JPH0713304B2 - 銅の表面処理法 - Google Patents

銅の表面処理法

Info

Publication number
JPH0713304B2
JPH0713304B2 JP62315750A JP31575087A JPH0713304B2 JP H0713304 B2 JPH0713304 B2 JP H0713304B2 JP 62315750 A JP62315750 A JP 62315750A JP 31575087 A JP31575087 A JP 31575087A JP H0713304 B2 JPH0713304 B2 JP H0713304B2
Authority
JP
Japan
Prior art keywords
copper
copper surface
treatment
composition
aqueous solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62315750A
Other languages
English (en)
Other versions
JPH01156479A (ja
Inventor
昭士 中祖
智子 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP62315750A priority Critical patent/JPH0713304B2/ja
Priority to EP88306625A priority patent/EP0321067B1/en
Priority to DE8888306625T priority patent/DE3874867T2/de
Priority to US07/224,911 priority patent/US4902551A/en
Priority to KR1019880009708A priority patent/KR910001549B1/ko
Publication of JPH01156479A publication Critical patent/JPH01156479A/ja
Priority to KR1019900018958A priority patent/KR910000573B1/ko
Priority to SG1309/92A priority patent/SG130992G/en
Publication of JPH0713304B2 publication Critical patent/JPH0713304B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は，多層プリント配線板を製造する際に，内層回
路板とプリプレグとを積層一体化する工程において内層
回路板上の銅とプリプレグとの接着に適した銅表面の処
理方法に関する。
（従来の技術） 従来，多層プリント配線板は，銅張積層板の銅箔の不要
な部分をエッチング等によって除去して内層回路を形成
し，内層回路の銅表面を化学液で粗化し，粗化した表面
を酸化処理し，プリプレグ及び外層回路となる銅箔をそ
の上に重ねて積層一体化し，外層回路及び内層回路の接
続を必要とする箇所に穴をあけ，その穴内面に付着した
樹脂やガラスの片を化学液で除去した後に無電解めっき
等を用いて銅等の金属層を形成し，外層回路をエッチン
グ等によって形成することによって，製造されていた。
このとき，穴内面に露出した銅表面の酸化処理層が，そ
の後の酸性の化学処理液に侵され，穴の周囲の内層銅箔
とプリプレグの接着が維持されない部分（ハローイング
という）ができ，はんだ付け等の熱衝撃によって乖離す
るという問題があったので、酸化銅より酸性の化学処理
液に溶け難い表面を形成するために，特開昭56−153797
に開示されているように，酸化銅を形成した後に水素化
ホウ素ナトリウム，ホルムアルデヒド等のアルカリ溶液
に浸漬してその表面を還元することが行われていた。
（発明が解決しようとする問題点） 水素化ホウ素ナトリウムを用いて酸化銅を還元した場合
は，処理後の外観がむらになりプリプレグとの接着が不
充分な場合がある。
また，ホルムアルデヒドの水溶液の場合は，処理速度が
小さいという問題が発生した。この原因として、鋭意研
究の結果，酸化処理した銅表面をホルムアルデヒドの水
溶液に接触させ銅のAg−AgCl電極に対する電位が−400m
Vより貴の電位である場合に還元処理速度が小さくなる
ことが分かった。
本発明は，このような問題を解決し，接着が充分に行え
処理速度の大きい酸化処理した銅表面の処理方法に関す
る。
（問題点を解決する手段） 本発明は，以下の工程を以下の順に含む処理工程によっ
て銅表面に形成した酸化銅を金属銅に還元することを特
徴とする銅の表面処理法である。
a.銅表面を酸化剤を含む水溶液と接触させて，銅表面に
酸化銅を形成する工程。
b.酸化処理した銅表面を水素化ホウ素アルカリを含む水
溶液と接触させることによって，酸化処理した銅表面の
電位をAg−AgCl電極に対して−1000mV以上で−400mV以
下の範囲内に変化させる工程。
c.ホルムアルデヒドを含む水溶液と接触させることによ
って，酸化処理した銅表面の電位をAg−AgCl電極に対し
て−1000mVよりも卑な電位に変化させる工程。
本発明において，工程ａの銅表面に酸化銅を形成する方
法は，一般に知られている亜塩素酸ナトリウム，過硫酸
アルカリ，塩素酸カリウム，過塩素酸カリウム等の酸化
剤を含む処理液に浸漬又はその処理液を吹き付けて行
う。この銅の酸化処理液組成の一例は， NaClO2;30〜150g/ Na3PO4・12H2O;10〜60g/ NaOH;5〜30g/ である。また，その処理条件は，液温が55〜95℃であ
る。さらに，酸化銅を形成するための銅表面の前処理と
して，脱脂を行い，過硫酸アンモニウム水溶液又は塩化
第二銅と塩酸とを含む水溶液等に接触させて銅表面を粗
化することが好ましい。
工程ｂで使用する還元剤である水素化ホウ素アルカリと
は，水素化ホウ素ナトリウムや水素化ホウ素カリウム等
である。この水素化ホウ素アルカリの濃度は，酸化処理
した銅表面の電位の変化する速度と，還元後の外観の均
一性とに影響する。その濃度は,0.1g/以上，好ましく
は0.2〜5g/で用いる。
また，水素化ホウ素アルカリは自然分解し易いので，抑
制するために，酢酸鉛，塩化鉛，硫酸鉛又はチオグリコ
ール酸を添加することが好ましく，また,pHを10〜13.5
に維持することによっても可能である。
酸化処理した銅表面と水素化ホウ素アルカリの接触時間
は極めて重要である。酸化処理した銅表面を水素化ホウ
素アルカリに接触させると，酸化銅が還元され始め，酸
化処理した銅表面の電位が卑の方へ変化していく。この
とき，電位が−1000mVより卑になるまで接触時間を長く
すると，外観に不均一を発生し，接着強度が大きくなら
ないこともある。このような問題の発生しない範囲が，
−1000mV以上で−400mV以下である。実際には，常に電
位の監視をする必要はなく，水素化ホウ素アルカリを含
む水溶液の組成と温度によって，望ましい接触時間が決
定できる。一例として，水素化ホウ素ナトリウムの場
合，濃度;1g/,pH;12.5,温度;40℃のときの望ましい接
触時間は３〜180秒である。
工程ｃで用いるホルムアルデヒドの水溶液の濃度は,36
％ホルマリンを使用した場合,0.5ml/以上で,2〜15ml/
が好ましい範囲である。また，このホルムアルデヒド
の水溶液のpHは９以上，好ましくは10.5以上である。こ
のpHを調整するには，水酸化アルカリ等を用いる。
このホルムアルデヒドを含む水溶液に，酸化処理をし工
程ｂの処理をした銅表面を接触させると，初期の銅の電
位は−1000mV〜−400mVの範囲にあり，接触を継続する
と金属銅の電位である−1000mVより卑に変化する。この
ホルムアルデヒドに接触をさせる時間は，銅の電位が−
1000mVより卑に変化するまでの時間が必要である。実際
には，工程ｂと同様にホルムアルデヒドを含む水溶液の
組成，濃度，温度を定めて望ましい接触時間に替えるこ
とができる。一例として,36％ホルマリンを，濃度;4ml/
,pH;12.5,温度;50℃のときの望ましい接触時間は,180
秒である。
工程ｂの処理を行った銅表面は，そのまま工程ｃの処理
をすることもでき，水洗して工程ｃの処理をしてもよ
い。
また，本発明は，多層プリント配線板の内層回路表面の
処理のみでなく，プリント配線板の外層回路の表面処
理，銅箔と絶縁材との貼り合わせ等にも用いることがで
きる。
実施例 あらかじめ，内層回路を形成した内層回路板を過硫酸ア
ンモニウム水溶液で粗化した後，以下の組成，条件で処
理して，内層回路の銅表面に酸化銅を形成した。
組成 水酸化ナトリウム;15g/ リン酸三ナトリウム;30g/ （Na3PO4・12H2O） 亜塩素酸ナトリウム;90g/ 水；以上の組成物と合わせて１となる量 条件 液温;85℃ 処理時間;90秒 次に，水洗した後以下の組成，条件で処理した。
組成 水素化ホウ素ナトリウム;1g/ 水；組成物と合わせて１となる量 条件 pH;12.5 液温;40℃ 処理時間;40秒 次に，以下の組成，条件で処理した。
組成 36％ホルマリン;4ml/ 水；組成物と合わせて１となる量 条件 pH;12.5 液温;50℃ 処理時間;5分 以上のように処理した内層回路板を，水洗し,80℃で30
分乾燥した後，この両側にエポキシ変性ポリイミド樹脂
プリプレグであるＩ−67（日立化成工業株式会社，商品
名）で挟みさらにその両外側を35μｍの銅箔で挟んで積
み重ね，圧力50kg/cm2,温度170℃，時間90分の条件で加
熱加圧して積層一体化した試験片を作成した。
比較例１ あらかじめ，内層回路を形成した内層回路板を過硫酸ア
ンモニウム水溶液で粗化した後，以下の組成，条件で処
理して，内層回路の銅表面に酸化銅を形成した。
組成 水酸化ナトリウム;15g/ リン酸３ナトリウム;30g/ （Na3PO4・12H2O） 亜塩素酸ナトリウム;90g/ 水；以上の組成物と合わせて１となる量 条件 液温;85℃ 処理時間;90秒 次に，水洗した後以下の組成，条件で処理した。
組成 水素化ホウ素ナトリウム;1g/ 水；組成物と合わせて１となる量 条件 pH;12.5 液温;40℃ 処理時間;10分 以上のように処理した内層回路板を，水洗し,80℃で30
分乾燥した後，この両側にエポキシ変性ポリイミド樹脂
プリプレグであるＩ−67（日立化成工業株式会社，商品
名）で挟みさらにその両外側を35μｍの銅箔で挟んで積
み重ね，圧力50kg/cm2,温度170℃，時間90分の条件で加
熱加圧して積層一体化した試験片を作成した。
比較例２ あらかじめ，内層回路を形成した内層回路板を過硫酸ア
ンモニウム水溶液で粗化した後，以下の組成，条件で処
理して，内層回路の銅表面に酸化銅を形成した。
組成 水酸化ナトリウム;15g/ リン酸三ナトリウム;30g/ （Na3PO4・12H2O） 亜塩素酸ナトリウム;90g/ 水；以上の組成物と合わせて１となる量 条件 液温;85℃ 処理時間;90秒 次に，水洗した後以下の組成，条件で処理した。
組成 36％ホルマリリン;4ml/ 水；組成物と合わせて１となる量 条件 pH;12.5 液温;50℃ 処理時間;5分 以上のように処理した内層回路板を，水洗し,80℃で30
分乾燥した後，この両側にエポキシ変性ポリイミド樹脂
プリプレグであるＩ−67（日立化成工業株式会社，商品
名）で挟みさらにその両外側を35μｍの銅箔で挟んで積
み重ね，圧力50kg/cm2,温度170℃，時間90分の条件で加
熱加圧して積層一体化した試験片を作成した。
以上のようにして作成した各々の試験片に以下の試験を
行った。その結果を第１表に示す。
（１）内層銅箔引き剥がし試験 試験法;JIS−C6481 （２）耐塩酸試験 試験法； 130mm×130mmの大きさに切断加工 表面銅箔を除去 直径1mmの穴を30箇所にあける 19％塩酸に浸漬 塩酸が内層に浸み込む時間の測定 （３）耐無電解めっき液試験 試験法； 130mm×130mmの大きさに切断加工 表面銅箔を除去 直径1mmの穴を30箇所にあける 以下の無電解めっき液に浸漬 組成 CuSO4・5H2O:10g/ EDTA・2Na:30g/ 36％ホルマリン:5ml/ 純水：組成物と合わせて１となる量 条件 温度:70℃ pH:12.5 無電解めっき液が内層に浸み込む時間の測定 （発明の効果） 以上に説明したように，本発明によって外観が均一で処
理むらのない表面が得られ，接着強度が増し，また，工
程内での酸性の処理液等に耐性のある表面処理方法を提
供することができる。

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】以下の工程を以下の順に含む処理工程によ
    って銅表面に形成した酸化銅を金属銅に還元することを
    特徴とする銅の表面処理法。 a.銅表面を酸化剤を含む水溶液と接触させて，銅表面に
    酸化銅を形成する工程。 b.酸化処理した銅表面を水素化ホウ素アルカリを含む水
    溶液と接触させることによって，酸化処理した銅表面の
    電位をAg−AgCl電極に対して−1000mV以上で−400mV以
    下の範囲内に変化させる工程。 c.ホルムアルデヒドを含む水溶液と接触させることによ
    って，酸化処理した銅表面の電位をAg−AgCl電極に対し
    て−1000mVよりも卑な電位に変化させる工程。
JP62315750A 1987-12-14 1987-12-14 銅の表面処理法 Expired - Lifetime JPH0713304B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP62315750A JPH0713304B2 (ja) 1987-12-14 1987-12-14 銅の表面処理法
EP88306625A EP0321067B1 (en) 1987-12-14 1988-07-20 Process for treating copper surface
DE8888306625T DE3874867T2 (de) 1987-12-14 1988-07-20 Verfahren zur behandlung einer kupferoberflaeche.
US07/224,911 US4902551A (en) 1987-12-14 1988-07-27 Process for treating copper surface
KR1019880009708A KR910001549B1 (ko) 1987-12-14 1988-07-30 구리표면의 처리방법과 이를 이용한 구리-피착 라미네이트 및 필름
KR1019900018958A KR910000573B1 (ko) 1987-12-14 1990-11-22 다층 배선판
SG1309/92A SG130992G (en) 1987-12-14 1992-12-21 Process for treating copper surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62315750A JPH0713304B2 (ja) 1987-12-14 1987-12-14 銅の表面処理法

Publications (2)

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JPH01156479A JPH01156479A (ja) 1989-06-20
JPH0713304B2 true JPH0713304B2 (ja) 1995-02-15

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US (1) US4902551A (ja)
EP (1) EP0321067B1 (ja)
JP (1) JPH0713304B2 (ja)
KR (1) KR910001549B1 (ja)
DE (1) DE3874867T2 (ja)
SG (1) SG130992G (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9066690B2 (en) 2007-09-27 2015-06-30 Covidien Lp Blood collection needle assembly
US10522444B2 (en) 2013-03-11 2019-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Surface treatment method and apparatus for semiconductor packaging

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633069A (en) * 1989-02-23 1997-05-27 Fuji Xerox Co., Ltd. Multilayer printed-circuit substrate, wiring substrate and process of producing the same
US5120384A (en) * 1989-05-25 1992-06-09 Matsushita Electric Works, Ltd. Method of manufacturing multilayer laminate
JPH0387092A (ja) * 1989-06-15 1991-04-11 Matsushita Electric Works Ltd 内層用回路板の銅回路の処理方法
US4997722A (en) * 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
GB2243577A (en) * 1990-05-07 1991-11-06 Compeq Manufacturing Co Limite A method of bonding copper and resin
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
DE69112181T2 (de) * 1990-11-30 1996-05-09 Toppan Printing Co Ltd Verfahren zur Herstellung einer Mehrschichtverdrahtungsplatine.
US5147492A (en) * 1991-02-20 1992-09-15 Compeq Manufacturing Co., Ltd. Method of bonding copper and resin
US5128008A (en) * 1991-04-10 1992-07-07 International Business Machines Corporation Method of forming a microelectronic package having a copper substrate
IT1256851B (it) * 1992-01-21 1995-12-27 Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.
JP2783133B2 (ja) * 1993-09-29 1998-08-06 松下電器産業株式会社 ワイヤボンディング前処理方法
DE4337988A1 (de) * 1993-11-06 1995-05-11 Hoellmueller Maschbau H Verfahren zur Herstellung von Multilayern sowie Vorrichtung zur Durchführung dieses Verfahrens
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
TW470734B (en) * 1994-01-31 2002-01-01 Matsushita Electric Works Ltd Method of coating a copper film on a ceramic substrate
JP3395854B2 (ja) * 1994-02-02 2003-04-14 日立化成工業株式会社 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
FR2726205B1 (fr) * 1994-10-28 1997-09-26 Motorola Inc Procede destine a reduire le temps de demarrage dans un bain autocatalytique
JP3400164B2 (ja) * 1995-01-23 2003-04-28 三井金属鉱業株式会社 多層プリント配線板およびその製造方法
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US5976228A (en) * 1997-09-15 1999-11-02 The Dexter Corporation Reducing agent for forming an acid resistant barrier
US6120639A (en) * 1997-11-17 2000-09-19 Macdermid, Incorporated Method for the manufacture of printed circuit boards
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US6294220B1 (en) 1999-06-30 2001-09-25 Alpha Metals, Inc. Post-treatment for copper on printed circuit boards
US6221176B1 (en) * 1999-03-17 2001-04-24 Gould Electronics, Inc. Surface treatment of copper to prevent microcracking in flexible circuits
WO2001088972A1 (en) * 2000-05-15 2001-11-22 Asm Microchemistry Oy Process for producing integrated circuits
US7494927B2 (en) * 2000-05-15 2009-02-24 Asm International N.V. Method of growing electrical conductors
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
JP4191881B2 (ja) 2000-08-10 2008-12-03 メルテックス株式会社 銅酸化物還元用の処理液および処理方法
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
JP4618466B2 (ja) * 2000-10-11 2011-01-26 日立化成工業株式会社 銅の表面処理法
US20040161545A1 (en) * 2000-11-28 2004-08-19 Shipley Company, L.L.C. Adhesion method
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20060065365A1 (en) * 2004-09-30 2006-03-30 Ferrier Donald R Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
US7588835B2 (en) 2005-03-11 2009-09-15 Hitachi Chemical Company, Ltd. Method of treating the surface of copper and copper
US8025922B2 (en) 2005-03-15 2011-09-27 Asm International N.V. Enhanced deposition of noble metals
US7666773B2 (en) 2005-03-15 2010-02-23 Asm International N.V. Selective deposition of noble metal thin films
US20070014919A1 (en) * 2005-07-15 2007-01-18 Jani Hamalainen Atomic layer deposition of noble metal oxides
US20090297840A1 (en) * 2006-04-10 2009-12-03 Linea Tergi Ltd. Method for applying a metal on paper
DE602007001344D1 (de) * 2006-04-10 2009-07-30 Linea Tergi Ltd Verfahren zur applizierung eines metalls auf ein substrat
US20080047134A1 (en) * 2006-08-02 2008-02-28 Fujikura Ltd. Method of manufacturing flexible printed circuit board
US7704562B2 (en) * 2006-08-14 2010-04-27 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US7435484B2 (en) * 2006-09-01 2008-10-14 Asm Japan K.K. Ruthenium thin film-formed structure
JP5109399B2 (ja) * 2006-09-06 2012-12-26 日立化成工業株式会社 銅の表面処理方法
US20080124484A1 (en) * 2006-11-08 2008-05-29 Asm Japan K.K. Method of forming ru film and metal wiring structure
US20080171436A1 (en) * 2007-01-11 2008-07-17 Asm Genitech Korea Ltd. Methods of depositing a ruthenium film
US20090087339A1 (en) * 2007-09-28 2009-04-02 Asm Japan K.K. METHOD FOR FORMING RUTHENIUM COMPLEX FILM USING Beta-DIKETONE-COORDINATED RUTHENIUM PRECURSOR
JP2009097034A (ja) * 2007-10-16 2009-05-07 Hitachi Chem Co Ltd 銅の表面処理法
KR101544198B1 (ko) 2007-10-17 2015-08-12 한국에이에스엠지니텍 주식회사 루테늄 막 형성 방법
US7655564B2 (en) * 2007-12-12 2010-02-02 Asm Japan, K.K. Method for forming Ta-Ru liner layer for Cu wiring
TW200927481A (en) * 2007-12-18 2009-07-01 Wen-Jung Jiang Method of producing ceramic-copper foil laminated board
KR20090067505A (ko) * 2007-12-21 2009-06-25 에이에스엠지니텍코리아 주식회사 루테늄막 증착 방법
US7799674B2 (en) * 2008-02-19 2010-09-21 Asm Japan K.K. Ruthenium alloy film for copper interconnects
US8084104B2 (en) * 2008-08-29 2011-12-27 Asm Japan K.K. Atomic composition controlled ruthenium alloy film formed by plasma-enhanced atomic layer deposition
US8133555B2 (en) 2008-10-14 2012-03-13 Asm Japan K.K. Method for forming metal film by ALD using beta-diketone metal complex
US9379011B2 (en) 2008-12-19 2016-06-28 Asm International N.V. Methods for depositing nickel films and for making nickel silicide and nickel germanide
US7927942B2 (en) 2008-12-19 2011-04-19 Asm International N.V. Selective silicide process
US8088246B2 (en) * 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US8512504B2 (en) 2009-05-06 2013-08-20 Steven A. Castaldi Process for improving adhesion of polymeric materials to metal surfaces
US20110020546A1 (en) * 2009-05-15 2011-01-27 Asm International N.V. Low Temperature ALD of Noble Metals
US8897023B2 (en) * 2009-05-15 2014-11-25 Hamilton Sundstrand Corporation Motor controller assembly with capacitor thermal isolation
US8329569B2 (en) * 2009-07-31 2012-12-11 Asm America, Inc. Deposition of ruthenium or ruthenium dioxide
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
US8871617B2 (en) 2011-04-22 2014-10-28 Asm Ip Holding B.V. Deposition and reduction of mixed metal oxide thin films
US9070750B2 (en) 2013-03-06 2015-06-30 Novellus Systems, Inc. Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment
US9865501B2 (en) 2013-03-06 2018-01-09 Lam Research Corporation Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US9469912B2 (en) 2014-04-21 2016-10-18 Lam Research Corporation Pretreatment method for photoresist wafer processing
DE102014210483A1 (de) * 2014-06-03 2015-12-03 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung
US9472377B2 (en) 2014-10-17 2016-10-18 Lam Research Corporation Method and apparatus for characterizing metal oxide reduction
US9607842B1 (en) 2015-10-02 2017-03-28 Asm Ip Holding B.V. Methods of forming metal silicides
US10820414B2 (en) 2016-12-05 2020-10-27 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US10443146B2 (en) 2017-03-30 2019-10-15 Lam Research Corporation Monitoring surface oxide on seed layers during electroplating
JP2020070386A (ja) * 2018-11-01 2020-05-07 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法
KR102153251B1 (ko) * 2020-01-16 2020-09-07 정일범 다이어프램의 제조방법
KR102953798B1 (ko) 2020-06-24 2026-04-15 에이에스엠 아이피 홀딩 비.브이. 몰리브덴을 포함하는 막의 기상 증착

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198672A (en) * 1960-08-18 1965-08-03 Internat Protected Metals Inc Preparation of cupric oxide surfaces
US3551304A (en) * 1965-07-12 1970-12-29 Bausch & Lomb Method for producing a composite article
CA949859A (en) * 1970-07-30 1974-06-25 Olin Corporation Method of producing tarnish resistant film on copper and copper alloys
US4020225A (en) * 1975-02-07 1977-04-26 Maruzen Oil Co. Ltd. Metal clad laminate composed of flame resistant thermosetting resin composition
DE2623695C2 (de) * 1976-05-26 1984-06-20 Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo Verfahren zur Herstellung eines leitfähigen, gehärteten Produktes
US4409037A (en) * 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
DE3609239A1 (de) * 1985-03-27 1986-10-30 Duropal-Werk Eberh. Wrede GmbH & Co KG, 5760 Arnsberg Verfahren zur herstellung einer plattenartigen matrize
GB8613960D0 (en) * 1986-06-09 1986-07-16 Omi International Gb Ltd Treating laminates

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9066690B2 (en) 2007-09-27 2015-06-30 Covidien Lp Blood collection needle assembly
US10522444B2 (en) 2013-03-11 2019-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Surface treatment method and apparatus for semiconductor packaging
US10811338B2 (en) 2013-03-11 2020-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Surface treatment method and apparatus for semiconductor packaging
US11776880B2 (en) 2013-03-11 2023-10-03 Taiwan Semiconductor Manufacturing Company, Ltd. Surface treatment method and apparatus for semiconductor packaging

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US4902551A (en) 1990-02-20
EP0321067A1 (en) 1989-06-21
JPH01156479A (ja) 1989-06-20
DE3874867D1 (de) 1992-10-29
DE3874867T2 (de) 1993-03-04
KR910001549B1 (ko) 1991-03-15
SG130992G (en) 1993-03-12
EP0321067B1 (en) 1992-09-23
KR890010277A (ko) 1989-08-07

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