TWI441890B - 改善聚合性材料黏著於金屬表面之方法 - Google Patents

改善聚合性材料黏著於金屬表面之方法 Download PDF

Info

Publication number: TWI441890B
Authority: TW; Taiwan
Prior art keywords: metal surface; acidic aqueous; composition; copper; adhesion promoting
Prior art date: 2009-05-06

Application number

TW099111728A

Other languages

English (en)

Chinese (zh)

Other versions

TW201041995A (en

Inventor

Kesheng Feng

Steven A Castaldi

Original Assignee

Macdermid Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-05-06

Filing date

2010-04-15

Publication date

2014-06-21

2010-04-15 Application filed by Macdermid Inc filed Critical Macdermid Inc

2010-12-01 Publication of TW201041995A publication Critical patent/TW201041995A/zh

2014-06-21 Application granted granted Critical

2014-06-21 Publication of TWI441890B publication Critical patent/TWI441890B/zh

Links

229910052751 metal Inorganic materials 0.000 title claims description 55
239000002184 metal Substances 0.000 title claims description 55
238000000034 method Methods 0.000 title claims description 48
239000000463 material Substances 0.000 title description 24
230000008569 process Effects 0.000 title description 3
239000000203 mixture Substances 0.000 claims description 55
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
229910052802 copper Inorganic materials 0.000 claims description 39
239000010949 copper Substances 0.000 claims description 39
230000001737 promoting effect Effects 0.000 claims description 30
230000002378 acidificating effect Effects 0.000 claims description 22
239000002253 acid Substances 0.000 claims description 21
-1 halide ion Chemical class 0.000 claims description 13
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
238000005470 impregnation Methods 0.000 claims description 10
239000007864 aqueous solution Substances 0.000 claims description 9
239000007800 oxidant agent Substances 0.000 claims description 9
239000002952 polymeric resin Substances 0.000 claims description 9
229920003002 synthetic resin Polymers 0.000 claims description 9
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
238000005260 corrosion Methods 0.000 claims description 8
230000007797 corrosion Effects 0.000 claims description 8
239000003112 inhibitor Substances 0.000 claims description 8
229920003169 water-soluble polymer Polymers 0.000 claims description 7
229920001223 polyethylene glycol Polymers 0.000 claims description 6
238000005507 spraying Methods 0.000 claims description 6
229910052500 inorganic mineral Inorganic materials 0.000 claims description 5
239000011707 mineral Substances 0.000 claims description 5
229920001577 copolymer Polymers 0.000 claims description 4
229920000642 polymer Polymers 0.000 claims description 4
IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
239000002202 Polyethylene glycol Substances 0.000 claims description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 2
229920001451 polypropylene glycol Polymers 0.000 claims description 2
229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
150000003536 tetrazoles Chemical class 0.000 claims description 2
150000003852 triazoles Chemical group 0.000 claims description 2
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims 1
229910001508 alkali metal halide Inorganic materials 0.000 claims 1
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 1
239000012964 benzotriazole Substances 0.000 claims 1
238000007766 curtain coating Methods 0.000 claims 1
238000003618 dip coating Methods 0.000 claims 1
150000003839 salts Chemical class 0.000 claims 1
239000010410 layer Substances 0.000 description 38
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 19
239000005751 Copper oxide Substances 0.000 description 19
229910000431 copper oxide Inorganic materials 0.000 description 19
239000011248 coating agent Substances 0.000 description 11
238000000576 coating method Methods 0.000 description 11
239000002131 composite material Substances 0.000 description 11
239000000758 substrate Substances 0.000 description 7
239000002318 adhesion promoter Substances 0.000 description 6
230000032798 delamination Effects 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 6
230000015572 biosynthetic process Effects 0.000 description 5
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
238000004090 dissolution Methods 0.000 description 4
238000001465 metallisation Methods 0.000 description 4
235000010755 mineral Nutrition 0.000 description 4
229910000679 solder Inorganic materials 0.000 description 4
239000011889 copper foil Substances 0.000 description 3
230000006872 improvement Effects 0.000 description 3
YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 3
239000011159 matrix material Substances 0.000 description 3
230000009467 reduction Effects 0.000 description 3
239000000243 solution Substances 0.000 description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
229910000881 Cu alloy Inorganic materials 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
239000011260 aqueous acid Substances 0.000 description 2
150000001875 compounds Chemical class 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
238000000151 deposition Methods 0.000 description 2
230000008021 deposition Effects 0.000 description 2
239000003989 dielectric material Substances 0.000 description 2
150000004820 halides Chemical class 0.000 description 2
239000000976 ink Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
230000001590 oxidative effect Effects 0.000 description 2
229920002120 photoresistant polymer Polymers 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
238000001878 scanning electron micrograph Methods 0.000 description 2
238000000926 separation method Methods 0.000 description 2
239000004094 surface-active agent Substances 0.000 description 2
KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Substances C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 1
BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 1
206010067484 Adverse reaction Diseases 0.000 description 1
GXIWMALOYDSQMW-UHFFFAOYSA-N ClCl(=O)=O Chemical compound ClCl(=O)=O GXIWMALOYDSQMW-UHFFFAOYSA-N 0.000 description 1
JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
230000004913 activation Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
230000001464 adherent effect Effects 0.000 description 1
230000006838 adverse reaction Effects 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
150000001556 benzimidazoles Chemical class 0.000 description 1
150000001565 benzotriazoles Chemical class 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
230000003197 catalytic effect Effects 0.000 description 1
239000003518 caustics Substances 0.000 description 1
230000008859 change Effects 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000003638 chemical reducing agent Substances 0.000 description 1
BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
229940112669 cuprous oxide Drugs 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
125000001475 halogen functional group Chemical group 0.000 description 1
229920001519 homopolymer Polymers 0.000 description 1
150000002460 imidazoles Chemical class 0.000 description 1
238000007654 immersion Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
150000002978 peroxides Chemical class 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920001983 poloxamer Polymers 0.000 description 1
239000002861 polymer material Substances 0.000 description 1
VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
239000001103 potassium chloride Substances 0.000 description 1
235000011164 potassium chloride Nutrition 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
150000003242 quaternary ammonium salts Chemical class 0.000 description 1
230000004044 response Effects 0.000 description 1
239000011780 sodium chloride Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
239000002344 surface layer Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/40—Metallic substrate based on other transition elements
- B05D2202/45—Metallic substrate based on other transition elements based on Cu
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/102—Pretreatment of metallic substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Laminated Bodies (AREA)
ing And Chemical Polishing (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

TW099111728A 2009-05-06 2010-04-15 改善聚合性材料黏著於金屬表面之方法 TWI441890B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US12/436,260 US8512504B2 (en)	2009-05-06	2009-05-06	Process for improving adhesion of polymeric materials to metal surfaces

Publications (2)

Publication Number	Publication Date
TW201041995A TW201041995A (en)	2010-12-01
TWI441890B true TWI441890B (zh)	2014-06-21

Family

ID=43050346

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW099111728A TWI441890B (zh)	2009-05-06	2010-04-15	改善聚合性材料黏著於金屬表面之方法

Country Status (6)

Country	Link
US (1)	US8512504B2 (fr)
EP (1)	EP2408573A4 (fr)
JP (1)	JP2012526200A (fr)
CN (1)	CN102413950A (fr)
TW (1)	TWI441890B (fr)
WO (1)	WO2010129104A1 (fr)

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WO2010064630A1 (fr) *	2008-12-02	2010-06-10	大日本印刷株式会社	Matériau de blindage contre les ondes électromagnétiques et son procédé de fabrication
CN102963000B (zh) *	2012-06-04	2014-11-05	刘阜东	一种超高分子量聚乙烯膜片与金属板的粘结方法
JP6225467B2 (ja) *	2012-06-06	2017-11-08	三菱瓦斯化学株式会社	プリント配線板用銅箔およびその製造方法ならびにその銅箔を用いたプリント配線板
US20170174894A1 (en) *	2015-12-17	2017-06-22	Sri Chaitra Chavali	Stress tolerant composite material and architecture
JP6870245B2 (ja) *	2016-09-06	2021-05-12	昭和電工マテリアルズ株式会社	銅製部材の表面処理方法及び半導体実装用基板の製造方法
CN114174557A (zh) *	2019-07-30	2022-03-11	三菱瓦斯化学株式会社	组合物、使用其的不锈钢表面的粗糙化处理方法以及粗糙化处理过的不锈钢及其制造方法

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2009
- 2009-05-06 US US12/436,260 patent/US8512504B2/en active Active
2010
- 2010-03-25 EP EP10772419.7A patent/EP2408573A4/fr not_active Withdrawn
- 2010-03-25 CN CN2010800200629A patent/CN102413950A/zh active Pending
- 2010-03-25 WO PCT/US2010/028601 patent/WO2010129104A1/fr not_active Ceased
- 2010-03-25 JP JP2012509819A patent/JP2012526200A/ja active Pending
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EP2408573A1 (fr)	2012-01-25
JP2012526200A (ja)	2012-10-25
TW201041995A (en)	2010-12-01
CN102413950A (zh)	2012-04-11
EP2408573A4 (fr)	2016-04-13
US20100282393A1 (en)	2010-11-11
WO2010129104A1 (fr)	2010-11-11
US8512504B2 (en)	2013-08-20

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