TWI648414B - 銅粉 - Google Patents

銅粉 Download PDF

Info

Publication number: TWI648414B
Authority: TW; Taiwan
Prior art keywords: copper; copper powder; void; carbon; particle
Prior art date: 2014-03-10

Application number

TW104107376A

Other languages

English (en)

Chinese (zh)

Other versions

TW201538759A (zh

Inventor

後藤善仁

向野

Original Assignee

日商三井金屬鑛業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-03-10

Filing date

2015-03-09

Publication date

2019-01-21

2015-03-09 Application filed by 日商三井金屬鑛業股份有限公司 filed Critical 日商三井金屬鑛業股份有限公司

2015-10-16 Publication of TW201538759A publication Critical patent/TW201538759A/zh

2019-01-21 Application granted granted Critical

2019-01-21 Publication of TWI648414B publication Critical patent/TWI648414B/zh

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 152
239000002245 particle Substances 0.000 claims abstract description 121
239000010949 copper Substances 0.000 claims abstract description 63
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 62
229910052799 carbon Inorganic materials 0.000 claims abstract description 61
229910052802 copper Inorganic materials 0.000 claims abstract description 60
239000011800 void material Substances 0.000 claims abstract description 60
238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 claims abstract description 18
238000005259 measurement Methods 0.000 claims abstract description 11
238000000034 method Methods 0.000 claims description 39
239000007921 spray Substances 0.000 claims description 28
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
238000009826 distribution Methods 0.000 claims description 10
AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 claims description 10
NWAXQRPWMADAKM-UHFFFAOYSA-N [C].[C].[Cu] Chemical compound [C].[C].[Cu] NWAXQRPWMADAKM-UHFFFAOYSA-N 0.000 claims 1
238000000691 measurement method Methods 0.000 claims 1
238000005336 cracking Methods 0.000 abstract description 9
239000007789 gas Substances 0.000 description 26
239000000843 powder Substances 0.000 description 14
239000011231 conductive filler Substances 0.000 description 10
238000004519 manufacturing process Methods 0.000 description 10
238000003756 stirring Methods 0.000 description 10
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
239000000155 melt Substances 0.000 description 9
238000002844 melting Methods 0.000 description 9
230000008018 melting Effects 0.000 description 9
239000001301 oxygen Substances 0.000 description 9
229910052760 oxygen Inorganic materials 0.000 description 9
CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
229910052751 metal Inorganic materials 0.000 description 8
239000002184 metal Substances 0.000 description 8
239000003795 chemical substances by application Substances 0.000 description 7
238000010304 firing Methods 0.000 description 7
239000011521 glass Substances 0.000 description 7
230000006698 induction Effects 0.000 description 7
229920005989 resin Polymers 0.000 description 7
239000011347 resin Substances 0.000 description 7
238000005507 spraying Methods 0.000 description 7
206010042674 Swelling Diseases 0.000 description 6
239000003610 charcoal Substances 0.000 description 6
238000005245 sintering Methods 0.000 description 6
230000008961 swelling Effects 0.000 description 6
230000015572 biosynthetic process Effects 0.000 description 5
239000004020 conductor Substances 0.000 description 5
239000011148 porous material Substances 0.000 description 5
229910002092 carbon dioxide Inorganic materials 0.000 description 4
239000001569 carbon dioxide Substances 0.000 description 4
239000000203 mixture Substances 0.000 description 4
239000000758 substrate Substances 0.000 description 4
239000003985 ceramic capacitor Substances 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
230000001186 cumulative effect Effects 0.000 description 3
238000005204 segregation Methods 0.000 description 3
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
238000004458 analytical method Methods 0.000 description 2
239000011230 binding agent Substances 0.000 description 2
150000001879 copper Chemical class 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000000635 electron micrograph Methods 0.000 description 2
238000011156 evaluation Methods 0.000 description 2
239000010419 fine particle Substances 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
239000011261 inert gas Substances 0.000 description 2
239000007788 liquid Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
229910052698 phosphorus Inorganic materials 0.000 description 2
239000011574 phosphorus Substances 0.000 description 2
239000002904 solvent Substances 0.000 description 2
229920001187 thermosetting polymer Polymers 0.000 description 2
MWEXRLZUDANQDZ-RPENNLSWSA-N (2s)-3-hydroxy-n-[11-[4-[4-[4-[11-[[2-[4-[(2r)-2-hydroxypropyl]triazol-1-yl]acetyl]amino]undecanoyl]piperazin-1-yl]-6-[2-[2-(2-prop-2-ynoxyethoxy)ethoxy]ethylamino]-1,3,5-triazin-2-yl]piperazin-1-yl]-11-oxoundecyl]-2-[4-(3-methylsulfanylpropyl)triazol-1-y Chemical compound N1=NC(CCCSC)=CN1[C@@H](CO)C(=O)NCCCCCCCCCCC(=O)N1CCN(C=2N=C(N=C(NCCOCCOCCOCC#C)N=2)N2CCN(CC2)C(=O)CCCCCCCCCCNC(=O)CN2N=NC(C[C@@H](C)O)=C2)CC1 MWEXRLZUDANQDZ-RPENNLSWSA-N 0.000 description 1
239000004925 Acrylic resin Substances 0.000 description 1
229920000178 Acrylic resin Polymers 0.000 description 1
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
235000002017 Zea mays subsp mays Nutrition 0.000 description 1
241000482268 Zea mays subsp. mays Species 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
238000000889 atomisation Methods 0.000 description 1
230000009172 bursting Effects 0.000 description 1
239000001273 butane Substances 0.000 description 1
239000003575 carbonaceous material Substances 0.000 description 1
239000003638 chemical reducing agent Substances 0.000 description 1
239000000571 coke Substances 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000002950 deficient Effects 0.000 description 1
SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000005674 electromagnetic induction Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
239000012530 fluid Substances 0.000 description 1
229910002804 graphite Inorganic materials 0.000 description 1
239000010439 graphite Substances 0.000 description 1
229920006015 heat resistant resin Polymers 0.000 description 1
-1 hull Substances 0.000 description 1
239000012535 impurity Substances 0.000 description 1
238000002347 injection Methods 0.000 description 1
239000007924 injection Substances 0.000 description 1
239000007769 metal material Substances 0.000 description 1
239000011859 microparticle Substances 0.000 description 1
238000013508 migration Methods 0.000 description 1
230000005012 migration Effects 0.000 description 1
IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
239000008188 pellet Substances 0.000 description 1
239000012071 phase Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
239000011164 primary particle Substances 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000002994 raw material Substances 0.000 description 1
239000003507 refrigerant Substances 0.000 description 1
229910052707 ruthenium Inorganic materials 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000000243 solution Substances 0.000 description 1
229940116411 terpineol Drugs 0.000 description 1
230000003685 thermal hair damage Effects 0.000 description 1
238000001107 thermogravimetry coupled to mass spectrometry Methods 0.000 description 1
239000012808 vapor phase Substances 0.000 description 1
239000002023 wood Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper

Landscapes

Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Dispersion Chemistry (AREA)
Mechanical Engineering (AREA)
Organic Chemistry (AREA)
Metallurgy (AREA)
Materials Engineering (AREA)
Engineering & Computer Science (AREA)
Conductive Materials (AREA)
Powder Metallurgy (AREA)
Non-Insulated Conductors (AREA)
Manufacture Of Metal Powder And Suspensions Thereof (AREA)

TW104107376A 2014-03-10 2015-03-09 銅粉 TWI648414B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2014-045937		2014-03-10
JP2014045937		2014-03-10

Publications (2)

Publication Number	Publication Date
TW201538759A TW201538759A (zh)	2015-10-16
TWI648414B true TWI648414B (zh)	2019-01-21

Family

ID=54071467

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW104107376A TWI648414B (zh)	2014-03-10	2015-03-09	銅粉

Country Status (3)

Country	Link
JP (1)	JP5969118B2 (fr)
TW (1)	TWI648414B (fr)
WO (1)	WO2015137015A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN117083137B (zh) *	2021-03-30	2026-01-02	三井金属矿业株式会社	铜颗粒及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0762467A (ja) *	1993-08-25	1995-03-07	Toshiba Corp	分散強化型銅合金及び分散強化型銅合金の製造方法
WO2011004363A2 (fr) *	2009-07-05	2011-01-13	Nanoready Ltd.	Procédé et système adaptés pour fournir des informations de rétroaction émanant d'un utilisateur en ligne à propos de sites web et de logiciels informatiques
TW201219128A (en) *	2010-11-12	2012-05-16	Mitsui Mining & Am Smelting Company Ltd	wherein the carbon content is less than 0.01 wt%
TW201244853A (en) *	2011-04-28	2012-11-16	Mitsui Mining & Smelting Co	Low-carbon copper particles
JP2014029029A (ja) *	2013-08-22	2014-02-13	Mitsui Mining & Smelting Co Ltd	銅粉

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2005008930A (ja) *	2003-06-18	2005-01-13	Nippon Atomized Metal Powers Corp	金属粉末、金属粉末製造装置および金属粉末製造方法

2015
- 2015-02-04 WO PCT/JP2015/053110 patent/WO2015137015A1/fr not_active Ceased
- 2015-02-04 JP JP2015515067A patent/JP5969118B2/ja active Active
- 2015-03-09 TW TW104107376A patent/TWI648414B/zh active

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0762467A (ja) *	1993-08-25	1995-03-07	Toshiba Corp	分散強化型銅合金及び分散強化型銅合金の製造方法
WO2011004363A2 (fr) *	2009-07-05	2011-01-13	Nanoready Ltd.	Procédé et système adaptés pour fournir des informations de rétroaction émanant d'un utilisateur en ligne à propos de sites web et de logiciels informatiques
TW201219128A (en) *	2010-11-12	2012-05-16	Mitsui Mining & Am Smelting Company Ltd	wherein the carbon content is less than 0.01 wt%
TW201244853A (en) *	2011-04-28	2012-11-16	Mitsui Mining & Smelting Co	Low-carbon copper particles
JP2014029029A (ja) *	2013-08-22	2014-02-13	Mitsui Mining & Smelting Co Ltd	銅粉

Also Published As

Publication number	Publication date
WO2015137015A1 (fr)	2015-09-17
JPWO2015137015A1 (ja)	2017-04-06
TW201538759A (zh)	2015-10-16
JP5969118B2 (ja)	2016-08-17

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