TWI456830B - 天線結構的製造方法 - Google Patents
天線結構的製造方法 Download PDFInfo
- Publication number
- TWI456830B TWI456830B TW099124483A TW99124483A TWI456830B TW I456830 B TWI456830 B TW I456830B TW 099124483 A TW099124483 A TW 099124483A TW 99124483 A TW99124483 A TW 99124483A TW I456830 B TWI456830 B TW I456830B
- Authority
- TW
- Taiwan
- Prior art keywords
- antenna structure
- structure according
- fabricating
- conductive
- dielectric layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 3
- 238000004519 manufacturing process Methods 0.000 claims 11
- 238000007747 plating Methods 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 238000010147 laser engraving Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910001961 silver nitrate Inorganic materials 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Chemically Coating (AREA)
- Details Of Aerials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Claims (11)
- 一種天線結構的製造方法,包括:提供一不導電殼體,並在該不導電殼體表面覆蓋一抗鍍阻劑;以雷射雕刻的方式將該不導電殼體表面上一預設區域內之該抗鍍阻劑去除,並使該預設區域內所露出之該不導電殼體表面形成一粗化表面;於該預設區域內之該粗化表面上形成一介質層,其中該介質層含有鈀元素;除去該不導電殼體表面上之該抗鍍阻劑;以及於該介質層上形成一金屬層。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該金屬層以化學鍍方式形成於介質層上。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該介質層具有錫鈀膠體或硝酸銀。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該抗鍍阻劑具有樹脂材質。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該抗鍍阻劑以浸泡之方式塗佈於該不導電殼體表面。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該抗鍍阻劑以噴灑之方式塗佈於該不導電殼體表面。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該金屬層具有銅材質。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該金屬層具有鎳材質。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中該不導電殼體為以射出成型方式製作之塑膠件。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中於該金屬層形成於該介質層上之後再除去該不導電殼體表面上之該抗鍍阻劑。
- 如申請專利範圍第1項所述之天線結構的製造方法,其中在該金屬層形成於該介質層上之前除去該不導電殼體表面上之該抗鍍阻劑。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099124483A TWI456830B (zh) | 2010-07-26 | 2010-07-26 | 天線結構的製造方法 |
| US12/969,516 US8176621B2 (en) | 2010-07-26 | 2010-12-15 | Method for forming antenna structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099124483A TWI456830B (zh) | 2010-07-26 | 2010-07-26 | 天線結構的製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201205952A TW201205952A (en) | 2012-02-01 |
| TWI456830B true TWI456830B (zh) | 2014-10-11 |
Family
ID=45492356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099124483A TWI456830B (zh) | 2010-07-26 | 2010-07-26 | 天線結構的製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8176621B2 (zh) |
| TW (1) | TWI456830B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI456830B (zh) * | 2010-07-26 | 2014-10-11 | Wistron Neweb Corp | 天線結構的製造方法 |
| TWI514668B (zh) * | 2010-08-20 | 2015-12-21 | Wistron Neweb Corp | 天線之製造方法 |
| TWI505552B (zh) * | 2012-06-01 | 2015-10-21 | Wistron Neweb Corp | 天線結構之製造方法 |
| TW201503784A (zh) * | 2013-07-04 | 2015-01-16 | Amphenol Taiwan Corp | 塑膠件的選鍍方法及行動通訊裝置的外殼 |
| TWI561132B (en) | 2013-11-01 | 2016-12-01 | Ind Tech Res Inst | Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure |
| CN109638435A (zh) * | 2018-11-27 | 2019-04-16 | 深圳市臻鼎盛通讯有限公司 | 一种非金属基材天线或线路的制造工艺及5g天线 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202023A (zh) * | 1998-07-09 | 1998-12-16 | 复旦大学 | 一种曲面微带天线的制作方法 |
| CN101170879A (zh) * | 2006-10-23 | 2008-04-30 | 富士胶片株式会社 | 多层线路板及其制备方法 |
| CN101246990A (zh) * | 2007-02-15 | 2008-08-20 | 上海安费诺永亿通讯电子有限公司 | 一种天线的制造方法以及天线结构 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
| US6471878B1 (en) * | 1994-08-30 | 2002-10-29 | Gordion Holding Corporation | Method for forming a radio frequency responsive target and apparatus for verifying the authenticity of same |
| US5786910A (en) * | 1995-05-11 | 1998-07-28 | Advanced Deposition Technologies, Inc. | Pattern metallized optical varying security devices |
| US6421011B1 (en) * | 1999-10-22 | 2002-07-16 | Lucent Technologies Inc. | Patch antenna using non-conductive frame |
| KR101038494B1 (ko) * | 2004-12-28 | 2011-06-01 | 삼성테크윈 주식회사 | Rfid 태그용 안테나 제조 방법 |
| US20060281500A1 (en) * | 2005-06-14 | 2006-12-14 | Inventec Appliances Corp. | Mobile telecommunication apparatus having antenna assembly compatible with different communication protocols |
| WO2008087172A1 (de) | 2007-01-19 | 2008-07-24 | Basf Se | Verfahren zur herstellung strukturierter, elektrisch leitfähiger oberflächen |
| TWI456830B (zh) * | 2010-07-26 | 2014-10-11 | Wistron Neweb Corp | 天線結構的製造方法 |
-
2010
- 2010-07-26 TW TW099124483A patent/TWI456830B/zh active
- 2010-12-15 US US12/969,516 patent/US8176621B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202023A (zh) * | 1998-07-09 | 1998-12-16 | 复旦大学 | 一种曲面微带天线的制作方法 |
| CN101170879A (zh) * | 2006-10-23 | 2008-04-30 | 富士胶片株式会社 | 多层线路板及其制备方法 |
| CN101246990A (zh) * | 2007-02-15 | 2008-08-20 | 上海安费诺永亿通讯电子有限公司 | 一种天线的制造方法以及天线结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201205952A (en) | 2012-02-01 |
| US8176621B2 (en) | 2012-05-15 |
| US20120017427A1 (en) | 2012-01-26 |
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