ATE546836T1 - Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug - Google Patents

Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug

Info

Publication number
ATE546836T1
ATE546836T1 AT05425254T AT05425254T ATE546836T1 AT E546836 T1 ATE546836 T1 AT E546836T1 AT 05425254 T AT05425254 T AT 05425254T AT 05425254 T AT05425254 T AT 05425254T AT E546836 T1 ATE546836 T1 AT E546836T1
Authority
AT
Austria
Prior art keywords
underlayer
conductive paths
chip
display device
motor vehicle
Prior art date
Application number
AT05425254T
Other languages
English (en)
Inventor
Piermario Repetto
Sabino Sinesi
Sara Padovani
Stefano Bernard
Denis Bollea
Davide Capello
A Pairetti
M Antonipieri
Original Assignee
Fiat Ricerche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche filed Critical Fiat Ricerche
Application granted granted Critical
Publication of ATE546836T1 publication Critical patent/ATE546836T1/de

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F21/00Mobile visual advertising
    • G09F21/04Mobile visual advertising by land vehicles
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
AT05425254T 2005-04-21 2005-04-21 Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug ATE546836T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05425254A EP1715521B1 (de) 2005-04-21 2005-04-21 Anwendung einer transparenten Leuchtdiodenanzeigevorrichtung in einem Kraftfahrzeug

Publications (1)

Publication Number Publication Date
ATE546836T1 true ATE546836T1 (de) 2012-03-15

Family

ID=35355217

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05425254T ATE546836T1 (de) 2005-04-21 2005-04-21 Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug

Country Status (5)

Country Link
US (1) US8283680B2 (de)
EP (1) EP1715521B1 (de)
JP (1) JP2006303509A (de)
CN (1) CN100530579C (de)
AT (1) ATE546836T1 (de)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE393374T1 (de) 2006-02-15 2008-05-15 Fiat Ricerche Leuchtanzeige für automobil-satelliten- navigationssysteme
DE112007001950T5 (de) 2006-08-21 2009-07-02 Innotec Corporation, Zeeland Elektrische Vorrichtung mit platinenloser Montageanordnung für elektrische Komponenten
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
EP1956580A1 (de) * 2006-12-18 2008-08-13 AGC Flat Glass Europe SA Anzeigetafel
EP1947693B1 (de) * 2007-01-18 2015-03-25 Polytron Technologies, Inc. Flächenstruktur einer Leuchtdioden-Beleuchtungsvorrichtung
US7712933B2 (en) 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
USD576968S1 (en) * 2007-03-29 2008-09-16 Luminus Devices, Inc. LED package
USD603352S1 (en) * 2007-03-29 2009-11-03 Luminus Devices, Inc. LED package
USD617289S1 (en) * 2007-03-29 2010-06-08 Luminus Devices, Inc. LED package
USD574337S1 (en) * 2007-03-29 2008-08-05 Luminus Devices, Inc. LED package
US20100181590A1 (en) * 2007-06-25 2010-07-22 Jen-Shyan Chen Light-emitting diode illuminating apparatus
WO2009028689A1 (ja) * 2007-08-30 2009-03-05 Kyocera Corporation 発光装置
EP2232592B1 (de) 2007-12-12 2013-07-17 Innotec Corporation Verfahren zum umspritzen einer leiterplatte
US7815339B2 (en) 2008-01-09 2010-10-19 Innotec Corporation Light module
DE202008017988U1 (de) * 2008-05-26 2011-02-10 C.R.F. Società Consortile per Azioni, Orbassano Transparente Anzeigevorrichtung mit Leiterbahnen, die mit undurchsichtiger Beschichtung versehen sind
FR2932307B1 (fr) * 2008-06-09 2011-10-28 Citiled Dispositif d'affichage d'une image video sur un edifice
AT507734A1 (de) * 2008-12-16 2010-07-15 Swarovski & Co Transparenter körper
USD619975S1 (en) * 2009-04-08 2010-07-20 Nichia Corporation Light emitting diode module
USD624889S1 (en) * 2009-10-09 2010-10-05 Toshiba Lighting & Technology Corporation Light emitting diode module
USD624888S1 (en) * 2009-10-09 2010-10-05 Toshiba Lighting & Technology Corporation Light emitting diode module
FR2953633B1 (fr) * 2009-12-08 2015-12-11 Citiled Element notamment pour facade comprenant une vitre et des diodes electroluminescentes
FR2953632B1 (fr) * 2009-12-08 2015-12-11 Citiled Element d'affichage a diodes electroluminescentes comprenant des moyens de connexion
FR2953631B1 (fr) * 2009-12-08 2012-02-24 Citiled Dispositif d'affichage d'une image video sur un edifice muni de plusieurs vitres
JP2011211047A (ja) * 2010-03-30 2011-10-20 Sharp Corp 表示装置、表示装置の製造方法および表示装置の駆動方法
US9329433B2 (en) 2010-03-12 2016-05-03 Sharp Kabushiki Kaisha Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
KR101163646B1 (ko) * 2010-05-06 2012-07-09 순천대학교 산학협력단 Led 모듈을 위한 어드레스 전극라인 및 제조방법
AT510824B1 (de) * 2010-11-23 2016-05-15 Swarco Futurit Verkehrssignalsysteme Ges M B H Farbmischende sammeloptik
US8417376B1 (en) * 2011-01-28 2013-04-09 Christopher M. Smolen Method and means for viewing selecting and taking action relative to an item of a group of items
CN102130283B (zh) * 2011-02-22 2012-07-18 史杰 Led芯片封装支架
CN102867818A (zh) * 2011-07-08 2013-01-09 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
TW201320412A (zh) * 2011-11-14 2013-05-16 長榮光電股份有限公司 發光二極體封裝
TWI526888B (zh) * 2011-12-20 2016-03-21 友達光電股份有限公司 自動販賣機及其操作系統與操作方法
US10621809B2 (en) 2012-01-19 2020-04-14 Christopher M. Smolen Digital currency enabled vending machine
DE112013002944T5 (de) 2012-06-13 2015-02-19 Innotec, Corp. Flexibler Hohllichtleiter
KR101188747B1 (ko) * 2012-07-18 2012-10-10 지스마트 주식회사 투명전광판 및 그 제조방법
KR101452768B1 (ko) 2012-08-21 2014-10-21 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
CN102927482A (zh) * 2012-11-20 2013-02-13 田茂福 一体化led照明组件
CN102927483A (zh) * 2012-11-20 2013-02-13 田茂福 一体化倒装型led照明组件
KR101984897B1 (ko) 2012-12-10 2019-06-03 삼성디스플레이 주식회사 발광 다이오드 패키지 및 그 제조 방법
CN103456729B (zh) * 2013-07-26 2016-09-21 利亚德光电股份有限公司 发光二极管显示屏
CN108305567A (zh) * 2014-01-20 2018-07-20 蒋伟东 可叠加拼接进行升级的有机透明光电面板及其应用方法
CN103855281A (zh) * 2014-01-26 2014-06-11 上海瑞丰光电子有限公司 一种led及其制备方法
CN106784234B (zh) * 2015-11-24 2018-09-28 扬升照明股份有限公司 光学模组以及光源
US10412800B1 (en) * 2016-04-07 2019-09-10 Christopher S. Beattie Vehicle LED display system
WO2017195295A1 (ja) * 2016-05-11 2017-11-16 パイオニア株式会社 発光システム及び発光装置を基材に取り付ける方法
TWI640109B (zh) * 2016-08-11 2018-11-01 億光電子工業股份有限公司 顯示裝置
CN107195624B (zh) * 2017-05-10 2023-09-15 佛山市国星光电股份有限公司 一种小间距led器件及其封装方法和由其制造的显示屏
CN107608075A (zh) * 2017-08-28 2018-01-19 陈超平 一种基于视网膜投影的近眼显示装置
US10340308B1 (en) 2017-12-22 2019-07-02 X Development Llc Device with multiple vertically separated terminals and methods for making the same
CN108258103B (zh) * 2018-03-16 2024-06-18 宁波升谱光电股份有限公司 一种多色温cob光源及其封装方法
JP2019168622A (ja) * 2018-03-26 2019-10-03 スタンレー電気株式会社 視線誘導シート、視線誘導システム、車両用照明装置、および、車両
CN109360501B (zh) * 2018-07-05 2024-08-02 深圳市格尔通信技术有限公司 立体矩阵灯装置
CN110853527A (zh) * 2018-08-01 2020-02-28 深圳Tcl新技术有限公司 一种透明led显示设备及其制造方法
WO2020196134A1 (ja) * 2019-03-22 2020-10-01 Agc株式会社 透明表示装置、透明表示装置付きガラス板、透明表示装置付き合わせガラス、及び移動体

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929809C2 (de) * 1978-07-25 1984-12-06 Sanyo Electric Co., Ltd., Moriguchi, Osaka Anzeigeeinrichtung
US5436535A (en) * 1992-12-29 1995-07-25 Yang; Tai-Her Multi-color display unit
JP4145366B2 (ja) * 1994-04-28 2008-09-03 ゼロックス コーポレイション 薄膜トランジスタ装置及び薄膜トランジスタ構造形成方法
JP2994219B2 (ja) * 1994-05-24 1999-12-27 シャープ株式会社 半導体デバイスの製造方法
JP3235949B2 (ja) * 1995-06-19 2001-12-04 エムケー精工株式会社 表示装置
JP3703591B2 (ja) * 1997-01-31 2005-10-05 松下電器産業株式会社 光電子装置
JPH10294498A (ja) * 1997-04-18 1998-11-04 Stanley Electric Co Ltd Led表示器の製造方法
JP3505985B2 (ja) * 1997-11-25 2004-03-15 松下電工株式会社 Led照明モジュール
JP4062640B2 (ja) * 1998-02-25 2008-03-19 スタンレー電気株式会社 Led表示装置
JP2000135814A (ja) * 1998-10-30 2000-05-16 Kyocera Corp 光プリンタヘッド
US6448900B1 (en) * 1999-10-14 2002-09-10 Jong Chen Easy-to-assembly LED display for any graphics and text
DE10019443A1 (de) * 2000-04-19 2001-10-31 Texas Instruments Deutschland Vorrichtung zum Befestigen eines Halbleiter-Chips auf einem Chip-Träger
DE10019888B4 (de) * 2000-04-20 2011-06-16 Schott Ag Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung
US6486561B1 (en) * 2000-09-12 2002-11-26 Luminary Logic, Ltd. Semiconductor light emitting element formed on a clear or translucent substrate
US6998281B2 (en) * 2000-10-12 2006-02-14 General Electric Company Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics
JP2002205268A (ja) * 2001-01-10 2002-07-23 Sharp Corp 薄膜除去方法および薄膜除去装置
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP4945865B2 (ja) * 2001-08-27 2012-06-06 ソニー株式会社 多層配線構造又は電極取り出し構造、電気回路装置、及びこれらの製造方法
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
FR2833719B1 (fr) * 2001-12-13 2004-02-20 Valeo Vision Procede de correction d'image pour un projecteur d'images tete haute, et dispositif mettant en oeuvre le procede
JP4567941B2 (ja) * 2001-12-28 2010-10-27 株式会社半導体エネルギー研究所 半導体装置の作製方法及び表示装置の作製方法
JP2003209293A (ja) * 2002-01-17 2003-07-25 Stanley Electric Co Ltd 発光ダイオード
JP2003332632A (ja) * 2002-05-16 2003-11-21 Sony Corp 素子アレイ装置及び素子アレイ装置の製造方法
EP1420462A1 (de) * 2002-11-13 2004-05-19 Heptagon Oy Lichtemittierende Vorrichtung
JP4561056B2 (ja) * 2003-07-17 2010-10-13 ソニー株式会社 光源装置の製造方法
JP4316960B2 (ja) * 2003-08-22 2009-08-19 株式会社半導体エネルギー研究所 装置
JP2005072479A (ja) * 2003-08-27 2005-03-17 Sumitomo Electric Ind Ltd 白色発光素子、蛍光体およびその製造方法
JP2005109212A (ja) * 2003-09-30 2005-04-21 Stanley Electric Co Ltd 半導体発光装置
DE602005019384D1 (de) * 2005-04-21 2010-04-01 Fiat Ricerche Durchsichtige LED-Anzeigevorrichtung
EP1715523B1 (de) * 2005-04-21 2012-03-14 C.R.F. Società Consortile per Azioni Durchsichtige Head-up-LED-Anzeigevorrichtung

Also Published As

Publication number Publication date
EP1715521A1 (de) 2006-10-25
EP1715521B1 (de) 2012-02-22
CN1855407A (zh) 2006-11-01
US8283680B2 (en) 2012-10-09
CN100530579C (zh) 2009-08-19
JP2006303509A (ja) 2006-11-02
US20060239037A1 (en) 2006-10-26

Similar Documents

Publication Publication Date Title
ATE546836T1 (de) Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug
US9461027B2 (en) LED package and manufacturing method
DE602005019384D1 (de) Durchsichtige LED-Anzeigevorrichtung
CN104521324B (zh) Led电路
TW200610191A (en) Semiconductor light emitting device with flexible substrate
TW200737536A (en) Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith
TW200713552A (en) Electronic package
EP1681717A4 (de) Elektronische einrichtung und prozess zu ihrer herstellung
TW200735277A (en) Semiconductor device
WO2010144213A3 (en) Integrated circuit light emission device, module and fabrication process
EP1843394A3 (de) Halbleiter-Strahlungsquelle sowie Lichthärtgerät
TW200721432A (en) Semiconductor device, fabrication method therefor, and film fabrication method
DE602006003316D1 (de) Herstellungsverfahren für halbleitergehäuse und mit diesem verfahren hergestellte gehäuse
MY148101A (en) Encapsulated chip scale package having flip-chip on lead frame structure and method
TW200705699A (en) Sensor semiconductor device and fabrication method thereof
TW200739857A (en) Semiconductor module and method of manufacturing the same
SG149896A1 (en) Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package
TW200735412A (en) Light-emitting device
TWI318791B (en) Semiconductor device
TW200627667A (en) LED package structure and mass production method of making the same
US10031179B2 (en) Testing method
TWI455362B (zh) 發光元件封裝方法
WO2004051745A3 (de) Elektronisches bauelement mit mehreren chips und verfahren zur herstellung
KR20120034389A (ko) Cob 타입의 led 조명 장치의 제조방법
KR101308552B1 (ko) 칩온보드 타입 발광 모듈 제조 방법