TWI295765B - - Google Patents

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Info

Publication number: TWI295765B
Authority: TW; Taiwan
Prior art keywords: heat; fan; heat source; base; heat pipe
Prior art date: 2005-12-23

Application number

TW94146178A

Other languages

English (en)

Chinese (zh)

Other versions

TW200725238A (en

Inventor

Kun Cheng Lee

Original Assignee

Mitac Technology Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-12-23

Filing date

2005-12-23

Publication date

2008-04-11

2005-12-23 Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp

2005-12-23 Priority to TW094146178A priority Critical patent/TW200725238A/zh

2007-07-01 Publication of TW200725238A publication Critical patent/TW200725238A/zh

2008-04-11 Application granted granted Critical

2008-04-11 Publication of TWI295765B publication Critical patent/TWI295765B/zh

Links

230000017525 heat dissipation Effects 0.000 claims description 25
238000009434 installation Methods 0.000 claims description 16
238000003466 welding Methods 0.000 claims description 8
238000001816 cooling Methods 0.000 claims description 6
230000007246 mechanism Effects 0.000 claims description 5
238000000034 method Methods 0.000 claims description 5
238000005476 soldering Methods 0.000 claims description 5
230000008569 process Effects 0.000 claims description 4
NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
239000000758 substrate Substances 0.000 claims 1
230000000694 effects Effects 0.000 description 2
210000003746 feather Anatomy 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
230000008859 change Effects 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
230000007547 defect Effects 0.000 description 1
238000004049 embossing Methods 0.000 description 1
230000004907 flux Effects 0.000 description 1
235000011389 fruit/vegetable juice Nutrition 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
230000000717 retained effect Effects 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1

Landscapes

Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

TW094146178A 2005-12-23 2005-12-23 Slim type heat dissipation module TW200725238A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW094146178A TW200725238A (en)	2005-12-23	2005-12-23	Slim type heat dissipation module

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW094146178A TW200725238A (en)	2005-12-23	2005-12-23	Slim type heat dissipation module

Publications (2)

Publication Number	Publication Date
TW200725238A TW200725238A (en)	2007-07-01
TWI295765B true TWI295765B (2)	2008-04-11

Family

ID=45068534

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW094146178A TW200725238A (en)	2005-12-23	2005-12-23	Slim type heat dissipation module

Country Status (1)

Country	Link
TW (1)	TW200725238A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI401563B (zh) *	2008-06-27	2013-07-11	Foxconn Tech Co Ltd	散熱裝置

2005
- 2005-12-23 TW TW094146178A patent/TW200725238A/zh not_active IP Right Cessation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI401563B (zh) *	2008-06-27	2013-07-11	Foxconn Tech Co Ltd	散熱裝置

Also Published As

Publication number	Publication date
TW200725238A (en)	2007-07-01

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Legal Events

Date	Code	Title	Description
2023-01-11	MM4A	Annulment or lapse of patent due to non-payment of fees