TWI296612B - - Google Patents

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Info

Publication number: TWI296612B
Authority: TW; Taiwan
Prior art keywords: scribing; brittle material; blade; head; line
Prior art date: 2002-07-18

Application number

TW092119507A

Other languages

English (en)

Chinese (zh)

Other versions

TW200403192A (en

Inventor

Wakayama Haruo

Original Assignee

Mitsuboshi Diamond Ind Co Ltdl

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-18

Filing date

2003-07-17

Publication date

2008-05-11

2003-07-17 Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl

2004-03-01 Publication of TW200403192A publication Critical patent/TW200403192A/zh

2008-05-11 Application granted granted Critical

2008-05-11 Publication of TWI296612B publication Critical patent/TWI296612B/zh

Links

239000000463 material Substances 0.000 claims description 83
229910003460 diamond Inorganic materials 0.000 claims description 44
239000010432 diamond Substances 0.000 claims description 44
238000006243 chemical reaction Methods 0.000 claims description 31
238000000034 method Methods 0.000 claims description 23
239000011521 glass Substances 0.000 description 58
230000007246 mechanism Effects 0.000 description 17
239000000758 substrate Substances 0.000 description 8
238000003825 pressing Methods 0.000 description 7
238000007796 conventional method Methods 0.000 description 6
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
238000005452 bending Methods 0.000 description 4
238000005520 cutting process Methods 0.000 description 4
238000007667 floating Methods 0.000 description 4
238000012545 processing Methods 0.000 description 3
239000004575 stone Substances 0.000 description 3
230000005540 biological transmission Effects 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
238000003776 cleavage reaction Methods 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
230000002950 deficient Effects 0.000 description 2
238000010586 diagram Methods 0.000 description 2
229910052742 iron Inorganic materials 0.000 description 2
239000004973 liquid crystal related substance Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
230000008569 process Effects 0.000 description 2
230000007017 scission Effects 0.000 description 2
241000251468 Actinopterygii Species 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
230000009471 action Effects 0.000 description 1
230000003042 antagnostic effect Effects 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
230000008859 change Effects 0.000 description 1
238000004891 communication Methods 0.000 description 1
238000013461 design Methods 0.000 description 1
235000013399 edible fruits Nutrition 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000005259 measurement Methods 0.000 description 1
239000000203 mixture Substances 0.000 description 1
230000000630 rising effect Effects 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
239000002689 soil Substances 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)

TW092119507A 2002-07-18 2003-07-17 Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head TW200403192A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2002209823		2002-07-18

Publications (2)

Publication Number	Publication Date
TW200403192A TW200403192A (en)	2004-03-01
TWI296612B true TWI296612B (de)	2008-05-11

Family

ID=30767701

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW092119507A TW200403192A (en)	2002-07-18	2003-07-17	Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head

Country Status (6)

Country	Link
JP (1)	JP4205664B2 (de)
KR (1)	KR100647456B1 (de)
CN (1)	CN1668431B (de)
AU (1)	AU2003281461A1 (de)
TW (1)	TW200403192A (de)
WO (1)	WO2004009311A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102005024497B4 (de) *	2005-05-27	2008-06-19	Schott Ag	Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material
TWI461376B (zh) *	2005-12-01	2014-11-21	Mitsuboshi Diamond Ind Co Ltd	And a cutter retainer mounting structure for the scribing device
US8051681B2 (en) *	2007-05-09	2011-11-08	Corning Incorporated	Constant force scoring device and method for using same
CN102371629B (zh) *	2007-06-06	2015-08-05	三星钻石工业株式会社	刀片保持器安装构造体
JP5450964B2 (ja) *	2008-02-29	2014-03-26	三星ダイヤモンド工業株式会社	スクライブ装置及びスクライブ方法
KR100941080B1 (ko) *	2008-04-30	2010-02-10	세메스 주식회사	스크라이빙 장치 및 방법과, 이를 이용한 기판 절단 장치
TWI498293B (zh) *	2011-05-31	2015-09-01	Mitsuboshi Diamond Ind Co Ltd	劃線方法、鑽石尖、劃線裝置
TWI562264B (en) *	2012-12-19	2016-12-11	Genesis Photonics Inc	Splitting apparatus and splitting method
JP6519381B2 (ja) *	2015-07-27	2019-05-29	三星ダイヤモンド工業株式会社	脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法
CN107775825A (zh) *	2016-08-30	2018-03-09	三星钻石工业股份有限公司	金刚石刀具及其划线方法
JP2018051945A (ja) *	2016-09-29	2018-04-05	三星ダイヤモンド工業株式会社	ダイヤモンドツール及びそのスクライブ方法
TWI819626B (zh) *	2022-05-25	2023-10-21	矽品精密工業股份有限公司	超音波裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0857846A (ja) *	1994-08-19	1996-03-05	Hitachi Ltd	ダイヤモンド・ポイントスクライブ装置
JP4191304B2 (ja) *	1999-03-03	2008-12-03	三星ダイヤモンド工業株式会社	チップホルダー
JP4249373B2 (ja) *	2000-05-16	2009-04-02	三星ダイヤモンド工業株式会社	脆性材料のクロススクライブ方法
EP1408012B1 (de) *	2001-07-18	2010-11-03	Mitsuboshi Diamond Industrial Co., Ltd.	Ritzkopf

2003
- 2003-07-17 JP JP2004522756A patent/JP4205664B2/ja not_active Expired - Fee Related
- 2003-07-17 WO PCT/JP2003/009127 patent/WO2004009311A1/ja not_active Ceased
- 2003-07-17 CN CN038169444A patent/CN1668431B/zh not_active Expired - Fee Related
- 2003-07-17 KR KR1020047020721A patent/KR100647456B1/ko not_active Expired - Fee Related
- 2003-07-17 AU AU2003281461A patent/AU2003281461A1/en not_active Abandoned
- 2003-07-17 TW TW092119507A patent/TW200403192A/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
KR20050013220A (ko)	2005-02-03
CN1668431B (zh)	2010-06-09
WO2004009311A1 (ja)	2004-01-29
CN1668431A (zh)	2005-09-14
KR100647456B1 (ko)	2006-11-23
AU2003281461A1 (en)	2004-02-09
JP4205664B2 (ja)	2009-01-07
JPWO2004009311A1 (ja)	2005-11-17
TW200403192A (en)	2004-03-01

Legal Events

Date	Code	Title	Description
2012-02-11	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
TWI296612B (de)	2008-05-11
CN1906002B (zh)	2011-08-31	划线形成机构、划线头和划线设备
TWI290543B (en)	2007-12-01	Scribe line forming device and scribe line forming method
CN1863740B (zh)	2012-04-25	划线头和使用该划线头的划线装置以及划线方法
TWI342300B (de)	2011-05-21
TW544442B (en)	2003-08-01	Cutter wheel for brittle material substrate and scriber
JP5459484B2 (ja)	2014-04-02	ダイシング装置及びダイシング方法
CN110091229B (zh)	2020-10-13	一种钢材连续切割打磨设备
JP5314674B2 (ja)	2013-10-16	脆性材料基板の加工方法
TW201114702A (en)	2011-05-01	Breaking apparatus and breaking method
TW201005815A (en)	2010-02-01	Wafer treating method
TW201711817A (zh)	2017-04-01	板玻璃加工裝置及玻璃基板
JP2010177277A (ja)	2010-08-12	レーザーダイシング方法及びレーザーダイシング装置
JP2003292332A (ja)	2003-10-15	スクライブ方法及びスクライブ装置
TWI455200B (zh)	2014-10-01	切割裝置及方法
TWI732959B (zh)	2021-07-11	晶圓的加工方法
TW404871B (en)	2000-09-11	Device and method for machining transparent medium by laser
JP4865160B2 (ja)	2012-02-01	脆性材料基板用カッターホイールおよびそれを備えたスクライバー
JPH06320401A (ja)	1994-11-22	ドリル刃先研削機
TW200301755A (en)	2003-07-16	Cutter wheel for nonmetal material, and method and device for scribing using the cutter wheel
JP5276736B2 (ja)	2013-08-28	ブレイク方法
JP2020082407A (ja)	2020-06-04	スクライブ装置及びスクライブ方法
JP2008084887A (ja)	2008-04-10	ダイシング装置及びダイシング方法
KR100735003B1 (ko)	2007-07-03	석재 샘플 가공 방법
EP1473283A2 (de)	2004-11-03	Verfahren zum Schneiden einer Glasscheibe