TWI374560B - Light emitting diode package employing lead terminal with reflecting surface - Google Patents

Light emitting diode package employing lead terminal with reflecting surface Download PDF

Info

Publication number
TWI374560B
TWI374560B TW096116453A TW96116453A TWI374560B TW I374560 B TWI374560 B TW I374560B TW 096116453 A TW096116453 A TW 096116453A TW 96116453 A TW96116453 A TW 96116453A TW I374560 B TWI374560 B TW I374560B
Authority
TW
Taiwan
Prior art keywords
package
lead end
led
lead
inclined surface
Prior art date
Application number
TW096116453A
Other languages
English (en)
Chinese (zh)
Other versions
TW200812114A (en
Inventor
Hwa Ja Kim
Nam Young Kim
Myung Hee Lee
Kyoung Bo Han
Tae Kwang Kim
Ji Seop So
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Publication of TW200812114A publication Critical patent/TW200812114A/zh
Application granted granted Critical
Publication of TWI374560B publication Critical patent/TWI374560B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
TW096116453A 2006-08-23 2007-05-09 Light emitting diode package employing lead terminal with reflecting surface TWI374560B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060079792 2006-08-23
KR1020070036516A KR100772433B1 (ko) 2006-08-23 2007-04-13 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지

Publications (2)

Publication Number Publication Date
TW200812114A TW200812114A (en) 2008-03-01
TWI374560B true TWI374560B (en) 2012-10-11

Family

ID=39060520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096116453A TWI374560B (en) 2006-08-23 2007-05-09 Light emitting diode package employing lead terminal with reflecting surface

Country Status (6)

Country Link
US (1) US7999280B2 (fr)
EP (3) EP2472617A3 (fr)
JP (1) JP4814178B2 (fr)
KR (1) KR100772433B1 (fr)
TW (1) TWI374560B (fr)
WO (1) WO2008023875A1 (fr)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI329934B (en) * 2007-01-17 2010-09-01 Chi Mei Lighting Tech Corp Lead frame structure of light emitting diode
TWM318792U (en) * 2007-01-23 2007-09-11 Lighthouse Technology Co Ltd Package structure
US20120037886A1 (en) * 2007-11-13 2012-02-16 Epistar Corporation Light-emitting diode device
US20110049552A1 (en) * 2007-12-24 2011-03-03 In Joon Pyeon Light emitting diode package
JP5186930B2 (ja) * 2008-01-24 2013-04-24 豊田合成株式会社 発光装置
JP5236406B2 (ja) * 2008-03-28 2013-07-17 ローム株式会社 半導体発光モジュールおよびその製造方法
JP2010003743A (ja) * 2008-06-18 2010-01-07 Toshiba Corp 発光装置
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
KR101537797B1 (ko) * 2008-06-26 2015-07-22 서울반도체 주식회사 발광장치
KR101488453B1 (ko) * 2008-06-30 2015-02-02 서울반도체 주식회사 다면 리드단자를 갖는 led 패키지 및 그의 표면실장용리드프레임 구조체
KR100986202B1 (ko) * 2008-07-01 2010-10-07 알티전자 주식회사 사이드 뷰 발광 다이오드 패키지
US8258526B2 (en) * 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
CN102144307B (zh) * 2008-07-03 2013-05-22 三星电子株式会社 发光二极管封装件和具有该发光二极管封装件的背光单元
JP2010021259A (ja) * 2008-07-09 2010-01-28 Toshiba Corp 光半導体装置
TWI456784B (zh) * 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
JP5444654B2 (ja) * 2008-07-29 2014-03-19 日亜化学工業株式会社 発光装置
JP5233478B2 (ja) * 2008-07-29 2013-07-10 日亜化学工業株式会社 発光装置
KR101523003B1 (ko) * 2008-09-29 2015-06-25 서울반도체 주식회사 사이드뷰 led 패키지 및 그 제조방법
KR101007131B1 (ko) 2008-11-25 2011-01-10 엘지이노텍 주식회사 발광 소자 패키지
US8288785B2 (en) * 2008-12-03 2012-10-16 Seoul Semiconductor Co., Ltd. Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
JP2010141058A (ja) * 2008-12-10 2010-06-24 Toyoda Gosei Co Ltd 発光装置
JP5212089B2 (ja) * 2008-12-25 2013-06-19 豊田合成株式会社 Led発光装置
US8058667B2 (en) * 2009-03-10 2011-11-15 Nepes Led Corporation Leadframe package for light emitting diode device
US8039862B2 (en) * 2009-03-10 2011-10-18 Nepes Led Corporation White light emitting diode package having enhanced white lighting efficiency and method of making the same
US8120055B2 (en) * 2009-04-20 2012-02-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
JP5496570B2 (ja) * 2009-08-05 2014-05-21 シャープ株式会社 発光装置
US20110125546A1 (en) * 2009-11-20 2011-05-26 Xerox Corporation System, method and computer-usable medium for generating financial data based on long term demand data
EP2365552A3 (fr) 2010-03-09 2015-03-25 LG Innotek Co., Ltd. Boitier d'un dispositif électroluminescent avec une grille de connexion ayant une cavité
US8598612B2 (en) * 2010-03-30 2013-12-03 Micron Technology, Inc. Light emitting diode thermally enhanced cavity package and method of manufacture
KR101047676B1 (ko) * 2010-04-01 2011-07-08 엘지이노텍 주식회사 발광 장치 및 이를 구비한 라이트 유닛
JP5734581B2 (ja) 2010-05-21 2015-06-17 シャープ株式会社 半導体発光装置
US8269244B2 (en) * 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
JP2012049348A (ja) 2010-08-27 2012-03-08 Sharp Corp 発光装置
KR101750559B1 (ko) * 2010-10-13 2017-06-23 엘지디스플레이 주식회사 발광 다이오드 패키지 및 그 제조방법
KR101693642B1 (ko) * 2010-12-21 2017-01-17 삼성전자 주식회사 발광소자 패키지 제조방법
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管(led)发光的部件和方法
KR101865438B1 (ko) 2011-02-10 2018-06-07 니치아 카가쿠 고교 가부시키가이샤 발광 장치, 발광 장치의 제조 방법 및 패키지 어레이
US8480254B2 (en) * 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US9062198B2 (en) 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
WO2012151270A1 (fr) * 2011-05-03 2012-11-08 Cree, Inc. Boîtiers, systèmes et dispositifs à diodes électroluminescentes (del), et procédés associés
JP5993943B2 (ja) * 2011-06-08 2016-09-21 ソウル セミコンダクター カンパニー リミテッド 発光ダイオードパッケージ
JP5978572B2 (ja) 2011-09-02 2016-08-24 日亜化学工業株式会社 発光装置
JP5698633B2 (ja) * 2011-09-21 2015-04-08 株式会社東芝 半導体発光装置、発光モジュール、および半導体発光装置の製造方法
JP5934803B2 (ja) * 2011-11-24 2016-06-15 クリー フイツォー ソリッド ステイト ライティング カンパニー リミテッド 防水型ledデバイス及び防水型ledデバイスを有するledディスプレイ
JP5914933B2 (ja) * 2011-12-21 2016-05-11 住友化学株式会社 半導体用パッケージの製造方法、半導体用パッケージ及び半導体発光装置
JP5923183B2 (ja) 2011-12-30 2016-05-24 ティコナ・エルエルシー 発光デバイス用の反射板
JP5721668B2 (ja) * 2012-06-29 2015-05-20 シャープ株式会社 発光装置、照明装置および表示装置用バックライト
WO2014099745A1 (fr) 2012-12-18 2014-06-26 Ticona Llc Réflecteurs moulés destinés à des ensembles diodes électroluminescentes
TWM462450U (zh) * 2013-01-24 2013-09-21 琉明斯光電科技股份有限公司 發光二極體支架結構
KR101509230B1 (ko) * 2013-08-30 2015-04-10 서울반도체 주식회사 발광 디바이스
US20150176800A1 (en) * 2013-12-25 2015-06-25 I-Chiun Precision Industry Co., Ltd. Supporting base for semiconductor chip
DE102014208960A1 (de) * 2014-05-12 2015-11-12 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements
JP6387787B2 (ja) 2014-10-24 2018-09-12 日亜化学工業株式会社 発光装置、パッケージ及びそれらの製造方法
JP6168096B2 (ja) 2015-04-28 2017-07-26 日亜化学工業株式会社 発光装置、パッケージ及びそれらの製造方法
KR102503215B1 (ko) 2016-03-28 2023-02-24 삼성전자 주식회사 발광 소자 패키지
JP6388012B2 (ja) 2016-09-30 2018-09-12 日亜化学工業株式会社 発光装置
TWI855946B (zh) * 2023-12-18 2024-09-11 友達光電股份有限公司 顯示裝置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
JPS60180176A (ja) * 1984-02-27 1985-09-13 Oki Electric Ind Co Ltd 光結合半導体装置
JPH0799345A (ja) * 1993-09-28 1995-04-11 Nichia Chem Ind Ltd 発光ダイオード
JPH07283352A (ja) * 1994-04-11 1995-10-27 Fujitsu Ltd 半導体装置及びその搬送方法
TW414924B (en) * 1998-05-29 2000-12-11 Rohm Co Ltd Semiconductor device of resin package
JP4009097B2 (ja) * 2001-12-07 2007-11-14 日立電線株式会社 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
JP2004146815A (ja) 2002-09-30 2004-05-20 Sanyo Electric Co Ltd 発光素子
WO2004034529A1 (fr) * 2002-09-30 2004-04-22 Sanyo Electric Co., Ltd. Element electroluminescent
KR100550856B1 (ko) 2003-06-03 2006-02-10 삼성전기주식회사 발광 다이오드(led) 소자의 제조 방법
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
JP2005294736A (ja) 2004-04-05 2005-10-20 Stanley Electric Co Ltd 半導体発光装置の製造方法
JP2005317661A (ja) * 2004-04-27 2005-11-10 Sharp Corp 半導体発光装置およびその製造方法
JP2006024645A (ja) 2004-07-06 2006-01-26 Rohm Co Ltd 半導体発光装置
KR100670918B1 (ko) * 2004-10-15 2007-01-18 (주)대신엘이디 방열 구조를 구비한 led 램프
JP2007042700A (ja) * 2005-08-01 2007-02-15 Matsushita Electric Ind Co Ltd 表面実装型半導体装置
TWI302041B (en) 2006-01-19 2008-10-11 Everlight Electronics Co Ltd Light emitting diode packaging structure

Also Published As

Publication number Publication date
JP4814178B2 (ja) 2011-11-16
WO2008023875A1 (fr) 2008-02-28
EP1892774B1 (fr) 2013-08-28
JP2008053726A (ja) 2008-03-06
EP2472617A2 (fr) 2012-07-04
KR100772433B1 (ko) 2007-11-01
US20080048201A1 (en) 2008-02-28
EP2048719A1 (fr) 2009-04-15
EP2472617A3 (fr) 2013-02-27
US7999280B2 (en) 2011-08-16
TW200812114A (en) 2008-03-01
EP1892774A1 (fr) 2008-02-27

Similar Documents

Publication Publication Date Title
KR100772433B1 (ko) 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지
JP6274271B2 (ja) 発光装置及びその製造方法
US8552453B2 (en) Light emitting device
TWI446568B (zh) 半導體發光裝置
US8314441B2 (en) Optoelectronic component
TW200834980A (en) Optical semiconductor device and manufacturing method thereof
KR20120024452A (ko) 발광 장치의 제조 방법
JP2005317661A (ja) 半導体発光装置およびその製造方法
JP2005197369A (ja) 光半導体装置
CN105261686B (zh) 发光器件封装
JP2013055190A (ja) 発光装置
JP2007103926A (ja) Led照明装置
US20070164408A1 (en) Light emitting diode packaging structure
JP2005026401A (ja) 発光ダイオード
KR100757826B1 (ko) 측면 발광 다이오드 패키지
JP3906199B2 (ja) 発光装置
JP2007208301A (ja) Led照明装置
KR100877775B1 (ko) 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지
CN100573935C (zh) Led封装结构及其制造方法
JP6038528B2 (ja) 発光装置
JP2007201028A (ja) 発光デバイス
JP7057513B2 (ja) 発光装置
KR100737822B1 (ko) 고광택 도금층을 구비하는 리드프레임을 채택한 발광다이오드 패키지
KR100885655B1 (ko) 발광 다이오드 패키지
KR100840208B1 (ko) 발광 다이오드 패키지

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees