TWI353045B - - Google Patents

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Publication number
TWI353045B
TWI353045B TW093133798A TW93133798A TWI353045B TW I353045 B TWI353045 B TW I353045B TW 093133798 A TW093133798 A TW 093133798A TW 93133798 A TW93133798 A TW 93133798A TW I353045 B TWI353045 B TW I353045B
Authority
TW
Taiwan
Prior art keywords
spacer
electronic component
electrode
substrate
semiconductor device
Prior art date
Application number
TW093133798A
Other languages
English (en)
Chinese (zh)
Other versions
TW200524101A (en
Inventor
Eiji Takaike
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200524101A publication Critical patent/TW200524101A/zh
Application granted granted Critical
Publication of TWI353045B publication Critical patent/TWI353045B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW093133798A 2003-11-07 2004-11-05 Electronic device and process for manufacturing same TW200524101A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003377892 2003-11-07
JP2004130217 2004-04-26
PCT/JP2004/016244 WO2005045925A1 (ja) 2003-11-07 2004-11-01 電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW200524101A TW200524101A (en) 2005-07-16
TWI353045B true TWI353045B (2) 2011-11-21

Family

ID=34575923

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133798A TW200524101A (en) 2003-11-07 2004-11-05 Electronic device and process for manufacturing same

Country Status (6)

Country Link
US (1) US7847411B2 (2)
EP (1) EP1681717B1 (2)
JP (1) JP4351214B2 (2)
KR (1) KR100784454B1 (2)
TW (1) TW200524101A (2)
WO (1) WO2005045925A1 (2)

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JP2006278906A (ja) * 2005-03-30 2006-10-12 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP4716819B2 (ja) * 2005-08-22 2011-07-06 新光電気工業株式会社 インターポーザの製造方法
JP2007170830A (ja) * 2005-12-19 2007-07-05 Fujikura Ltd 半導体圧力センサ及びその製造方法
JP2007184426A (ja) * 2006-01-06 2007-07-19 Shinko Electric Ind Co Ltd 半導体装置の製造方法
KR100771874B1 (ko) * 2006-07-06 2007-11-01 삼성전자주식회사 반도체 탭 패키지 및 그 제조방법
JP4783692B2 (ja) * 2006-08-10 2011-09-28 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法と電子部品装置
US7659151B2 (en) * 2007-04-12 2010-02-09 Micron Technology, Inc. Flip chip with interposer, and methods of making same
JP5238182B2 (ja) * 2007-04-19 2013-07-17 株式会社フジクラ 積層配線基板の製造方法
US9610758B2 (en) 2007-06-21 2017-04-04 General Electric Company Method of making demountable interconnect structure
US9953910B2 (en) * 2007-06-21 2018-04-24 General Electric Company Demountable interconnect structure
JP2009224616A (ja) * 2008-03-17 2009-10-01 Shinko Electric Ind Co Ltd 電子部品内蔵基板及びその製造方法、及び半導体装置
CN101364568B (zh) * 2008-07-10 2011-11-30 旭丽电子(广州)有限公司 镜头模块的制造方法及以该方法所制成的镜头模块
KR101013551B1 (ko) * 2008-08-29 2011-02-14 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
US8383457B2 (en) 2010-09-03 2013-02-26 Stats Chippac, Ltd. Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
USRE48111E1 (en) 2009-08-21 2020-07-21 JCET Semiconductor (Shaoxing) Co. Ltd. Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
US8169058B2 (en) 2009-08-21 2012-05-01 Stats Chippac, Ltd. Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars
US8237278B2 (en) * 2009-11-16 2012-08-07 International Business Machines Corporation Configurable interposer
WO2011101170A1 (de) * 2010-02-22 2011-08-25 Andreas Jakob Verfahren und anordnung zum herstellen eines halbleitermoduls
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JP5537446B2 (ja) * 2011-01-14 2014-07-02 株式会社東芝 発光装置、発光モジュール、発光装置の製造方法
EP4050649A1 (en) * 2011-08-16 2022-08-31 Intel Corporation Offset interposers for large-bottom packages and large-die package-on-package structures
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US9288909B2 (en) * 2012-02-01 2016-03-15 Marvell World Trade Ltd. Ball grid array package substrate with through holes and method of forming same
US9761506B2 (en) * 2012-02-23 2017-09-12 Rohm Co., Ltd. Semiconductor device and fabrication method for the same
JP2014038910A (ja) * 2012-08-13 2014-02-27 Toshiba Corp 光電気集積パッケージモジュール
US9490240B2 (en) * 2012-09-28 2016-11-08 Intel Corporation Film interposer for integrated circuit devices
JP2014072494A (ja) * 2012-10-01 2014-04-21 Toshiba Corp 半導体装置及びその製造方法
US10483132B2 (en) 2012-12-28 2019-11-19 Taiwan Semiconductor Manufacturing Company, Ltd. Post-passivation interconnect structure and method of forming the same
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
JP7145515B2 (ja) * 2017-04-28 2022-10-03 国立研究開発法人産業技術総合研究所 光電子集積回路及びコンピューティング装置
JP6573415B1 (ja) * 2018-11-15 2019-09-11 有限会社アイピーシステムズ ビア配線形成用基板及びビア配線形成用基板の製造方法並びに半導体装置実装部品の製造方法
KR102301877B1 (ko) * 2019-12-27 2021-09-15 웨이브로드 주식회사 반도체 발광소자
US11966090B2 (en) * 2021-03-03 2024-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Heterogeneous packaging integration of photonic and electronic elements
WO2022209438A1 (ja) * 2021-03-29 2022-10-06 株式会社村田製作所 電子部品パッケージ、電子部品ユニットおよび電子部品パッケージの製造方法
US12009272B2 (en) * 2021-11-15 2024-06-11 Texas Instruments Incorporated Integral redistribution layer for WCSP
US20240304440A1 (en) * 2023-03-06 2024-09-12 Fabric8Labs, Inc. Electrochemical-additive manufacturing systems with protected electrode arrays
US20250076599A1 (en) * 2023-09-05 2025-03-06 Taiwan Semiconductor Manufacturing Company Limited Interposer with planar sidewall surface for optical coupling and methods of forming the same

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JP3808030B2 (ja) * 2002-11-28 2006-08-09 沖電気工業株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP1681717A4 (en) 2009-07-29
KR100784454B1 (ko) 2007-12-11
JPWO2005045925A1 (ja) 2007-05-24
TW200524101A (en) 2005-07-16
US7847411B2 (en) 2010-12-07
US20070158832A1 (en) 2007-07-12
WO2005045925A1 (ja) 2005-05-19
EP1681717A1 (en) 2006-07-19
EP1681717B1 (en) 2017-03-29
KR20060080236A (ko) 2006-07-07
JP4351214B2 (ja) 2009-10-28

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