TW511891U - A heat dissipating device - Google Patents

A heat dissipating device

Info

Publication number
TW511891U
TW511891U TW091202950U TW91202950U TW511891U TW 511891 U TW511891 U TW 511891U TW 091202950 U TW091202950 U TW 091202950U TW 91202950 U TW91202950 U TW 91202950U TW 511891 U TW511891 U TW 511891U
Authority
TW
Taiwan
Prior art keywords
pipes
base
heat
holes
working liquid
Prior art date
Application number
TW091202950U
Other languages
English (en)
Inventor
Jen-Tian Lai
Tzung-Lung Li
Sheng-Hua Wang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091202950U priority Critical patent/TW511891U/zh
Priority to US10/174,770 priority patent/US6808013B2/en
Publication of TW511891U publication Critical patent/TW511891U/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW091202950U 2002-03-13 2002-03-13 A heat dissipating device TW511891U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091202950U TW511891U (en) 2002-03-13 2002-03-13 A heat dissipating device
US10/174,770 US6808013B2 (en) 2002-03-13 2002-06-18 Heat dissipation device with working liquid received in circulatory route

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091202950U TW511891U (en) 2002-03-13 2002-03-13 A heat dissipating device

Publications (1)

Publication Number Publication Date
TW511891U true TW511891U (en) 2002-11-21

Family

ID=27731962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091202950U TW511891U (en) 2002-03-13 2002-03-13 A heat dissipating device

Country Status (2)

Country Link
US (1) US6808013B2 (zh)
TW (1) TW511891U (zh)

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TWM244509U (en) * 2003-07-16 2004-09-21 Hon Hai Prec Ind Co Ltd A heat pipe radiator
TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
US6796373B1 (en) * 2003-08-27 2004-09-28 Inventec Corporation Heat sink module
CN2657082Y (zh) * 2003-10-18 2004-11-17 鸿富锦精密工业（深圳）有限公司 热管散热装置
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US7059391B2 (en) * 2004-04-09 2006-06-13 Aavid Thermalloy, Inc. Multiple evaporator heat pipe assisted heat sink
CN2696124Y (zh) * 2004-04-22 2005-04-27 鸿富锦精密工业（深圳）有限公司 散热装置
ITMI20041652A1 (it) * 2004-08-13 2004-11-13 Bosari Thermal Man S R L Scambiatore di calore e metodo per produrlo
CN2727959Y (zh) * 2004-08-14 2005-09-21 鸿富锦精密工业（深圳）有限公司 散热器
US6978829B1 (en) * 2004-09-24 2005-12-27 Asia Vital Component Co., Ltd. Radiator assembly
TWM267825U (en) * 2004-11-03 2005-06-11 Forward Electronics Co Ltd Improved heat sink structure of liquid-cooling type heat sink device
US6963488B1 (en) * 2004-11-22 2005-11-08 Chin-Ping Chen Device to convey the cool air from an air-conditioner into a computer
TWI251656B (en) * 2004-12-03 2006-03-21 Hon Hai Prec Ind Co Ltd Boiling chamber cooling device
US20060180297A1 (en) * 2005-02-14 2006-08-17 Hung-Tao Peng Conductor pipe of a temperature conductor
US20060207747A1 (en) * 2005-03-18 2006-09-21 Cpumate Inc. Isothermal plate heat-dissipating device
US20060254754A1 (en) * 2005-05-11 2006-11-16 Jian-Dih Jeng Panel-type radiating system
CN100395684C (zh) * 2005-07-02 2008-06-18 富准精密工业(深圳)有限公司 环路式散热模组
US20070102146A1 (en) * 2005-09-07 2007-05-10 Coolit Systems Inc. Cooling device for electronic components
US20070095509A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation having a heat pipe
US7487825B2 (en) * 2006-10-31 2009-02-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
US7719839B2 (en) * 2007-02-19 2010-05-18 Dell Products L.P. Heat conduction apparatus providing for selective configuration for heat conduction
US7556088B2 (en) * 2007-03-30 2009-07-07 Coolit Systems, Inc. Thermosiphon for laptop computer
US7764504B2 (en) * 2007-05-16 2010-07-27 Tyco Electronics Corporation Heat transfer system for a receptacle assembly
US7548426B2 (en) * 2007-06-22 2009-06-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7443677B1 (en) * 2007-07-12 2008-10-28 Fu Zhun Industry (Shen Zhen) Co., Ltd. Heat dissipation device
EP2198681A4 (en) * 2007-10-08 2017-05-03 Zaonzi Co., Ltd Heat dissipating device using heat pipe
CN101616567B (zh) * 2008-06-25 2011-06-08 富准精密工业(深圳)有限公司 散热装置
CN102056457B (zh) * 2009-10-30 2014-01-22 鸿富锦精密工业（深圳）有限公司 水冷式散热装置
US9341418B2 (en) * 2013-03-01 2016-05-17 International Business Machines Corporation Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
USD749713S1 (en) 2014-07-31 2016-02-16 Innovative Medical Equipment, Llc Heat exchanger
CN107461327B (zh) * 2017-09-26 2023-06-16 科比传动技术（上海）有限公司 进气机构及具有该进气机构的水泵一体机
TWI685638B (zh) * 2018-09-14 2020-02-21 財團法人工業技術研究院 立體脈衝式熱管、立體脈衝式熱管組和散熱模組
TW202217214A (zh) * 2020-10-19 2022-05-01 財團法人工業技術研究院 立體脈衝式熱管
CN116437624A (zh) * 2022-01-11 2023-07-14 开利公司 机械封壳

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Also Published As

Publication number Publication date
US20030173061A1 (en) 2003-09-18
US6808013B2 (en) 2004-10-26

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees