed circuit board (not shown); the frame design pattern is fully consistent with the circuit layout of the printed circuit board. As shown in Fig. J, the formed metal frame 12 can be firmly welded to the circuit surface 180 of the printed circuit board 18 by its bottom surface 121, and then most of the metal foil 19 (such as steel foil, Aluminum foil, etc.) is adhered to the top surface 120 of the metal frame 12 with its periphery attached to the opening edge, that is, a plurality of shielding spaces for electromagnetic radiation can be formed on the printed circuit board 18 Anti-electromagnetic interference device 1. The metal frame 12 of the present invention is to cover the layout of the circuit as desired, ----- »! I! ^ ----- (Please read the precautions on the back before filling in this Page) 'Hua · This paper size applies Chinese National Standard (CNS) A4 specifications (0 x 297 public love) 5 16277 511453 Economy > Wisdom% Production Bureau employee consumer cooperative printed A7 5. Description of invention (6) Proportional molding Therefore, it is not necessary to assemble the frame i 2 to the printed circuit board 丨 8 when assembling the frame, simplifying the complexity of the assembly process; at the same time, if you want to repair the circuit of the electric shielded area, you only need to remove the metal box on the surface of the part to be repaired. It can be repaired. Compared with the traditional method of incapable repair and disposal, the present invention can significantly reduce the manufacturing cost of the printed circuit board 18. The above descriptions are merely preferred embodiments of the present invention, and are not intended to limit the essential technical content of the present invention. The essential technical content of the present invention is broadly defined in the following patent application scope t. Any technical entity or method completed by him is the same or an equivalent change as defined in the patent application scope described below. Will be deemed to be covered by this patent. Note on the back, please fill in this page again.) [Symbols and symbols description]: I Anti-electromagnetic interference device II Circuit block no Electronic component 12 Metal frame 120 Frame top surface 121 Frame bottom surface 122 Frame opening 13 Mold 14 Metal powder 18 Printed circuit board 180 Circuit Face 19 Metal foil This paper is sized for China National Standard (CNS) A4 (210 X 297 mm) 6 16277