TWI348024B - Carrier tray for use with prober - Google Patents

Carrier tray for use with prober

Info

Publication number
TWI348024B
TWI348024B TW096127793A TW96127793A TWI348024B TW I348024 B TWI348024 B TW I348024B TW 096127793 A TW096127793 A TW 096127793A TW 96127793 A TW96127793 A TW 96127793A TW I348024 B TWI348024 B TW I348024B
Authority
TW
Taiwan
Prior art keywords
prober
carrier tray
tray
carrier
Prior art date
Application number
TW096127793A
Other languages
English (en)
Other versions
TW200815760A (en
Inventor
Satoshi Tomita
Hiroyuki Tokuyama
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Publication of TW200815760A publication Critical patent/TW200815760A/zh
Application granted granted Critical
Publication of TWI348024B publication Critical patent/TWI348024B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096127793A 2006-08-09 2007-07-30 Carrier tray for use with prober TWI348024B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006216579A JP4832207B2 (ja) 2006-08-09 2006-08-09 プローバ装置用搬送トレイ

Publications (2)

Publication Number Publication Date
TW200815760A TW200815760A (en) 2008-04-01
TWI348024B true TWI348024B (en) 2011-09-01

Family

ID=39050116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127793A TWI348024B (en) 2006-08-09 2007-07-30 Carrier tray for use with prober

Country Status (5)

Country Link
US (2) US7652467B2 (zh)
JP (1) JP4832207B2 (zh)
KR (1) KR100847284B1 (zh)
CN (1) CN101122613B (zh)
TW (1) TWI348024B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243314A (ja) * 2009-04-06 2010-10-28 Syswave Corp 半導体チップ素子試験治具及び自動試験装置
US8518749B2 (en) * 2009-06-22 2013-08-27 Stats Chippac, Ltd. Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
US8587331B2 (en) * 2009-12-31 2013-11-19 Tommie E. Berry Test systems and methods for testing electronic devices
JP4765127B1 (ja) * 2010-07-30 2011-09-07 合同会社Ｐｌｅｓｏｎ トレーユニットおよび半導体デバイスの検査装置
JP5648809B2 (ja) * 2011-10-28 2015-01-07 株式会社島津製作所 Ｔｆｔアレイ検査装置
CN103730376B (zh) * 2012-10-15 2018-04-03 华邦电子股份有限公司 封装测试方法
CN105453244B (zh) 2013-05-14 2018-04-06 佛姆法克特股份有限公司 可互换探针头的自动附接和拆卸
US10317460B2 (en) 2013-06-07 2019-06-11 Maxim Integrated Products, Inc. Precision alignment unit for semiconductor trays
KR101611922B1 (ko) * 2014-05-12 2016-04-14 참엔지니어링(주) 기판 검사 장치 및 기판 검사 방법
US9527731B2 (en) * 2014-10-15 2016-12-27 Nxp Usa, Inc. Methodology and system for wafer-level testing of MEMS pressure sensors
US20160116361A1 (en) * 2014-10-28 2016-04-28 Freescale Semiconductor, Inc. System for wafer-level testing of mems pressure sensors
JP6424719B2 (ja) * 2015-04-06 2018-11-21 三菱電機株式会社 半導体試験治具、半導体装置の試験方法
US9885748B2 (en) * 2015-06-09 2018-02-06 International Business Machines Corporation Module testing utilizing wafer probe test equipment
CN106290990A (zh) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 可同时多颗电子元件定位的定位装置及其应用的作业设备
WO2018135707A1 (ko) * 2017-01-17 2018-07-26 주식회사 네패스 반도체 패키지 제조용 트레이
KR101901987B1 (ko) 2017-01-17 2018-09-27 주식회사 네패스 반도체 패키지의 제조 방법
CN108107349A (zh) * 2017-12-26 2018-06-01 上海华岭集成电路技术股份有限公司 一种晶圆和成品测试通用承载板
CN110018405B (zh) * 2018-01-04 2021-10-15 京元电子股份有限公司 半导体元件测试载盘及其测试装置与设备
TWI741715B (zh) * 2020-08-03 2021-10-01 矽品精密工業股份有限公司 承載裝置
WO2022169442A1 (en) * 2021-02-02 2022-08-11 Kla Corporation Three-motors configuration for adjusting wafer tilt and focus
CN118471867B (zh) * 2024-07-13 2024-09-24 中北大学 一种半导体封装测试装置及其测试方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210752A (ja) * 1988-06-29 1990-01-16 Tokyo Electron Ltd 半導体素子の検査装置
JPH0669296A (ja) * 1992-08-19 1994-03-11 Tokyo Electron Ltd 試験装置
JP3183591B2 (ja) * 1993-07-02 2001-07-09 三菱電機株式会社 半導体デバイスのテストシステム、半導体デバイスのテスト方法、半導体デバイス挿抜ステーション及びテスト用チャンバ
JPH07244116A (ja) * 1994-03-07 1995-09-19 Hitachi Chem Co Ltd 半導体特性測定用治具とその製造法並びにその使用方法
US5456360A (en) * 1994-09-30 1995-10-10 The Perkin-Elmer Corporation Holder assembly for reaction tubes
JPH08179007A (ja) 1994-12-22 1996-07-12 Advantest Corp Ｉｃテスタ用ハンドラのチェンジキットの構造
JP2625395B2 (ja) * 1995-01-17 1997-07-02 東京エレクトロン株式会社 Ｉｃハンドラ及びｉｃプロービング方法
JPH08248095A (ja) * 1995-03-14 1996-09-27 Tokyo Electron Ltd 検査装置
DE19631340C2 (de) * 1995-08-04 2000-11-30 Advantest Corp Anordnung zum Testen von ICs
KR20000043520A (ko) * 1998-12-29 2000-07-15 윤종용 테스트 캐리어
JP2000327070A (ja) * 1999-05-18 2000-11-28 Hitachi Ltd 梱包方法および搬送方法ならびに半導体装置の製造方法
JP2001113420A (ja) * 1999-10-19 2001-04-24 Sharp Corp 位置決め方法及びその装置
JP2002202346A (ja) * 2000-12-28 2002-07-19 Yokogawa Electric Corp 位置固定方法、位置固定装置及び位置固定装置を用いたハンドラ
KR100465372B1 (ko) * 2002-05-14 2005-01-13 미래산업 주식회사 반도체 소자 테스트 핸들러용 캐리어 모듈
JP2004160627A (ja) 2002-11-15 2004-06-10 Shinko Electric Ind Co Ltd 位置決め方法及びその装置
JP2004177202A (ja) * 2002-11-26 2004-06-24 Yokogawa Electric Corp 搬送装置
JP2005055244A (ja) * 2003-08-01 2005-03-03 Yokogawa Electric Corp テストトレイ
JP2005345262A (ja) * 2004-06-03 2005-12-15 Niigata Seimitsu Kk 半導体検査装置およびこれに用いる被検査部品トレー
JP4403458B2 (ja) * 2004-10-28 2010-01-27 東洋精密工業株式会社 チップトレイ

Also Published As

Publication number Publication date
JP4832207B2 (ja) 2011-12-07
KR20080013820A (ko) 2008-02-13
TW200815760A (en) 2008-04-01
US20100085070A1 (en) 2010-04-08
US20080036482A1 (en) 2008-02-14
KR100847284B1 (ko) 2008-07-21
JP2008039666A (ja) 2008-02-21
CN101122613B (zh) 2010-12-29
US8022719B2 (en) 2011-09-20
CN101122613A (zh) 2008-02-13
US7652467B2 (en) 2010-01-26

Similar Documents

Publication Publication Date Title
EP2170713A4 (en) CARRIER WITH RETENTION FUNCTIONS
TWI371817B (en) Test tray for test handler
TWI366881B (en) Test tray and handler using the test tray
AU309542S (en) Tray with chocolates
GB2438714B (en) Shim tray
TWI348988B (en) Tray locating-device
GB2440330B (en) Paint-roller tray
GB0604258D0 (en) Carrier tray
GB0607011D0 (en) Egg holder
GB2458658B (en) Parts labelling tray
GB0624431D0 (en) Adaptable support tray
ZA200709680B (en) Tray
GB0623244D0 (en) Tray
AU310797S (en) Bumbo tray
PH32006000130S1 (en) Tray
PH32006000135S1 (en) Tray
PH32007000540S1 (en) Tray component
AU321062S (en) Serving tray
PL378861A1 (pl) Bilonownica
GB0713362D0 (en) Curbo tray
GB0622686D0 (en) Carrier device
PH32007000852S1 (en) Round tray with dividers
GB0814016D0 (en) Instrument tray
GB0605952D0 (en) Carrier
GB0617466D0 (en) Support for an article