TWI361265B - - Google Patents

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Publication number
TWI361265B
TWI361265B TW096106405A TW96106405A TWI361265B TW I361265 B TWI361265 B TW I361265B TW 096106405 A TW096106405 A TW 096106405A TW 96106405 A TW96106405 A TW 96106405A TW I361265 B TWI361265 B TW I361265B
Authority
TW
Taiwan
Prior art keywords
flow path
heat
heat dissipation
dissipating
refrigerant
Prior art date
Application number
TW096106405A
Other languages
English (en)
Chinese (zh)
Other versions
TW200739014A (en
Inventor
Ohta Haruhiko
Shinmoto Yasuhisa
Original Assignee
Univ Kyushu Nat Univ Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Kyushu Nat Univ Corp filed Critical Univ Kyushu Nat Univ Corp
Publication of TW200739014A publication Critical patent/TW200739014A/zh
Application granted granted Critical
Publication of TWI361265B publication Critical patent/TWI361265B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
TW096106405A 2006-02-22 2007-02-26 Heat removing method and heat removing apparatus TW200739014A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006045558 2006-02-22

Publications (2)

Publication Number Publication Date
TW200739014A TW200739014A (en) 2007-10-16
TWI361265B true TWI361265B (fr) 2012-04-01

Family

ID=38509287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106405A TW200739014A (en) 2006-02-22 2007-02-26 Heat removing method and heat removing apparatus

Country Status (4)

Country Link
US (1) US20090114374A1 (fr)
JP (1) JP4269060B2 (fr)
TW (1) TW200739014A (fr)
WO (1) WO2007105450A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714505A (zh) * 2015-11-13 2017-05-24 鸿富锦精密工业（深圳）有限公司 服务器散热系统

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4552877B2 (ja) * 2006-03-27 2010-09-29 トヨタ自動車株式会社 冷却器
JP4544187B2 (ja) * 2006-03-29 2010-09-15 トヨタ自動車株式会社 冷却器
JP4986064B2 (ja) * 2008-02-27 2012-07-25 アイシン・エィ・ダブリュ株式会社 発熱体冷却装置
FR2993649B1 (fr) * 2012-07-18 2014-08-08 Astrium Sas Dispositif de controle thermique
KR101474616B1 (ko) * 2012-11-02 2014-12-18 삼성전기주식회사 전력반도체장치의 방열시스템
US10436519B1 (en) * 2015-10-14 2019-10-08 The Research Foundation For The State University Of New York Cocurrent loop thermosyphon heat transfer system for sub-ambient evaporative cooling and cool storage
JP6321089B2 (ja) * 2016-07-04 2018-05-09 レノボ・シンガポール・プライベート・リミテッド ベイパーチャンバー及び電子機器
JP2021069993A (ja) * 2019-10-31 2021-05-06 キヤノン株式会社 ウルトラファインバブル生成装置およびその制御方法
US11333445B1 (en) * 2020-08-31 2022-05-17 Mainstream Engineering Corporation Modular membrane controlled three-phase deployable radiator
CN113727472A (zh) * 2021-09-14 2021-11-30 南阳理工学院 实现蜂窝网络重定位的5g基站散热系统
CN113883925B (zh) * 2021-10-18 2022-08-09 西安交通大学 一种均匀液膜蒸发换热器及方法
JP7835007B2 (ja) * 2021-12-23 2026-03-25 富士電機株式会社 冷却装置
WO2024034291A1 (fr) * 2022-08-08 2024-02-15 富士電機株式会社 Refroidisseur et dispositif semi-conducteur
TWI900951B (zh) * 2023-11-30 2025-10-11 艾姆勒科技股份有限公司 具改良型鋁焊道結構的水冷散熱器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100294317B1 (ko) * 1999-06-04 2001-06-15 이정현 초소형 냉각 장치
JP4178850B2 (ja) * 2002-06-25 2008-11-12 ソニー株式会社 冷却装置、電子機器装置、冷却装置の製造方法及びエバポレータ
ES2241948T3 (es) * 2002-12-20 2005-11-01 Innowert Gmbh Dispositivo de refrigeracion para una unidad electrica o electronica.
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
JP3908705B2 (ja) * 2003-08-29 2007-04-25 株式会社東芝 液冷装置及び液冷システム
JP2005259747A (ja) * 2004-03-09 2005-09-22 Sony Corp 熱輸送装置及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106714505A (zh) * 2015-11-13 2017-05-24 鸿富锦精密工业（深圳）有限公司 服务器散热系统

Also Published As

Publication number Publication date
JP4269060B2 (ja) 2009-05-27
WO2007105450A1 (fr) 2007-09-20
US20090114374A1 (en) 2009-05-07
TW200739014A (en) 2007-10-16
JPWO2007105450A1 (ja) 2009-07-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees