TWI347865B - Apparatus for treating substrates and method of treating substrates - Google Patents

Apparatus for treating substrates and method of treating substrates

Info

Publication number
TWI347865B
TWI347865B TW094108939A TW94108939A TWI347865B TW I347865 B TWI347865 B TW I347865B TW 094108939 A TW094108939 A TW 094108939A TW 94108939 A TW94108939 A TW 94108939A TW I347865 B TWI347865 B TW I347865B
Authority
TW
Taiwan
Prior art keywords
treating substrates
substrates
treating
Prior art date
Application number
TW094108939A
Other languages
Chinese (zh)
Other versions
TW200536625A (en
Inventor
Hideki Sueyoshi
Akinori Iso
Norio Toyoshima
Harumichi Hirose
Shinichiro Takaki
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200536625A publication Critical patent/TW200536625A/en
Application granted granted Critical
Publication of TWI347865B publication Critical patent/TWI347865B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
TW094108939A 2004-03-29 2005-03-23 Apparatus for treating substrates and method of treating substrates TWI347865B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004096018 2004-03-29
JP2005057878A JP4495618B2 (en) 2004-03-29 2005-03-02 Substrate processing apparatus and processing method

Publications (2)

Publication Number Publication Date
TW200536625A TW200536625A (en) 2005-11-16
TWI347865B true TWI347865B (en) 2011-09-01

Family

ID=35049067

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108939A TWI347865B (en) 2004-03-29 2005-03-23 Apparatus for treating substrates and method of treating substrates

Country Status (4)

Country Link
JP (1) JP4495618B2 (en)
KR (1) KR101118068B1 (en)
CN (1) CN1676231B (en)
TW (1) TWI347865B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1847980B (en) * 2006-03-24 2010-12-01 友达光电股份有限公司 Low-voltage processing equipment
KR100757497B1 (en) 2006-12-14 2007-09-13 주식회사 케이씨텍 Beth exhaust
KR100945024B1 (en) * 2007-11-16 2010-03-05 (주)네오이엔지 Glass or Wafer Wet Processing Units
JP5352388B2 (en) * 2009-09-02 2013-11-27 芝浦メカトロニクス株式会社 Substrate processing apparatus and processing method
JP2013026490A (en) * 2011-07-22 2013-02-04 Tokyo Electron Ltd Substrate processor
JP6651127B2 (en) * 2015-09-11 2020-02-19 日本電気硝子株式会社 Method for manufacturing glass plate and apparatus for manufacturing the same
CN106997860B (en) * 2016-01-22 2020-09-04 芝浦机械电子株式会社 Substrate processing equipment
JP6904694B2 (en) * 2016-01-29 2021-07-21 芝浦メカトロニクス株式会社 Board processing equipment
CN107024790B (en) * 2016-01-29 2021-04-09 芝浦机械电子株式会社 Substrate processing equipment
CN105618450A (en) * 2016-02-25 2016-06-01 赵齐赞 Cleaning slot cover
CN106154601B (en) * 2016-07-04 2019-04-30 武汉华星光电技术有限公司 Apparatus for baking and its method for exhausting
JP7203545B2 (en) 2018-09-21 2023-01-13 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
CN109772794B (en) * 2019-02-20 2020-12-04 深圳市华星光电技术有限公司 Substrate cleaning machine
IT202100002936A1 (en) * 2021-02-10 2022-08-10 Ecosys S R L APPARATUS FOR THE TREATMENT OF A CHEMICAL PRODUCT APPLIED TO THE SURFACES OF ITEMS
KR102856965B1 (en) * 2023-11-29 2025-09-11 주식회사 에스이에이 Apparatus for processing substrate including exhaust guiding cover therein

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61193455A (en) 1985-02-20 1986-08-27 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS61193455U (en) * 1985-05-25 1986-12-02
CN2106005U (en) * 1991-06-15 1992-06-03 青岛市崂山节能设备厂 Far infrared direct heated purifying spray paint baking room for car
KR0133342B1 (en) * 1994-08-19 1998-04-16 이헌조 Substrate cleaning device equipped with exhaust means
JP2996236B1 (en) * 1998-09-09 1999-12-27 日本電気株式会社 Substrate processing equipment
JP2002292347A (en) * 2001-03-30 2002-10-08 Sumitomo Bakelite Co Ltd Method and apparatus for cleaning and drying optical plastic film

Also Published As

Publication number Publication date
KR20060044945A (en) 2006-05-16
JP4495618B2 (en) 2010-07-07
KR101118068B1 (en) 2012-02-24
JP2005317922A (en) 2005-11-10
CN1676231B (en) 2011-09-07
TW200536625A (en) 2005-11-16
CN1676231A (en) 2005-10-05

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