TWI607094B - 用於無線通訊塔的經微球塡充之金屬組件 - Google Patents

用於無線通訊塔的經微球塡充之金屬組件 Download PDF

Info

Publication number: TWI607094B
Authority: TW; Taiwan
Prior art keywords: metal; microspheres; microsphere; filled; filled metal
Prior art date: 2012-09-28

Application number

TW102135133A

Other languages

English (en)

Chinese (zh)

Other versions

TW201413002A (zh

Inventor

莫哈梅德愛斯其爾

Original Assignee

陶氏全球科技有限責任公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-09-28

Filing date

2013-09-27

Publication date

2017-12-01

2013-09-27 Application filed by 陶氏全球科技有限責任公司 filed Critical 陶氏全球科技有限責任公司

2014-04-01 Publication of TW201413002A publication Critical patent/TW201413002A/zh

2017-12-01 Application granted granted Critical

2017-12-01 Publication of TWI607094B publication Critical patent/TWI607094B/zh

Links

229910052751 metal Inorganic materials 0.000 title claims description 91
239000002184 metal Substances 0.000 title claims description 91
239000004005 microsphere Substances 0.000 title claims description 65
238000004891 communication Methods 0.000 title claims description 19
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 29
229910052782 aluminium Inorganic materials 0.000 claims description 28
239000000203 mixture Substances 0.000 claims description 14
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
229910052802 copper Inorganic materials 0.000 claims description 6
239000010949 copper Substances 0.000 claims description 6
239000011521 glass Substances 0.000 claims description 6
FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
229910045601 alloy Inorganic materials 0.000 claims description 5
239000000956 alloy Substances 0.000 claims description 5
239000011777 magnesium Substances 0.000 claims description 5
229910052749 magnesium Inorganic materials 0.000 claims description 5
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
229910052799 carbon Inorganic materials 0.000 claims description 4
239000002245 particle Substances 0.000 claims description 4
239000000919 ceramic Substances 0.000 claims description 3
KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 2
238000009826 distribution Methods 0.000 claims description 2
229910052863 mullite Inorganic materials 0.000 claims description 2
229910052709 silver Inorganic materials 0.000 claims description 2
239000004332 silver Substances 0.000 claims description 2
239000011859 microparticle Substances 0.000 claims 1
239000007769 metal material Substances 0.000 description 37
239000000463 material Substances 0.000 description 25
229920000642 polymer Polymers 0.000 description 16
239000003822 epoxy resin Substances 0.000 description 15
229920000647 polyepoxide Polymers 0.000 description 15
238000000034 method Methods 0.000 description 14
239000000945 filler Substances 0.000 description 13
150000002739 metals Chemical class 0.000 description 10
239000002131 composite material Substances 0.000 description 7
238000010438 heat treatment Methods 0.000 description 7
239000004593 Epoxy Substances 0.000 description 5
239000006260 foam Substances 0.000 description 5
238000009472 formulation Methods 0.000 description 5
238000001723 curing Methods 0.000 description 4
238000007747 plating Methods 0.000 description 4
239000000126 substance Substances 0.000 description 4
229920001187 thermosetting polymer Polymers 0.000 description 4
239000011800 void material Substances 0.000 description 4
-1 aluminum-germanate Chemical compound 0.000 description 3
230000000712 assembly Effects 0.000 description 3
238000000429 assembly Methods 0.000 description 3
230000015572 biosynthetic process Effects 0.000 description 3
238000005266 casting Methods 0.000 description 3
239000002905 metal composite material Substances 0.000 description 3
238000002156 mixing Methods 0.000 description 3
MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 2
229910000838 Al alloy Inorganic materials 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
239000004697 Polyetherimide Substances 0.000 description 2
150000008064 anhydrides Chemical class 0.000 description 2
CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
230000007547 defect Effects 0.000 description 2
238000007872 degassing Methods 0.000 description 2
239000003365 glass fiber Substances 0.000 description 2
239000007788 liquid Substances 0.000 description 2
238000003754 machining Methods 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
239000004033 plastic Substances 0.000 description 2
229920003023 plastic Polymers 0.000 description 2
229920001601 polyetherimide Polymers 0.000 description 2
239000004848 polyfunctional curative Substances 0.000 description 2
239000010453 quartz Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
AAMHBRRZYSORSH-UHFFFAOYSA-N 2-octyloxirane Chemical compound CCCCCCCCC1CO1 AAMHBRRZYSORSH-UHFFFAOYSA-N 0.000 description 1
229910052582 BN Inorganic materials 0.000 description 1
PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
229910000906 Bronze Inorganic materials 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
239000004721 Polyphenylene oxide Substances 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
229920006362 Teflon® Polymers 0.000 description 1
229920004738 ULTEM® Polymers 0.000 description 1
238000013459 approach Methods 0.000 description 1
239000010953 base metal Substances 0.000 description 1
239000010974 bronze Substances 0.000 description 1
239000006229 carbon black Substances 0.000 description 1
239000002041 carbon nanotube Substances 0.000 description 1
229910021393 carbon nanotube Inorganic materials 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
239000011651 chromium Substances 0.000 description 1
230000000052 comparative effect Effects 0.000 description 1
238000000748 compression moulding Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000000835 fiber Substances 0.000 description 1
238000007667 floating Methods 0.000 description 1
235000011389 fruit/vegetable juice Nutrition 0.000 description 1
230000009477 glass transition Effects 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910002804 graphite Inorganic materials 0.000 description 1
239000010439 graphite Substances 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
230000017525 heat dissipation Effects 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
238000005470 impregnation Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
229910001092 metal group alloy Inorganic materials 0.000 description 1
239000006262 metallic foam Substances 0.000 description 1
238000005555 metalworking Methods 0.000 description 1
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
SOOZEQGBHHIHEF-UHFFFAOYSA-N methyltetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21C SOOZEQGBHHIHEF-UHFFFAOYSA-N 0.000 description 1
238000000465 moulding Methods 0.000 description 1
238000009740 moulding (composite fabrication) Methods 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
229920000570 polyether Polymers 0.000 description 1
239000002861 polymer material Substances 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
238000003756 stirring Methods 0.000 description 1
238000010998 test method Methods 0.000 description 1
238000012360 testing method Methods 0.000 description 1
230000000930 thermomechanical effect Effects 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
239000012815 thermoplastic material Substances 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
230000007704 transition Effects 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F3/1112—Making porous workpieces or articles with particular physical characteristics comprising hollow spheres or hollow fibres
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F2003/1106—Product comprising closed porosity
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Laminated Bodies (AREA)
Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Manufacture Of Alloys Or Alloy Compounds (AREA)
Inorganic Compounds Of Heavy Metals (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Casings For Electric Apparatus (AREA)
Powder Metallurgy (AREA)

TW102135133A 2012-09-28 2013-09-27 用於無線通訊塔的經微球塡充之金屬組件 TWI607094B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US201261707085P	2012-09-28	2012-09-28

Publications (2)

Publication Number	Publication Date
TW201413002A TW201413002A (zh)	2014-04-01
TWI607094B true TWI607094B (zh)	2017-12-01

Family

ID=49230874

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW102135133A TWI607094B (zh)	2012-09-28	2013-09-27	用於無線通訊塔的經微球塡充之金屬組件

Country Status (10)

Country	Link
US (1)	US20150225815A1 (fr)
EP (1)	EP2900838A1 (fr)
JP (1)	JP2016518694A (fr)
KR (1)	KR20150060728A (fr)
CN (1)	CN104662184B (fr)
BR (1)	BR112015006630A2 (fr)
CA (1)	CA2881164A1 (fr)
MX (1)	MX2015004107A (fr)
TW (1)	TWI607094B (fr)
WO (1)	WO2014052020A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
MX361304B (es) *	2012-12-20	2018-12-03	Dow Global Technologies Llc	Componentes de compuestos polimericos para torres de comunicaciones inalambricas.
US20190381749A1 (en) *	2016-11-30	2019-12-19	Continental Structural Plastics, Inc.	Two piece bonded vehicle components formed by sheet molding compound-resin transfer molding assemblies

Citations (1)

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Publication number	Priority date	Publication date	Assignee	Title
CN102612459A (zh) *	2009-09-15	2012-07-25	泽菲罗斯公司	腔填充的改进或相关

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JPS62170440A (ja) *	1986-01-22	1987-07-27	Inahata Kenkyusho:Kk	複合軽金属材料
JPH065751A (ja) *	1992-03-05	1994-01-14	Texas Instr Inc <Ti>	金属フォーム放熱器
JPH11302765A (ja) *	1998-04-20	1999-11-02	Shinko Kosen Kogyo Kk	衝撃吸収性に優れた発泡金属
JPH11340640A (ja) *	1998-05-26	1999-12-10	Furukawa Electric Co Ltd:The	電子機器筐体
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2013
- 2013-09-12 CA CA2881164A patent/CA2881164A1/fr not_active Abandoned
- 2013-09-12 EP EP13766201.1A patent/EP2900838A1/fr not_active Withdrawn
- 2013-09-12 WO PCT/US2013/059390 patent/WO2014052020A1/fr not_active Ceased
- 2013-09-12 BR BR112015006630A patent/BR112015006630A2/pt not_active IP Right Cessation
- 2013-09-12 US US14/419,696 patent/US20150225815A1/en not_active Abandoned
- 2013-09-12 KR KR1020157007629A patent/KR20150060728A/ko not_active Ceased
- 2013-09-12 MX MX2015004107A patent/MX2015004107A/es unknown
- 2013-09-12 JP JP2015534530A patent/JP2016518694A/ja not_active Withdrawn
- 2013-09-12 CN CN201380050435.0A patent/CN104662184B/zh not_active Expired - Fee Related
- 2013-09-27 TW TW102135133A patent/TWI607094B/zh not_active IP Right Cessation

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CN102612459A (zh) *	2009-09-15	2012-07-25	泽菲罗斯公司	腔填充的改进或相关

Also Published As

Publication number	Publication date
CN104662184A (zh)	2015-05-27
US20150225815A1 (en)	2015-08-13
EP2900838A1 (fr)	2015-08-05
JP2016518694A (ja)	2016-06-23
KR20150060728A (ko)	2015-06-03
BR112015006630A2 (pt)	2017-07-04
CN104662184B (zh)	2018-03-02
TW201413002A (zh)	2014-04-01
CA2881164A1 (fr)	2014-04-03
WO2014052020A1 (fr)	2014-04-03
MX2015004107A (es)	2015-07-06

Legal Events

Date	Code	Title	Description
2019-09-01	MM4A	Annulment or lapse of patent due to non-payment of fees

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