TWI299328B - Dielectric ceramic composition and multi-layer ceramic capacitor - Google Patents
Dielectric ceramic composition and multi-layer ceramic capacitor Download PDFInfo
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- TWI299328B TWI299328B TW092100762A TW92100762A TWI299328B TW I299328 B TWI299328 B TW I299328B TW 092100762 A TW092100762 A TW 092100762A TW 92100762 A TW92100762 A TW 92100762A TW I299328 B TWI299328 B TW I299328B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/003—Titanates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/003—Titanates
- C01G23/006—Alkaline earth titanates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G31/00—Compounds of vanadium
- C01G31/006—Compounds containing vanadium, with or without oxygen or hydrogen, and containing two or more other elements
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G45/00—Compounds of manganese
- C01G45/20—Compounds containing manganese, with or without oxygen or hydrogen, and containing one or more other elements
- C01G45/22—Compounds containing manganese, with or without oxygen or hydrogen, and containing two or more other elements
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
- C04B2235/662—Annealing after sintering
- C04B2235/663—Oxidative annealing
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
- C04B2235/662—Annealing after sintering
- C04B2235/664—Reductive annealing
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/72—Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/79—Non-stoichiometric products, e.g. perovskites (ABO3) with an A/B-ratio other than 1
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- Chemical & Material Sciences (AREA)
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- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002006065 | 2002-01-15 |
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| Publication Number | Publication Date |
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| TW200306288A TW200306288A (en) | 2003-11-16 |
| TWI299328B true TWI299328B (en) | 2008-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092100762A TWI299328B (en) | 2002-01-15 | 2003-01-15 | Dielectric ceramic composition and multi-layer ceramic capacitor |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6809052B2 (de) |
| EP (1) | EP1327616B9 (de) |
| KR (1) | KR100514574B1 (de) |
| CN (1) | CN1250483C (de) |
| DE (1) | DE60335427D1 (de) |
| TW (1) | TWI299328B (de) |
Families Citing this family (45)
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|---|---|---|---|---|
| TWI245299B (en) * | 2003-11-21 | 2005-12-11 | Tdk Corp | Laminated ceramic capacitor |
| KR100519821B1 (ko) * | 2003-12-18 | 2005-10-10 | 삼성전기주식회사 | 적층 세라믹 콘덴서용 유전체 조성물, 적층 세라믹콘덴서, 및 적층 세라믹 콘덴서의 제조방법 |
| WO2005117041A1 (ja) * | 2004-05-31 | 2005-12-08 | Tdk Corporation | 電子部品、積層セラミックコンデンサおよびその製造方法 |
| JP2006005222A (ja) * | 2004-06-18 | 2006-01-05 | Tdk Corp | セラミック電子部品およびその製造方法 |
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| JP4622537B2 (ja) * | 2005-01-20 | 2011-02-02 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
| US20060229188A1 (en) * | 2005-04-07 | 2006-10-12 | Randall Michael S | C0G multi-layered ceramic capacitor |
| US7923395B2 (en) * | 2005-04-07 | 2011-04-12 | Kemet Electronics Corporation | C0G multi-layered ceramic capacitor |
| TW200705481A (en) * | 2005-04-28 | 2007-02-01 | Tdk Corp | Method of production of multilayer ceramic electronic device |
| JP5461774B2 (ja) * | 2005-06-24 | 2014-04-02 | Tdk株式会社 | 電子部品およびその製造方法 |
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| JP4821357B2 (ja) * | 2006-02-14 | 2011-11-24 | Tdk株式会社 | 電子部品、誘電体磁器組成物およびその製造方法 |
| JP4839913B2 (ja) * | 2006-03-23 | 2011-12-21 | Tdk株式会社 | 電子部品、誘電体磁器組成物およびその製造方法 |
| JP2007331956A (ja) * | 2006-06-12 | 2007-12-27 | Tdk Corp | 電子部品、誘電体磁器組成物およびその製造方法 |
| JP2007331958A (ja) * | 2006-06-12 | 2007-12-27 | Tdk Corp | 電子部品、誘電体磁器組成物およびその製造方法 |
| DE112007001335B4 (de) * | 2006-07-07 | 2019-05-23 | Murata Manufacturing Co., Ltd. | Dielektrische Keramik, Keramikelektronikelement und Vielschicht-Keramikkondensator |
| US7541306B2 (en) * | 2007-01-17 | 2009-06-02 | Ferro Corporation | X8R dielectric composition for use with nickel electrodes |
| US7521390B2 (en) * | 2007-03-05 | 2009-04-21 | Ferro Corporation | Ultra low temperature fixed X7R and BX dielectric ceramic composition and method of making |
| JP5240199B2 (ja) * | 2007-09-26 | 2013-07-17 | 株式会社村田製作所 | 誘電体セラミック及び積層セラミックコンデンサ |
| US8420559B2 (en) * | 2008-03-24 | 2013-04-16 | Kyocera Corporation | Multilayer ceramic capacitor |
| JP5018604B2 (ja) * | 2008-03-31 | 2012-09-05 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
| WO2010035663A1 (ja) * | 2008-09-24 | 2010-04-01 | 株式会社村田製作所 | 誘電体セラミック組成物および積層セラミックコンデンサ |
| US8178458B2 (en) * | 2009-12-01 | 2012-05-15 | National Taiwan University Technology | Dielectric ceramic composition |
| JP5360079B2 (ja) * | 2010-03-05 | 2013-12-04 | Tdk株式会社 | 誘電体磁器組成物およびセラミック電子部品 |
| US8492302B2 (en) | 2010-03-05 | 2013-07-23 | Tdk Corporation | Dielectric ceramic composition and ceramic electronic component |
| JPWO2011125543A1 (ja) | 2010-04-02 | 2013-07-08 | 株式会社村田製作所 | 誘電体セラミックおよびそれを用いた積層セラミックコンデンサ |
| JP5141718B2 (ja) * | 2010-05-20 | 2013-02-13 | Tdk株式会社 | 誘電体磁器組成物およびセラミック電子部品 |
| CN102826845A (zh) * | 2012-08-29 | 2012-12-19 | 苏州金桨节能与环保科技有限公司 | 一种触电/压电材料的制备方法及其应用 |
| KR20140118724A (ko) * | 2013-03-29 | 2014-10-08 | 미쓰비시 마테리알 가부시키가이샤 | Pzt 계 강유전체 박막 및 그 형성 방법 |
| DE102013110978A1 (de) * | 2013-10-02 | 2015-04-16 | Epcos Ag | Keramischer Vielschichtkondensator |
| JP6753221B2 (ja) * | 2016-08-30 | 2020-09-09 | Tdk株式会社 | 誘電体組成物および積層電子部品 |
| CN111517780B (zh) * | 2019-02-01 | 2023-07-25 | 三星电机株式会社 | 介电陶瓷组合物和包括其的多层陶瓷电容器 |
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| KR102292797B1 (ko) * | 2019-02-13 | 2021-08-24 | 삼성전기주식회사 | 유전체 자기 조성물 및 이를 포함하는 적층 세라믹 커패시터 |
| KR102827667B1 (ko) | 2019-07-24 | 2025-07-02 | 삼성전기주식회사 | 유전체 자기 조성물 및 이를 포함하는 적층 세라믹 커패시터 |
| DE102020002664A1 (de) | 2020-05-04 | 2021-11-04 | Giesecke+Devrient Currency Technology Gmbh | Gedruckter Folienkondensator mit hoher Kapazität |
| DE102020002881A1 (de) | 2020-05-13 | 2021-11-18 | Giesecke+Devrient Currency Technology Gmbh | Gedruckter Folienkondensator mit gesintertem Dielektrikum |
| CN114573335A (zh) * | 2020-12-01 | 2022-06-03 | 日本化学工业株式会社 | 电介质陶瓷形成用组合物及电介质陶瓷材料 |
| KR102624590B1 (ko) * | 2020-12-07 | 2024-01-12 | 한국과학기술원 | 유전체 세라믹, 이의 제조 방법, 및 이를 포함하는 적층형 전자 부품 |
| JP7575961B2 (ja) * | 2021-02-09 | 2024-10-30 | Tdk株式会社 | 誘電体組成物、電子部品および積層電子部品 |
| CN116655373A (zh) * | 2022-02-21 | 2023-08-29 | 中国科学院上海硅酸盐研究所 | 一种低电容电压系数的x7r瓷粉及其制备方法和应用 |
| US12542238B2 (en) | 2023-04-19 | 2026-02-03 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
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| JP3918372B2 (ja) | 1999-07-26 | 2007-05-23 | 株式会社村田製作所 | 誘電体セラミック組成物、および積層セラミックコンデンサ |
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| JP3838845B2 (ja) | 2000-02-16 | 2006-10-25 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
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| JP2001240466A (ja) | 2000-02-28 | 2001-09-04 | Taiyo Yuden Co Ltd | 誘電体磁器と積層セラミック電子部品 |
| JP3934352B2 (ja) * | 2000-03-31 | 2007-06-20 | Tdk株式会社 | 積層型セラミックチップコンデンサとその製造方法 |
| JP2002020166A (ja) | 2000-06-30 | 2002-01-23 | Taiyo Yuden Co Ltd | 誘電体磁器組成物及び磁器コンデンサ |
| JP2002020167A (ja) | 2000-06-30 | 2002-01-23 | Taiyo Yuden Co Ltd | 誘電体磁器組成物及び磁器コンデンサ |
| JP3854454B2 (ja) | 2000-09-14 | 2006-12-06 | 太陽誘電株式会社 | 誘電体磁器組成物及び磁器コンデンサ |
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2003
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- 2003-01-15 DE DE60335427T patent/DE60335427D1/de not_active Expired - Lifetime
- 2003-01-15 CN CNB031015948A patent/CN1250483C/zh not_active Expired - Lifetime
- 2003-01-15 KR KR10-2003-0002687A patent/KR100514574B1/ko not_active Expired - Lifetime
- 2003-01-15 US US10/342,283 patent/US6809052B2/en not_active Expired - Lifetime
- 2003-01-15 TW TW092100762A patent/TWI299328B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200306288A (en) | 2003-11-16 |
| KR20030061699A (ko) | 2003-07-22 |
| HK1056714A1 (en) | 2004-02-27 |
| EP1327616B1 (de) | 2010-12-22 |
| US6809052B2 (en) | 2004-10-26 |
| KR100514574B1 (ko) | 2005-09-13 |
| DE60335427D1 (de) | 2011-02-03 |
| CN1432548A (zh) | 2003-07-30 |
| EP1327616A3 (de) | 2004-11-03 |
| US20040038800A1 (en) | 2004-02-26 |
| EP1327616A2 (de) | 2003-07-16 |
| CN1250483C (zh) | 2006-04-12 |
| EP1327616B9 (de) | 2011-04-13 |
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