TWI336358B - Device and method for electrolytically treating electrically insulated structures - Google Patents
Device and method for electrolytically treating electrically insulated structures Download PDFInfo
- Publication number
- TWI336358B TWI336358B TW093126281A TW93126281A TWI336358B TW I336358 B TWI336358 B TW I336358B TW 093126281 A TW093126281 A TW 093126281A TW 93126281 A TW93126281 A TW 93126281A TW I336358 B TWI336358 B TW I336358B
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- Taiwan
- Prior art keywords
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- electrode
- workpieces
- treatment liquid
- workpiece
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000007788 liquid Substances 0.000 claims abstract description 124
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 48
- 230000008569 process Effects 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims description 84
- 238000007789 sealing Methods 0.000 claims description 84
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
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- 239000011248 coating agent Substances 0.000 claims description 37
- 238000005192 partition Methods 0.000 claims description 11
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- 125000006850 spacer group Chemical group 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 4
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- 241000283690 Bos taurus Species 0.000 claims 1
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- 239000000463 material Substances 0.000 abstract description 53
- 239000011888 foil Substances 0.000 description 82
- 239000010949 copper Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000003792 electrolyte Substances 0.000 description 19
- 150000002500 ions Chemical class 0.000 description 19
- 238000007747 plating Methods 0.000 description 14
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
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- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
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- 238000009713 electroplating Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- MJOQJPYNENPSSS-XQHKEYJVSA-N [(3r,4s,5r,6s)-4,5,6-triacetyloxyoxan-3-yl] acetate Chemical compound CC(=O)O[C@@H]1CO[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O MJOQJPYNENPSSS-XQHKEYJVSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 210000003423 ankle Anatomy 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
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- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 150000002736 metal compounds Chemical class 0.000 description 1
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- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10342512A DE10342512B3 (de) | 2003-09-12 | 2003-09-12 | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200510577A TW200510577A (en) | 2005-03-16 |
| TWI336358B true TWI336358B (en) | 2011-01-21 |
Family
ID=33039358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093126281A TWI336358B (en) | 2003-09-12 | 2004-08-31 | Device and method for electrolytically treating electrically insulated structures |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20060201817A1 (de) |
| EP (1) | EP1664390B1 (de) |
| JP (1) | JP4474414B2 (de) |
| KR (1) | KR101076947B1 (de) |
| CN (1) | CN1849415A (de) |
| AT (1) | ATE350514T1 (de) |
| BR (1) | BRPI0413715B1 (de) |
| CA (1) | CA2532451A1 (de) |
| DE (2) | DE10342512B3 (de) |
| MX (1) | MXPA06002649A (de) |
| TW (1) | TWI336358B (de) |
| WO (1) | WO2005026415A1 (de) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4862513B2 (ja) * | 2005-06-23 | 2012-01-25 | 東レ株式会社 | 給電用ローラならびに電解めっき被膜付きフィルムの製造装置および方法 |
| DE102005031948B3 (de) | 2005-07-08 | 2006-06-14 | Höllmüller Maschinenbau GmbH | Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle |
| JP5301993B2 (ja) | 2005-08-12 | 2013-09-25 | モジュメタル エルエルシー | 組成変調複合材料及びその形成方法 |
| US20090101511A1 (en) * | 2006-04-18 | 2009-04-23 | Rene Lochtman | Electroplating device and method |
| EP2010700B1 (de) * | 2006-04-18 | 2010-01-20 | Basf Se | Vorrichtung und verfahren zur galvanischen beschichtung |
| DE102006033353B4 (de) * | 2006-07-19 | 2010-11-18 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten |
| TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
| DE102008004592A1 (de) | 2008-01-16 | 2009-07-23 | Danziger, Manfred, Dr. | Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes |
| JP2009249659A (ja) * | 2008-04-02 | 2009-10-29 | Nippon Mektron Ltd | 電気めっき装置及び電気めっき方法 |
| US20100264035A1 (en) * | 2009-04-15 | 2010-10-21 | Solopower, Inc. | Reel-to-reel plating of conductive grids for flexible thin film solar cells |
| DE102009022337A1 (de) * | 2009-05-13 | 2010-11-18 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung eines Substrats |
| WO2010144509A2 (en) | 2009-06-08 | 2010-12-16 | Modumetal Llc | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
| US8377267B2 (en) * | 2009-09-30 | 2013-02-19 | National Semiconductor Corporation | Foil plating for semiconductor packaging |
| CN102383159A (zh) * | 2011-08-09 | 2012-03-21 | 长春一汽富维高新汽车饰件有限公司 | 粗化生产与三价铬电解工艺合并的装置及方法 |
| EP2626144A1 (de) * | 2012-02-07 | 2013-08-14 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Herstellungssystem für Endlosprodukte mit einer Reinraum-Auftragszone und einem getrennten Behandlungsraum |
| BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
| HK1220742A1 (zh) | 2013-03-15 | 2017-05-12 | Modumetal, Inc. | 用於连续施加纳米层压金属涂层的方法和装置 |
| EA201500948A1 (ru) | 2013-03-15 | 2016-03-31 | Модьюметл, Инк. | Способ изготовления изделия и изделие, изготовленное вышеуказанным способом |
| EA201500949A1 (ru) | 2013-03-15 | 2016-02-29 | Модьюметл, Инк. | Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие |
| US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
| BR112016001709B1 (pt) * | 2013-08-22 | 2021-08-24 | Ashworth Bros., Inc | Sistema para eletropolimento ou eletrogalvanização de uma correia transportadora, e método para eletropolimento ou eletrogalvanização de uma correia transportadora |
| CN104195611B (zh) * | 2014-08-15 | 2016-09-14 | 洛阳弘洋机械有限公司 | 一种棒料连续镀铬生产线 |
| EP3194642A4 (de) | 2014-09-18 | 2018-07-04 | Modumetal, Inc. | Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen |
| BR112017005534A2 (pt) | 2014-09-18 | 2017-12-05 | Modumetal Inc | métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva |
| CN104928738B (zh) * | 2015-05-21 | 2017-04-19 | 中国科学院山西煤炭化学研究所 | 一种碳纤维丝束的连续电镀金属方法及装置 |
| CN105177660B (zh) * | 2015-10-09 | 2017-11-21 | 华晶精密制造股份有限公司 | 一种金刚石切割线生产用水平上砂装置 |
| US11365488B2 (en) | 2016-09-08 | 2022-06-21 | Modumetal, Inc. | Processes for providing laminated coatings on workpieces, and articles made therefrom |
| TW201821649A (zh) | 2016-09-09 | 2018-06-16 | 美商馬杜合金股份有限公司 | 層合物與奈米層合物材料於工具及模製方法之應用 |
| EP3512987A1 (de) | 2016-09-14 | 2019-07-24 | Modumetal, Inc. | System zur erzeugung eines zuverlässigen, komplexen elektrischen hochdurchsatzfeldes und verfahren zur herstellung von beschichtungen daraus |
| US12076965B2 (en) | 2016-11-02 | 2024-09-03 | Modumetal, Inc. | Topology optimized high interface packing structures |
| WO2018175975A1 (en) | 2017-03-24 | 2018-09-27 | Modumetal, Inc. | Lift plungers with electrodeposited coatings, and systems and methods for producing the same |
| EP3612669A1 (de) | 2017-04-21 | 2020-02-26 | Modumetal, Inc. | Rohrförmige artikel mit galvanischen beschichtungen und systeme und verfahren zur herstellung derselben |
| US11214884B2 (en) | 2017-07-11 | 2022-01-04 | University Of South Florida | Electrochemical three-dimensional printing and soldering |
| CN107523831B (zh) * | 2017-09-30 | 2019-01-18 | 江阴康强电子有限公司 | 粗化浸镀子槽 |
| CN112272717B (zh) | 2018-04-27 | 2024-01-05 | 莫杜美拓有限公司 | 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法 |
| CN108950622B (zh) * | 2018-08-28 | 2020-07-21 | 温州杰锐电子科技有限公司 | 一种电刷镀装置 |
| US10807823B2 (en) * | 2019-02-01 | 2020-10-20 | Assa Abloy Ab | Card stacker |
| CN112249702A (zh) * | 2019-07-22 | 2021-01-22 | 艾里亚设计股分有限公司 | 导引辊装置 |
| US11713514B2 (en) * | 2019-08-08 | 2023-08-01 | Hutchinson Technology Incorporated | Systems for electroplating and methods of use thereof |
| CN112111775B (zh) * | 2020-08-15 | 2023-02-03 | 智兴(上海)五金有限公司 | 一种导线快速氧化处理系统 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| GB1055001A (de) * | 1964-02-04 | |||
| US3535222A (en) * | 1964-02-04 | 1970-10-20 | Aluminium Lab Ltd | Apparatus for continuous electrolytic treatment |
| US4282073A (en) * | 1979-08-22 | 1981-08-04 | Thomas Steel Strip Corporation | Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates |
| US4324633A (en) * | 1980-10-20 | 1982-04-13 | Lovejoy Curtis N | Electrolytic apparatus for treating continuous strip material |
| US4401523A (en) * | 1980-12-18 | 1983-08-30 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
| US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
| US4560445A (en) * | 1984-12-24 | 1985-12-24 | Polyonics Corporation | Continuous process for fabricating metallic patterns on a thin film substrate |
| FR2653787B1 (fr) * | 1989-10-27 | 1992-02-14 | Lorraine Laminage | Installation et procede de revetement electrolytique d'une bande metallique. |
| DE4229403C2 (de) * | 1992-09-03 | 1995-04-13 | Hoellmueller Maschbau H | Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien |
| DE19612555C2 (de) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
| DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
| US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
| DE19951325C2 (de) * | 1999-10-20 | 2003-06-26 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens |
| DE10043814C1 (de) * | 2000-09-06 | 2002-04-11 | Egon Huebel | Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut |
| DE10065643C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut |
| DE10065649C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von elektrisch leitfähigen Bändern |
| WO2003038158A2 (de) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen |
-
2003
- 2003-09-12 DE DE10342512A patent/DE10342512B3/de not_active Expired - Fee Related
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2004
- 2004-08-19 KR KR1020067003313A patent/KR101076947B1/ko not_active Expired - Fee Related
- 2004-08-19 DE DE602004004164T patent/DE602004004164T2/de not_active Expired - Lifetime
- 2004-08-19 CN CNA2004800260338A patent/CN1849415A/zh active Pending
- 2004-08-19 EP EP04764415A patent/EP1664390B1/de not_active Expired - Lifetime
- 2004-08-19 MX MXPA06002649A patent/MXPA06002649A/es active IP Right Grant
- 2004-08-19 CA CA002532451A patent/CA2532451A1/en not_active Abandoned
- 2004-08-19 JP JP2006525683A patent/JP4474414B2/ja not_active Expired - Fee Related
- 2004-08-19 AT AT04764415T patent/ATE350514T1/de not_active IP Right Cessation
- 2004-08-19 BR BRPI0413715-9B1A patent/BRPI0413715B1/pt not_active IP Right Cessation
- 2004-08-19 US US10/566,227 patent/US20060201817A1/en not_active Abandoned
- 2004-08-19 WO PCT/EP2004/009436 patent/WO2005026415A1/en not_active Ceased
- 2004-08-31 TW TW093126281A patent/TWI336358B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1849415A (zh) | 2006-10-18 |
| EP1664390B1 (de) | 2007-01-03 |
| ATE350514T1 (de) | 2007-01-15 |
| KR101076947B1 (ko) | 2011-10-26 |
| BRPI0413715B1 (pt) | 2013-09-17 |
| US20060201817A1 (en) | 2006-09-14 |
| DE602004004164T2 (de) | 2007-10-11 |
| JP4474414B2 (ja) | 2010-06-02 |
| WO2005026415A1 (en) | 2005-03-24 |
| CA2532451A1 (en) | 2005-03-24 |
| MXPA06002649A (es) | 2006-06-06 |
| EP1664390A1 (de) | 2006-06-07 |
| TW200510577A (en) | 2005-03-16 |
| KR20060058116A (ko) | 2006-05-29 |
| DE10342512B3 (de) | 2004-10-28 |
| JP2007505213A (ja) | 2007-03-08 |
| DE602004004164D1 (de) | 2007-02-15 |
| BRPI0413715A (pt) | 2006-10-17 |
| HK1084423A1 (en) | 2006-07-28 |
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