TWI379450B - - Google Patents

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Publication number: TWI379450B
Authority: TW; Taiwan
Prior art keywords: light; layer; heat; heat dissipation; type semiconductor
Prior art date: 2008-05-28

Application number

TW97119664A

Other languages

English (en)

Chinese (zh)

Other versions

TW200950180A (en

Inventor

Null Null

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-05-28

Filing date

2008-05-28

Publication date

2012-12-11

2008-05-28 Application filed filed Critical

2008-05-28 Priority to TW97119664A priority Critical patent/TW200950180A/zh

2009-12-01 Publication of TW200950180A publication Critical patent/TW200950180A/zh

2012-12-11 Application granted granted Critical

2012-12-11 Publication of TWI379450B publication Critical patent/TWI379450B/zh

Links

230000017525 heat dissipation Effects 0.000 claims description 46
239000000758 substrate Substances 0.000 claims description 34
239000004065 semiconductor Substances 0.000 claims description 22
238000012546 transfer Methods 0.000 claims description 17
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
229910052799 carbon Inorganic materials 0.000 claims description 16
239000004020 conductor Substances 0.000 claims description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
229910052802 copper Inorganic materials 0.000 claims description 3
239000010949 copper Substances 0.000 claims description 3
239000000463 material Substances 0.000 claims description 3
210000004508 polar body Anatomy 0.000 claims description 3
230000001590 oxidative effect Effects 0.000 claims 1
229910052751 metal Inorganic materials 0.000 description 14
239000002184 metal Substances 0.000 description 14
230000000694 effects Effects 0.000 description 12
238000006243 chemical reaction Methods 0.000 description 9
238000000034 method Methods 0.000 description 8
239000002918 waste heat Substances 0.000 description 8
229910052594 sapphire Inorganic materials 0.000 description 5
239000010980 sapphire Substances 0.000 description 5
238000005253 cladding Methods 0.000 description 3
229910000831 Steel Inorganic materials 0.000 description 2
238000005516 engineering process Methods 0.000 description 2
238000000605 extraction Methods 0.000 description 2
238000004806 packaging method and process Methods 0.000 description 2
238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
239000010959 steel Substances 0.000 description 2
229910000851 Alloy steel Inorganic materials 0.000 description 1
229910000881 Cu alloy Inorganic materials 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
238000005229 chemical vapour deposition Methods 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
238000004020 luminiscence type Methods 0.000 description 1
239000008267 milk Substances 0.000 description 1
210000004080 milk Anatomy 0.000 description 1
235000013336 milk Nutrition 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
238000012827 research and development Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1

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Led Devices (AREA)
Led Device Packages (AREA)

TW97119664A 2008-05-28 2008-05-28 High heat-dissipating LED component and its light-emitting module TW200950180A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW97119664A TW200950180A (en)	2008-05-28	2008-05-28	High heat-dissipating LED component and its light-emitting module

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW97119664A TW200950180A (en)	2008-05-28	2008-05-28	High heat-dissipating LED component and its light-emitting module

Publications (2)

Publication Number	Publication Date
TW200950180A TW200950180A (en)	2009-12-01
TWI379450B true TWI379450B (de)	2012-12-11

Family

ID=44871224

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW97119664A TW200950180A (en)	2008-05-28	2008-05-28	High heat-dissipating LED component and its light-emitting module

Country Status (1)

Country	Link
TW (1)	TW200950180A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI467819B (zh) *	2011-12-23	2015-01-01	Ind Tech Res Inst	發光晶片及發光晶片的製造方法

2008
- 2008-05-28 TW TW97119664A patent/TW200950180A/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
TW200950180A (en)	2009-12-01

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Legal Events

Date	Code	Title	Description
2021-09-11	MM4A	Annulment or lapse of patent due to non-payment of fees