TWI323960B - - Google Patents

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Info

Publication number: TWI323960B
Authority: TW; Taiwan
Prior art keywords: connector; solder; terminal; connection; layer
Prior art date: 2006-08-18

Application number

TW96119626A

Other languages

English (en)

Chinese (zh)

Other versions

TW200812162A (en

Inventor

Fujimura Takashi

Abe Yoichi

Original Assignee

Nippon Mektron Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-08-18

Filing date

2007-06-01

Publication date

2010-04-21

2007-06-01 Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk

2008-03-01 Publication of TW200812162A publication Critical patent/TW200812162A/zh

2010-04-21 Application granted granted Critical

2010-04-21 Publication of TWI323960B publication Critical patent/TWI323960B/zh

Links

229910000679 solder Inorganic materials 0.000 claims description 46
238000004519 manufacturing process Methods 0.000 claims description 10
239000011248 coating agent Substances 0.000 claims description 2
238000000576 coating method Methods 0.000 claims description 2
239000010410 layer Substances 0.000 description 23
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
239000010931 gold Substances 0.000 description 9
229910052737 gold Inorganic materials 0.000 description 9
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
238000007747 plating Methods 0.000 description 6
239000011347 resin Substances 0.000 description 6
229920005989 resin Polymers 0.000 description 6
239000004020 conductor Substances 0.000 description 5
238000002844 melting Methods 0.000 description 5
230000008018 melting Effects 0.000 description 5
239000011241 protective layer Substances 0.000 description 5
239000000758 substrate Substances 0.000 description 5
238000000034 method Methods 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
229910045601 alloy Inorganic materials 0.000 description 3
239000000956 alloy Substances 0.000 description 3
239000000463 material Substances 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
239000002184 metal Substances 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000007769 metal material Substances 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 1
230000000739 chaotic effect Effects 0.000 description 1
239000011247 coating layer Substances 0.000 description 1
239000000109 continuous material Substances 0.000 description 1
238000001816 cooling Methods 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
238000004043 dyeing Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000004945 emulsification Methods 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
238000005530 etching Methods 0.000 description 1
230000005496 eutectics Effects 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
229910052500 inorganic mineral Inorganic materials 0.000 description 1
238000003780 insertion Methods 0.000 description 1
230000037431 insertion Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
230000007774 longterm Effects 0.000 description 1
239000000155 melt Substances 0.000 description 1
239000011707 mineral Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000000178 monomer Substances 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
238000012545 processing Methods 0.000 description 1

Landscapes

Manufacturing Of Printed Wiring (AREA)
Manufacturing Of Electrical Connectors (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

TW96119626A 2006-08-18 2007-06-01 Manufacturing method of connector connecting terminal of wiring board TW200812162A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2006223496A JP4786461B2 (ja)	2006-08-18	2006-08-18	配線基板のコネクタ接続用端子の製造方法

Publications (2)

Publication Number	Publication Date
TW200812162A TW200812162A (en)	2008-03-01
TWI323960B true TWI323960B (ja)	2010-04-21

Family

ID=39095958

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW96119626A TW200812162A (en)	2006-08-18	2007-06-01	Manufacturing method of connector connecting terminal of wiring board

Country Status (3)

Country	Link
JP (1)	JP4786461B2 (ja)
CN (1)	CN101128089B (ja)
TW (1)	TW200812162A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5624392B2 (ja) *	2010-07-13	2014-11-12	株式会社東芝	誘導加熱調理器
JP2013094836A (ja) *	2011-11-02	2013-05-20	Mitsubishi Materials Corp	プリコート用ハンダペースト及びその製造方法
JP5968514B1 (ja) *	2015-11-05	2016-08-10	株式会社フジクラ	プリント配線板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5446247A (en) *	1993-11-19	1995-08-29	Motorola, Inc.	Electrical contact and method for making an electrical contact
JP2705675B2 (ja) *	1995-11-07	1998-01-28	日本電気株式会社	印刷配線板の製造方法
JPH10242629A (ja) *	1997-02-26	1998-09-11	Oki Electric Ind Co Ltd	プリント配線板及びその製造方法
US6047637A (en) *	1999-06-17	2000-04-11	Fujitsu Limited	Method of paste printing using stencil and masking layer
JP2002184546A (ja) *	2000-12-13	2002-06-28	Japan Aviation Electronics Industry Ltd	電気接続部材の製造方法及び電気接続部材
CN1148849C (zh) *	2000-12-23	2004-05-05	富士康(昆山)电脑接插件有限公司	电连接器制造方法

2006
- 2006-08-18 JP JP2006223496A patent/JP4786461B2/ja not_active Expired - Fee Related
2007
- 2007-06-01 TW TW96119626A patent/TW200812162A/zh not_active IP Right Cessation
- 2007-06-22 CN CN2007101067884A patent/CN101128089B/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
TW200812162A (en)	2008-03-01
CN101128089B (zh)	2011-04-20
JP2008047471A (ja)	2008-02-28
JP4786461B2 (ja)	2011-10-05
CN101128089A (zh)	2008-02-20

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Legal Events

Date	Code	Title	Description
2020-01-21	MM4A	Annulment or lapse of patent due to non-payment of fees