TWI274163B - Prober - Google Patents

Prober Download PDF

Info

Publication number
TWI274163B
TWI274163B TW091137043A TW91137043A TWI274163B TW I274163 B TWI274163 B TW I274163B TW 091137043 A TW091137043 A TW 091137043A TW 91137043 A TW91137043 A TW 91137043A TW I274163 B TWI274163 B TW I274163B
Authority
TW
Taiwan
Prior art keywords
probe
probe device
conversion element
disposed
group
Prior art date
Application number
TW091137043A
Other languages
English (en)
Chinese (zh)
Other versions
TW200302352A (en
Inventor
Masato Kobayashi
Haruhiko Yoshioka
Takafumi Fujita
Original Assignee
Tokyo Electron Ltd
Takafumi Fujita
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Takafumi Fujita filed Critical Tokyo Electron Ltd
Publication of TW200302352A publication Critical patent/TW200302352A/zh
Application granted granted Critical
Publication of TWI274163B publication Critical patent/TWI274163B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Vibration Prevention Devices (AREA)
TW091137043A 2002-01-30 2002-12-23 Prober TWI274163B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002021048A JP2003222654A (ja) 2002-01-30 2002-01-30 プローブ装置

Publications (2)

Publication Number Publication Date
TW200302352A TW200302352A (en) 2003-08-01
TWI274163B true TWI274163B (en) 2007-02-21

Family

ID=27654380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091137043A TWI274163B (en) 2002-01-30 2002-12-23 Prober

Country Status (5)

Country Link
US (1) US6933736B2 (2)
JP (1) JP2003222654A (2)
KR (1) KR100597227B1 (2)
TW (1) TWI274163B (2)
WO (1) WO2003065441A1 (2)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
EP1509776A4 (en) 2002-05-23 2010-08-18 Cascade Microtech Inc PROBE TO TEST ANY TESTING EQUIPMENT
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
JP4797341B2 (ja) * 2004-07-12 2011-10-19 トヨタ自動車株式会社 圧電素子と電気装置が重合された圧電式振動抑制装置
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7265534B2 (en) * 2004-10-20 2007-09-04 Freescale Semiconductor, Inc. Test system for device characterization
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (ja) 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
JP2007227899A (ja) * 2006-01-13 2007-09-06 King Yuan Electronics Co Ltd Ｚｉｆコネクタつきプローブカード、その組立方法、ウェハテストシステム、及びそれを導入したウェハテスト方法
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
WO2008050518A1 (en) * 2006-10-20 2008-05-02 Panasonic Corporation Prober device
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP7561662B2 (ja) * 2021-03-12 2024-10-04 レーザーテック株式会社 検査装置及び振動抑制方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
JPH05149379A (ja) 1991-11-29 1993-06-15 Takenaka Komuten Co Ltd アクテイブ除振装置
JPH0669321A (ja) 1992-08-19 1994-03-11 Tokyo Electron Yamanashi Kk プローブ装置
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
JPH1082204A (ja) 1996-09-10 1998-03-31 Mitsubishi Steel Mfg Co Ltd 摩擦力制御型制振装置
US5814733A (en) * 1996-09-12 1998-09-29 Motorola, Inc. Method of characterizing dynamics of a workpiece handling system
JPH11304837A (ja) 1998-04-27 1999-11-05 Yokogawa Electric Corp プローブ装置
JP4588816B2 (ja) 1999-06-15 2010-12-01 特許機器株式会社 圧電制振ユニットおよびこれを用いた制振構造
DE19952943C2 (de) * 1999-11-03 2003-07-03 Infineon Technologies Ag Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte

Also Published As

Publication number Publication date
KR20040020973A (ko) 2004-03-09
US6933736B2 (en) 2005-08-23
JP2003222654A (ja) 2003-08-08
TW200302352A (en) 2003-08-01
WO2003065441A1 (en) 2003-08-07
US20040164759A1 (en) 2004-08-26
KR100597227B1 (ko) 2006-07-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees