TWI284397B - Carrier substrate for electronic components - Google Patents

Carrier substrate for electronic components Download PDF

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Publication number
TWI284397B
TWI284397B TW090109376A TW90109376A TWI284397B TW I284397 B TWI284397 B TW I284397B TW 090109376 A TW090109376 A TW 090109376A TW 90109376 A TW90109376 A TW 90109376A TW I284397 B TWI284397 B TW I284397B
Authority
TW
Taiwan
Prior art keywords
transparent
substrate
light
conductive layer
carrier substrate
Prior art date
Application number
TW090109376A
Other languages
English (en)
Inventor
Thomas Zenker
Christian Thiemann
Original Assignee
Thomas Zenker
Thieman Christian
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7639642&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI284397(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Thomas Zenker, Thieman Christian filed Critical Thomas Zenker
Application granted granted Critical
Publication of TWI284397B publication Critical patent/TWI284397B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Surface Treatment Of Glass (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

ϋ申Μ專利祀圍第4項之發光二極體模組元件，其中’ 導電層係由一或多種下述金屬構成：
Al、Ag、Au、Ni、Cr。 6泰=μ專利範圍第1項之發光二極體模組元件，其中’ 透明基板(1)係一玻璃或塑膠基板。 L申Λ專她圍第6項之發光二極體模組錯，其中， 玻璃基板被硬化及/或具有預應力。 8“如:請專利範圍第6項之發光二極體模組元件，其中， 玻璃或塑膠基板具有任意輪廓。 9士如申請專利麵第6項之發光二極體模組元件，其中， 玻璃或塑膠基板有裝飾印刷。 ^申請專纖㈣1項之贱二極義組元件，其中， 導電層具有由導電漿料或塗料構成的連接位置。 H申料纖料1項之發光二極職祕件，其中， ，發光二極體模組树具有—任意三度空間形狀。 ϋ料娜圍第1項之發光二減觀元件，其中， 導電層具有圖案。 13.如申明專她圍第i項之發光二極體模組元件其中’ Ί 明基板係由—導電透明或似透明層或薄膜構成。 •明專利fc圍第1項之發光二極體模組元件，其中， =，二極職組元件係衫個裝設有發光二減(lED)之 承戟基板構成。 I5. -種製造發光二極體模组元件的方法，其包括下述步驟： 透明或似透明導電層之透明基板上裝設發光 輪係-氟^係一石灰納玻璃’透明或似透明 1284397 使發光二極體(LED)與導電層導電連接。 16. 如申請專利範圍第15項之方法，其中，基板在塗佈透明 或似透明導電層之前可以任意三度空間成形，尤其是彎曲。 17. 如申請專利範圍第15項之方法，其中’透明或似透明導 電層係噴塗在透明基板上。 18. 如申請專利範圍第15項之方法，其中，透明或似透明導 電層可以雷射使其中斷而形成圖案。 19. 如申請專利範圍第15項之方法，其中，導電層上設置連 接位置或各向同性導電黏合劑以連接發光二極體(LED)。 20. 如申請專利範圍第19項之方法，其中，以網版印刷或模 版印刷設置由一導電漿料或塗料構成的連接位置，並接著燒 入透明基板’而同時使透明基板獲得一預應力。 21. 如申請專利範圍第15項之方法，其中，在導電層上設置 連接位置，以焊接方法將發光二極體(LED)固定於連接位置 (9)，而使其與導電層導電連接。 22. 如申請專利範圍第15項之方法，其中，其他透明基板設 置在承載基板上方之發光二歸(LED)上。
TW090109376A 2000-04-20 2001-04-19 Carrier substrate for electronic components TWI284397B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10019888A DE10019888B4 (de) 2000-04-20 2000-04-20 Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
TWI284397B true TWI284397B (en) 2007-07-21

Family

ID=7639642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090109376A TWI284397B (en) 2000-04-20 2001-04-19 Carrier substrate for electronic components

Country Status (8)

Country Link
EP (4) EP1947694A1 (zh)
AT (2) ATE360891T1 (zh)
AU (1) AU2001252218A1 (zh)
DE (5) DE10019888B4 (zh)
ES (2) ES2282758T3 (zh)
MY (1) MY143357A (zh)
TW (1) TWI284397B (zh)
WO (1) WO2001082378A1 (zh)

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DE202005020315U1 (de) 2005-12-15 2006-02-16 Döppner Bauelemente GmbH & Co. KG Elektrischer Sockelanschluss
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DE102009017659A1 (de) 2009-04-16 2010-10-28 Schott Ag Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat
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BE1019185A3 (fr) * 2010-02-16 2012-04-03 Agc Glass Europe Panneau a motif conducteur ameliore.
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DE102015111573A1 (de) 2015-07-16 2017-01-19 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
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Also Published As

Publication number Publication date
WO2001082378A1 (de) 2001-11-01
AU2001252218A1 (en) 2001-11-07
ES2282758T3 (es) 2007-10-16
DE20122195U1 (de) 2004-09-23
EP1275153B1 (de) 2009-01-14
EP1450416B1 (de) 2007-04-25
ES2320096T3 (es) 2009-05-19
ES2320096T5 (es) 2012-04-24
DE20122323U1 (de) 2005-04-14
DE50114659D1 (de) 2009-03-05
EP1947694A1 (de) 2008-07-23
EP1275153B2 (de) 2012-02-08
ATE421168T1 (de) 2009-01-15
MY143357A (en) 2011-04-29
DE10019888A1 (de) 2001-10-31
DE50112414D1 (de) 2007-06-06
EP1450416A1 (de) 2004-08-25
ATE360891T1 (de) 2007-05-15
EP2009965A1 (de) 2008-12-31
DE10019888B4 (de) 2011-06-16
EP1275153A1 (de) 2003-01-15

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