TWI352003B - - Google Patents
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- Publication number
- TWI352003B TWI352003B TW097127101A TW97127101A TWI352003B TW I352003 B TWI352003 B TW I352003B TW 097127101 A TW097127101 A TW 097127101A TW 97127101 A TW97127101 A TW 97127101A TW I352003 B TWI352003 B TW I352003B
- Authority
- TW
- Taiwan
- Prior art keywords
- holding member
- wire
- laser welding
- terminal
- core wire
- Prior art date
Links
- 238000003466 welding Methods 0.000 claims description 59
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008068386A JP4384696B2 (ja) | 2008-03-17 | 2008-03-17 | レーザ溶接装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200940230A TW200940230A (en) | 2009-10-01 |
| TWI352003B true TWI352003B (de) | 2011-11-11 |
Family
ID=41090606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097127101A TW200940230A (en) | 2008-03-17 | 2008-07-17 | Laser welding device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4384696B2 (de) |
| KR (1) | KR20090104801A (de) |
| CN (1) | CN101652221A (de) |
| TW (1) | TW200940230A (de) |
| WO (1) | WO2009116186A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6046132B2 (ja) * | 2011-07-01 | 2016-12-14 | デルフィ・インターナショナル・オペレーションズ・ルクセンブルク・エス・アー・エール・エル | ケーブルを端子に溶接する方法およびそれから得られる端子 |
| CN102303188B (zh) * | 2011-07-28 | 2014-01-08 | 武汉凌云光电科技有限责任公司 | 用于极细同轴排线连接器的激光焊接装置及其焊接工艺 |
| CN102581488B (zh) * | 2012-02-27 | 2014-06-18 | 武汉凌云光电科技有限责任公司 | 多芯屏蔽电缆与pcb板的激光锡焊方法及精密快装夹具 |
| CN102756217B (zh) * | 2012-07-10 | 2014-11-26 | 新疆雪峰科技(集团)股份有限公司 | 电子雷管脚线激光焊接夹具及其使用方法 |
| CN103157905B (zh) * | 2013-04-11 | 2015-08-12 | 重庆市灵龙电子有限公司 | 手机马达端盖组件导电端子铜片与电刷插脚激光焊接工艺 |
| CN103427309B (zh) * | 2013-08-20 | 2016-05-18 | 歌尔声学股份有限公司 | 极细同轴线焊接设备及工艺 |
| JP6194265B2 (ja) * | 2014-03-13 | 2017-09-06 | 日立オートモティブシステムズ株式会社 | 溶接用マスク部材及び回路基板の溶接方法 |
| CN105057947A (zh) * | 2015-07-24 | 2015-11-18 | 立讯精密工业(滁州)有限公司 | 焊接治具 |
| CN106304646B (zh) * | 2016-08-30 | 2019-08-27 | 歌尔股份有限公司 | 焊接治具 |
| CN106425139B (zh) * | 2016-11-10 | 2018-07-31 | 上海安费诺永亿通讯电子有限公司 | 一种移动设备天线上微型金属连接器焊接用治具 |
| KR20190079963A (ko) * | 2017-12-28 | 2019-07-08 | 주식회사 디에스시동탄 | 시트백 프레임 레이저 용접용 지그 장치 |
| AT522547A1 (de) * | 2019-04-17 | 2020-11-15 | Miba Automation Systems Ges M B H | Positionierhilfe für Laserschweißen und Positionierverfahren |
| CN110280861A (zh) * | 2019-07-25 | 2019-09-27 | 深圳市升达康科技有限公司 | 焊接机 |
| CN110355469B (zh) * | 2019-07-26 | 2024-11-12 | 湖南大学 | 一种微间距金属pin与芯线的透光式焊接装置及焊接方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05131883A (ja) * | 1991-11-12 | 1993-05-28 | Yazaki Corp | フラツトワイヤハーネスの配索固定方法 |
| JPH06176845A (ja) * | 1992-12-07 | 1994-06-24 | Fujitsu Ten Ltd | 溶着装置 |
| JPH088028A (ja) * | 1994-06-23 | 1996-01-12 | Yazaki Corp | 電線の接続方法および電線接続用挟持体 |
| JP2007326140A (ja) * | 2006-06-09 | 2007-12-20 | Phoeton Corp | レーザ溶接方法 |
-
2008
- 2008-03-17 JP JP2008068386A patent/JP4384696B2/ja active Active
- 2008-07-10 KR KR1020097005260A patent/KR20090104801A/ko not_active Abandoned
- 2008-07-10 CN CN200880000679A patent/CN101652221A/zh active Pending
- 2008-07-10 WO PCT/JP2008/062492 patent/WO2009116186A1/ja not_active Ceased
- 2008-07-17 TW TW097127101A patent/TW200940230A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009220157A (ja) | 2009-10-01 |
| WO2009116186A1 (ja) | 2009-09-24 |
| JP4384696B2 (ja) | 2009-12-16 |
| KR20090104801A (ko) | 2009-10-06 |
| CN101652221A (zh) | 2010-02-17 |
| TW200940230A (en) | 2009-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |