TWI655761B - 填充膜與用其製造有機發光顯示設備之方法 - Google Patents

填充膜與用其製造有機發光顯示設備之方法 Download PDF

Info

Publication number
TWI655761B
TWI655761B TW103111153A TW103111153A TWI655761B TW I655761 B TWI655761 B TW I655761B TW 103111153 A TW103111153 A TW 103111153A TW 103111153 A TW103111153 A TW 103111153A TW I655761 B TWI655761 B TW I655761B
Authority
TW
Taiwan
Prior art keywords
film
filling
release film
thickness
micrometers
Prior art date
Application number
TW103111153A
Other languages
English (en)
Other versions
TW201507137A (zh
Inventor
金正洙
Original Assignee
南韓商三星顯示器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星顯示器有限公司 filed Critical 南韓商三星顯示器有限公司
Publication of TW201507137A publication Critical patent/TW201507137A/zh
Application granted granted Critical
Publication of TWI655761B publication Critical patent/TWI655761B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5007—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/04—4 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/005—Presence of polyolefin in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/105—Presence of homo or copolymers of propene in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/005—Presence of halogenated polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1424—Halogen containing compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1424—Halogen containing compound
    • Y10T428/1429—Fluorine
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一種填充膜以及利用填充膜製造有機發光顯示設備之方法。該填充膜包含填充材料、貼附在填充膜之一表面之第一離型膜、貼附在填充膜之另一表面之第二離型膜、以及貼附在第二離型膜上之支撐層。第二離型膜與支撐層間之結合力大於填充材料與第二離型膜間之結合力。

Description

填充膜與用其製造有機發光顯示設備之方法 相關申請案之交互參照
本申請案主張2013年5月22日韓國智慧財產局提交之No.10-2013-0057953韓國專利申請案之效益，其揭露於此全部併入作為參考。
本發明之例示性實施例係關於一種填充膜與利用其製造有機發光顯示設備之方法，且更具體來說，是一種可提高有機發光顯示設備之製作效率之填充膜、以及利用其製造有機發光顯示設備之方法。
近來，顯示設備已被可攜式薄膜平板顯示設備取代。在平板顯示設備中，場發射顯示設備是一種廣視角且高對比之發射顯示設備，且因此作為次世代顯示設備而備受關注。同時，其中由有機材料形成發光層之有機發光顯示設備具有理想性質，像是廣視角、高對比、快速反應時間以及多彩顯示。
有機發光顯示設備通常包含其上形成有顯示單元之基板、以及在顯示單元上製成之封裝基板，且基板與封裝基板藉由使用密封劑而相互結合。然而，由於增加有機發光顯示設備大小之趨勢，封裝基板之大 小與重量也隨之增加。因此，為了確保有機發光顯示設備之結構可靠度，發展出在基板與封裝基板間進一步包含填充材料之方法。
本發明之例示性實施例提供一種可提高有機發光顯示設備之製作效率之填充膜、以及利用填充膜製造有機發光顯示設備之方法。
本發明之例示性實施例揭露一種填充膜。填充膜包含填充材料、附在填充材料之第一表面之第一離型膜、附在填充材料之第二表面之第二離型膜以及附在第二離型膜上之支撐層。第二離型膜與支撐層間之結合力要高於填充材料與第二離型膜間之結合力。
本發明之例示性實施例亦揭露一種製造有機發光顯示設備之方法。此方法包含：從由複數個填充膜堆成之疊堆中分離填充膜、將分離出之填充膜中心定位於載膜臺上、將填充膜之填充材料層疊在封裝基板上、以及結合封裝基板與含有顯示單元之基板。在層疊前，填充膜包含附在填充材料之第一表面之第一離型膜、附在填充材料之第二表面之第二離型膜以及附在第二離型膜上之支撐層，且支撐層包含聚對苯二甲酸乙二酯，且具有範圍約50微米至約100微米之厚度。
本發明之例示性實施例亦揭露具有第一厚度之第一離型膜、設置在第一離型膜上之填充材料、設置在填充材料上且具有第二厚度之第二離型膜，其中第二厚度小於第一厚度、以及設置在第二離型膜上之支撐層。支撐層包含聚對苯二甲酸乙二酯且具有大於第二厚度之第三厚度。
要瞭解的是，前面之一般性描述與接下來的詳細描述都是示例性，且意在提供來進一步解釋所主張之發明。
10‧‧‧有機發光顯示設備
100‧‧‧基板
200‧‧‧顯示單元
212‧‧‧緩衝層
213‧‧‧閘極絕緣膜
214‧‧‧層間絕緣層
215‧‧‧平坦化膜
216‧‧‧像素定義膜
221‧‧‧主動層
222‧‧‧閘極電極
223‧‧‧源極與汲極電極
230‧‧‧接觸孔
231‧‧‧像素電極
232‧‧‧中間層
233‧‧‧相對電極
200a‧‧‧薄膜電晶體層
200b‧‧‧像素單元
310‧‧‧密封材料
320‧‧‧濕氣吸收劑
400‧‧‧封裝基板
410‧‧‧基板臺
500‧‧‧填充材料
501‧‧‧第一離型膜
502‧‧‧第二離型膜
503‧‧‧支撐層
500A‧‧‧填充膜
500B‧‧‧層堆疊
620‧‧‧拾取單元
710‧‧‧載膜臺
720‧‧‧中心定位銷
730‧‧‧滾輪
T‧‧‧厚度
本發明之前述以及其他特徵與優勢將藉由參照附圖詳細說明其例示性實施例而變得更加顯而易見：
第1圖為根據本發明之例示性實施例之有機發光顯示設備之示意剖視圖。
第2圖為第1圖中有機發光顯示設備之顯示單元之示意剖視圖。
第3圖為用來作為第1圖之有機發光顯示設備之填充材料的填充膜之示意剖視圖。
第4圖、第5圖、第6圖與第7圖為描述第1圖之有機發光顯示設備之製造方法之示意剖視圖。
由於例示性實施例能有各種修改及替代形式，實施例將於圖式中以示例之方式顯示並於文中詳細說明。然而，應瞭解的是，此並非意在將例示性實施例限制在所揭露之特定形式裡，而是相反的，例示性實施例包含了所有落於發明範圍內之修改、等效物以及替代物。在本發明之描述中，當關於先前習知功能與配置之具體說明可能不必要地造成本發明範圍不清楚時，其描述將被省略。
將瞭解的是，即使可能使用「第一」、「第二」等辭彙在此描述不同元件，這些元件不該被這些辭彙所限制。這些詞彙僅僅是用來區別一個元件與另一個元件。
將瞭解的是，當元件或層被稱為位於另一元件或層「上方」或「連結至」另一元件或另一層時，可以直接地位於另一元件或層上方或直接連結至另一元件或層，但也可能存在中介元件或層。相反的，當一元件被稱為「直接」位於另一元件或層「上方」或「直接連結至」另一元件或另一層時，則不存在中介元件或層。將瞭解的是，於本揭露之宗旨，「X、Y與Z之至少之一」可以解釋成只有X、只有Y、只有Z或是二或多項X、Y與Z之所有組合(例如：XYZ、XYY、YZ、ZZ)。
之後，本發明將參照繪示本發明之例示性實施例之附圖而更加完整地說明。在參照圖式而描述本發明例示性實施例中，相同參考符號係用於大致相同或彼此對應之元件，並且將不再重複其描述。在圖式中，厚度可能為了層與區域之清晰而放大。同時，為了方便解釋，一些層與區域可被誇大。
第1圖是根據本發明例示性實施例之有機發光顯示設備10之示意剖視圖。第2圖是第1圖之有機發光顯示設備10之顯示單元200之示意剖視圖。
參照第1圖與第2圖，有機發光顯示設備10包含基板100、在基板100上製成之顯示單元200、設置以面對基板100之封裝基板400、藉著結合基板100與封裝基板400而密封顯示單元200之密封材料310以及介於顯示單元200與封裝基板400之間的填充材料500。
基板100可用具SiO2為主要成份之透明玻璃材料製成。然而，基板100亦可以其他材料製成。例如，基板可由透明塑膠材料製成。舉例來說，用來製成基板100之塑膠材料可包含至少一絕緣有機材料，像是聚醚碸(PES)、聚丙烯酸酯(PAR)、聚醚醯亞胺(PEI)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸乙二酯(PET)、聚苯硫醚(PPS)、聚烯丙基化物、聚醯亞胺、聚碳酸酯(PC)、三乙酸纖維素(TAC)和醋酸丙酸纖維素(CAP)。
當有機發光顯示設備10為其中影像會朝由基板100之方向實現之底部發光類型時，基板100由透明材料製成。然而，當有機發光顯示設備10為其中影像朝基板100之相反方向實現之頂部發光類型時，基板100可由反射材料像是金屬材料製成。當基板100由金屬材料製成時，基板100可包含，舉例來說，碳、鐵、鉻、錳、鎳、鈦、鉬和不銹鋼(SUS)之至少其中之一。
顯示單元200可包含薄膜電晶體層200a與像素單元200b。薄膜電晶體層200a可由有機、無機或任何其他可用以形成薄膜電晶體之材料製成。像素單元200b可為有機發光裝置(OLED)。在下文中，參照第2圖，顯示單元200將被詳細描述。
緩衝層212可在基板100上製成。緩衝層212可防止雜質元素滲進基板100，並且提供基板100上之平坦面。緩衝層212可由行使上述功能之各種材料製成。舉例來說，緩衝層212可包含，舉例來說，至少一無機材料像是氧化矽、氮化矽、氮氧化矽、氧化鋁、氮化鋁、氧化鈦與氮化鈦；或至少一有機材料像是聚醯亞胺、聚酯與丙烯酸類，且可使用上述之材料以疊層製成。
緩衝層212可使用各種方式沉積，舉例來說，電漿增強化學氣相沉積(PECVD)法、大氣壓化學氣相沉積(APCVD)法、或低壓化學氣相沈積(LPCVD)。
主動層221可由像是矽之無機半導體或有機半導體在緩衝層212上製成。此外，主動層221包含源極區域、汲極區域以及介於源極區域與汲極區域間之通道區域。舉例來說，當主動層221由非晶矽製成時，主動層221可如此在緩衝層212之整個表面上形成非晶矽層後，藉由結晶非晶矽層製成多晶矽層而形成。在圖樣化多晶矽層後，藉由用摻雜劑來摻雜源極區域及汲極區域而製成具有在主動層221邊緣之源極區域與汲極區域、以及介於源極區域與汲極區域間之通道區域的主動層221。
在主動層221上製成閘極絕緣膜213。製成閘極絕緣膜213使主動層221與閘極電極222絕緣，且可由無機材料像是SiNx或SiO2製成。
在閘極絕緣膜213之上表面製成閘極電極222。閘極電極222連結一閘極線(未顯示)，透過閘極線可施加一開/關訊號至薄膜電晶體(TFT)。
閘極電極222可包含，舉例來說，至少一金屬材料像是金、銀、銅、鎳、鉑、鈀、鋁與鉬，且可能包括合金像是鋁：釹或鉬：鎢。然而，考慮到設計環境，閘極電極222可由其他材料製成。
在閘極電極222上所製成之層間絕緣層214係形成用來使閘極電極222及源極與汲極電極223之間絕緣，且可由無機材料像是SiNx或SiO2製成。
在層間絕緣層214上製成源極與汲極電極223。更具體來說，在層間絕緣層214與閘極絕緣膜213中製成接觸孔，以露出主動層221之源極與汲極區域，且源極與汲極電極223透過接觸孔與主動層221露出之源極及汲極區域電性連結。
第2圖描繪依序包含有主動層221、閘極電極222以及源極與汲極電極223之頂部閘極型薄膜電晶體。然而，薄膜電晶體可具有其他結構。舉例來說，閘極電極222可以設置在主動層221下方。
上述之有機薄膜電晶體層200a電性連結像素單元200b以驅動像素單元200b，且由平坦化膜215覆蓋而受到保護。
平坦化膜215可為無機絕緣膜與/或有機絕緣膜。無機絕緣膜可包含，舉例來說，SiO2、SiNx、SiON、Al2O3、TiO2、Ta2O5、HfO2、ZrO2、BST和PZT之至少之一。有機絕緣膜可包含，舉例來說，像是聚甲基丙烯酸甲酯(PMMA)或聚苯乙烯(PS)之至少一通用聚合物、具有酚基(phenol group)之聚合物衍生物、丙烯酸聚合物(acryl polymer)、醯亞胺聚合物(imide polymer)、芳醚聚合物(aryl ether polymer)、醯胺聚合物(amide polymer)、氟化聚合物(fluoride polymer)、對-gilyrene聚合物(p-gilyrene polymer)、乙烯醇聚合物(vinyl alcohol polymer)、以及這些材料之混合物。平坦化膜215亦可形成為無機絕緣膜與有機絕緣膜之複合疊層。
在平坦化膜215上製成像素單元200b。像素單元200b可包含像素電極231、中間層232以及相對電極(facing electrode)233。
像素電極231在平坦化膜215上製成，且透過平化膜215中形成之接觸孔230而與源極與汲極電極223作電性連結。
像素電極231可為反射電極，且在這情況下，可以包含含有例如銀、鎂、鋁、鉑、鈀、金、鎳、釹、銥、鉻之至少之一及這些材料之化合物之反射膜；以及在反射膜上形成之透明或半透明電極。透明或半透明電極可包含，舉例來說，氧化銦錫(ITO)、氧化銦鋅(IZO)、氧化鋅(ZnO)、氧化銦(In2O3)、氧化銦鎵(IGO)和氧化鋁鋅(AZO)之至少之一。
朝向像素電極231之相對電極233可為透明或半透明電極，且可由具小功函數之金屬薄膜製成。金屬薄膜可包含例如鋰、鈣、氟化鋰/鈣、氟化鋰/鋁、鋁、銀、鎂、以及這些材料之化合物之至少一。同時，可進一步在金屬薄膜上形成用製作透明電極之材料所製成之輔助電極層或匯流電極，舉例來說，ITO、IZO、ZnO、或In2O3。
於是，相對電極233可傳輸由包含於中間層232之有機發光層(未顯示)所發出之光。也就是說，從有機發光層發出之光可直接朝相對電極233發射(discharged)或是由形成為反射電極之像素電極231反射。
有機發光顯示設備10可具有其他配置。舉例來說，有機發光顯示設備10可為底部發射型有機發光顯示設備，其中光線朝基板100發射。當有機發光顯示設備10為底部發射型時，像素電極231可製成為透明或半透明電極，且相對電極233可製成為反射電極。另外，有機發光顯示設備10可為雙重發光顯示設備，其中光線同時以頂部與底部方向發出。
利用絕緣材料，像素定義膜216在像素電極231上製成。像素定義膜216可藉由使用旋轉塗佈方法包含例如，聚醯亞胺、聚醯胺、丙 烯酸樹脂、苯並環丁烯、以及苯酚樹脂之至少之一。像素定義膜216露出部分之像素電極231，且包含有機發光層之中間層232位於像素電極231之露出部分上。
包含於中間層232之有機發光層(未顯示)可由低分子量有機材料或高分子有機材料製成。中間層232除有機發光層外，可以選擇性進一步包含功能層，像是電洞傳遞層(HTL)、電洞注入層(HIL)、電子傳遞層(ETL)、及電子注入層(EIL)。
含有顯示單元200之基板100與設置在顯示單元200上之封裝基板400結合。封裝基板400可由不同之材料製成。舉例來說，除了玻璃材料，封裝基板400可由塑膠材料像是壓克力(acryl)製成，且甚至可由金屬板製成。
基板100與封裝基板400藉由使用密封材料310結合。密封材料310可為常用材料，像是封接玻璃料(sealing glass frit)。密封材料310以及封裝基板400阻擋了外部濕氣或空氣接觸顯示單元200。
濕氣吸收劑320可進一步設置在密封材料310之旁邊。濕氣吸收劑320易於與濕氣及氧氣反應，且因而防止濕氣及氧氣造成OLED壽命減少。濕氣吸收劑320可包含，例如，鹼金屬氧化物、鹼土金屬氧化物、金屬鹵化物、硫酸鋰、金屬硫酸鹽、金屬高氯酸鹽、及矽膠以及五氧化二磷之一種、或這些材料之混合之至少之一。然而，濕氣吸收劑320之類型與位置可具有多種其他配置。
填充材料500包含在由密封材料310密封之區域內。填充材料500被包含以填充在基板100與封裝基板400之間之空間。
封裝材料500可包含，例如，環氧樹脂、丙烯酸樹脂、矽、乙烯-乙酸乙烯酯(EVA)以及聚乙烯之至少之一。填充材料500可具有範圍約10微米至約30微米之厚度T。填充材料500可具有熱硬化或是紫外光(UV)硬化之性質，且可包含各種添加劑像是硬化劑、抗氧化劑以及耦合劑。
上述描述之填充材料500，可由第3圖描繪之填充膜500A製成。參照第3圖，填充膜500A現將會被詳細描述。
第3圖是製成第1圖之有機發光顯示設備10之填充材料500之填充膜500A的剖面圖。
參照第3圖，填充膜500A可包含填充材料500、附在填充材料500之第一表面之第一離型膜501、附在填充材料500之第二表面之第二離型膜502以及附在第二離型膜502上之支撐層503。
填充材料500可具有範圍在約10微米至約30微米之厚度。而且如同上面提到的，可由環氧樹脂、丙烯酸樹脂、矽、乙烯-乙酸乙烯酯(EVA)以及聚乙烯之至少之一製成。
在有機發光顯示設備10的製程中，第一與第二離型膜501與502保護填充材料500並從填充材料500分離。第一與第二離型膜501與502可個別包含例如聚甲基戊烯膜(polymethylpentene film)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)膜、鐵氟龍®膜(Teflon® film)以及聚丙烯膜(polypropylene film)之至少之一。
如下面所描述，在製造有機發光顯示設備10的製程中，第一與第二離型膜501與502可自填充材料500依序地分離。更具體的說，根據一例示性實施例，第二離型膜502在第一離型膜501從填充材料500上分 離之前可由填充材料500分離。因此，在這種情況下，當第二離型膜502分離時，第一離型膜501仍應附在填充材料500上。所以，第一離型膜501與填充材料500間之結合力應大於第二離型膜502與填充材料500間之結合力。
為了這個目的，第一離型膜501可厚於第二離型膜502。舉例來說，第一離型膜501可具有範圍約50微米至約100微米間之厚度，而第二離型膜之502可具有範圍約20微米至約50微米間之厚度。據此，由於第一離型膜501厚於第二離型膜502，故第一離型膜501與填充材料500間之結合力大於第二離型膜502與填充材料500間之結合力，而可穩定地實施有機發光顯示設備10的製程。
支撐層503附在第二離型膜502上，增加填充膜500A的整體厚度與重量，且可預防填充膜500A由於施加在填充膜500A之側面之壓力而彎曲或起皺。
支撐層503可包含，例如，PET，但卻不僅限於此。
在有機發光顯示設備10之製程中，支撐層503並不會與第二離型膜502分離。而是，在第二離型膜502從填充材料500分離時，支撐層503與第二離型膜502一起從填充材料500上分離。於是，支撐層503與第二離型膜502間之結合力應大於第二離型膜502與填充材料500間之結合力。
為了達成較大之結合力，支撐層503可具有範圍約50微米至約100微米之厚度。當支撐層503小於50微米厚度時，如下面參考第5圖所描述，填充膜500A可能在填充膜500A之對齊製程中，由於中心定位銷 (centering pin)720(參照第5圖)的緣故而彎曲或起皺。而且，當支撐層503小於50微米厚度時，支撐層503與第二離型膜502間之結合力減少了，因此，當第二離型膜502從填充材料500分離時，支撐層503可能從第二離型膜502分離，從而降低製造有機發光顯示設備10之效率。
當支撐層503遠大於100微米厚度時，填充膜500A之重量大量增加，結果填充膜500A可能無法被拾取單元620(參照第4圖)提起。據此，支撐層503可具有範圍約50微米至約100微米之厚度。
支撐層503之上表面可為靜電屏蔽(static shielded)。可由在支撐層503之上表面塗覆抗靜電劑得到靜電屏蔽。可使用其他方式來得到靜電屏蔽。舉例來說，在支撐層503包含抗靜電劑下也可得到靜電屏蔽。
藉由這種方式，如同第4圖所描繪，支撐層503之上表面有靜電屏蔽時，當藉由層疊複數個填充膜500A而製成層堆疊500B時，填充膜500A間之靜電力作用可被預防。因此，拾取單元620(參照第4圖)可輕易將填充膜500A一層層提起。
第4圖至第7圖為描述第1圖中之有機發光顯示設備10之製造方法之示意剖視圖。雖然下文描述之方法係關於有機發光顯示設備之製備，然而本發明例示性實施例可應用在任何需要密封保護之顯示設備或發光器上，像是防撞、防空氣或防濕氣保護。
根據本發明例示性實施例，製造有機發光顯示設備10之方法包含：從層堆疊500B一片一片將填充膜500A分離；將分離出之填充膜500A在載膜臺710之中心上對齊；將對齊之填充膜500A中的填充材料500 與封裝基板400層疊；然後將上面形成有顯示單元200之基板100與封裝基板400結合。
下文中，現將參照第3圖以及第4圖至第7圖，詳細說明製造有機發光顯示設備10之方法。
如第4圖所描繪，從層堆疊500B一片一片分離出填充膜500A包含藉由拾取單元620由藉以層疊複數個填充膜500A所製成之層堆疊500B一片一片提起填充膜500A。
拾取單元620包含真空墊(未顯示)，且在真空墊與層堆疊500B之上表面接觸後，真空壂藉真空吸附力(vacuum force)將層堆疊500B之最上面的填充膜500A提起。在一些例示性實施例中，由於真空吸附力，拾取單元620不必真的接觸最上面的填充膜500A即可提起最上面的填充膜500A。
由於摩擦的緣故，層疊之填充膜可能產生靜電。靜電力可在互相接觸之二填充膜間作用，導致填充膜可能無法輕易地一片一片分離。當兩片填充膜被同時提起並且進入如第5圖所描繪之中心定位製程(centering process)時，製造有機發光顯示設備10的製程可能發生錯誤而導致製造效率降低。
然而，根據本發明例示性實施例，由於填充膜500A除了包含填充材料500以及附在填充材料500兩面的第一離型膜501與第二離型膜502，還進一步包含了支撐層503，填充膜500A的總重量可增加。因此，填充膜500A易於被拾取單元620一片一片分離。另外，當提起填充膜500A時，拾取單元620亦可作至少一次的搖擺動作(shaking operation)。由於拾 取單元620之分離動作，即使兩片或更多填充膜500A被提起，因為支撐層503增加了重量，填充膜500A依然可輕易地一片一片分離。
同時，根據本發明例示性實施例，支撐層503表面也可為靜電屏蔽。因此，可以預防或減少層疊的填充膜500A間靜電力產生。據此，填充膜500A之分離操作可有效地執行。換句話說，在層疊的基礎上，填充膜500A更容易被提起，而在兩片或更多之填充膜500A被提起的情況下，由於拾取單元620的搖擺動作，填充膜更容易被分離，從而留下單片的填充膜500A附在拾取單元620上。
表1總結了分離動作的成功率。這裡的「成功」是指由拾取單元620一開始就將單層之填充膜500A提起，或是在兩片或更多片填充膜500A被提起的情況下，拾取單元620的搖擺動作致使留下單片填充膜500A附於拾取單元620。在比較例中，填充膜500A包含填充材料500、第一離型膜501以及第二離型膜502，但不包含支撐層503。然而，在實施例1與2中，填充膜500A額外包含了支撐層503。同時，不同於實施例1，在實施例2中，支撐層503之上表面為靜電屏蔽。填充膜500A包含具有20微米厚度之填充材料500、具有100微米厚度之第一離型膜501以及具有25微米厚度之第二離型膜502。支撐層503具有100微米之厚度。
接著，如第5圖所描繪，分離出之填充膜500A在載膜臺710上被對齊。
更具體的說，當填充膜500A放在載膜臺710時，藉由從載膜臺710之邊緣單元移動以接觸填充膜500A之側面之中心定位銷720而使填充膜500A對齊。對齊之填充膜500A可被載膜臺710之表面上形成之真空孔洞吸住和固定。
中心定位銷720會對填充膜500A四邊施力。就這點上來說，若填充膜500A具有非常小的厚度，由於中心定位銷720所施加之壓力，填充膜500A可能彎曲或起皺。在這樣的情況下，填充膜500A可能無法正確對齊且可能造成後續製程的錯誤。
然而，根據本發明例示性實施例，由於除了填充材料500以及附在填充材料500兩側的第一離型膜501與第二離型膜502以外，填充膜500A還包含支撐層503，故填充膜500A之厚度增加了。因此，可以防止由於中心定位銷720對填充膜500A之側面所施予之壓力而造成之填充膜500A之彎曲或起皺。
表2總結了中心定位動作的成功率。這裡的「成功」是指，填充膜500A不致彎曲或起皺到會在後續製程中造成錯誤。在比較例中，與上述比較例相同，填充膜500A不包含支撐層503。然而，在實施例中，填充膜500A包含支撐層503。同時，在比較例及實施例中使用之填充膜500A與表1分離動作中使用之填充膜500A是一樣的。
[表2]
如表1與表2所見，在填充膜500A包含支撐層503的條件下，能達成90%以上之成功率，也就是說，在製造有機發光顯示設備10的製程中，分離動作與中心定位動作產生的錯誤可減少。因此，製造有機發光顯示設備10之效率可提高。
接著，如第6圖中所描繪，填充膜500A中的填充材料500可被設置在封裝基板400上。舉例來說，填充材料500可與封裝基板400層疊。
封裝基板400被固定在基板臺410上，且封裝基板400可朝向地面設置。可藉由真空吸住封裝基板400，以此將封裝基板400固定在基板臺410上。
在載膜臺710上對齊填充膜500A時，支撐層503與第二離型膜502從填充材料500分離，且露出之填充材料500朝向封裝基板400設置。同時，第一離型膜501與填充材料500維持結合狀態。為了這個目的，支撐層503與第二離型膜502間之結合力高於第二離型膜502與填充材料500間之結合力，且第一離型膜501與填充材料500間之結合力大於第二離型膜502與填充材料500間之結合力。
可藉由依一方向旋轉地移動載膜臺710之一側上所包含之滾輪(roller)730實施封裝基板400與填充材料500之層疊。也就是說，層疊可從填充材料500與封裝基板400接觸之一邊之點為起始點，以第6圖中箭頭所示方向進行。
在填充膜500層疊在封裝基板400之表面上後，可移除第一離型膜501。
最後，如同第7圖所描繪，以使用密封材料310為媒介，結合封裝基板400與上面有顯示單元200形成之基板100。
顯示單元200係參照第2圖描述。然而，先前技術中習知之各類有機發光顯示器可應用於本實施例，且因此，省略實際製造有機發光顯示器之方法之描述。
密封材料310可形成以圍繞在封裝基板400上之填充材料500。可以塗覆液狀或漿糊狀之密封材料製成密封材料310。第7圖中描繪密封材料310在封裝基板400之表面製成，但其他配置是可能的。舉例來說，密封材料310可在基板100之表面製成。同時，濕氣吸收劑320可進一步在密封材料310之內側製成。舉例來說，可藉由塗覆液狀濕氣吸收劑320製成濕氣吸收劑320。
基板100與封裝基板400之結合係如此實行，從填充材料500分離第一離型膜501後，設置基板100朝向封裝基板400，之後，在真空狀態下，在對應密封材料310之基板100與封裝基板400上照射紫外線(UV)使基板100與封裝基板400結合。當在真空狀態下實行結合之動作時，可減少外部濕氣與異物之滲透。
同時，當UV光照射在基板100與封裝基板400上時，部分接觸密封材料310之基板100與封裝基板400會熔化，且因此，基板100與封裝基板400可以黏合。然而，這僅僅是例示性實施例，且基板100與封裝基板400可根據密封材料310之種類而以不同方式黏合。
雖然本發明已參照其例示性實施例而特別展示及描述，然而所屬技術領域具有通常知識者將瞭解的是，在不脫離本發明由下列專利申請範圍所定義之精神與範圍下，可對其進行形式與細節上之各種變更。

Claims (17)

  1. 一種填充膜，其包含：一填充材料，其厚度為10微米到30微米；一第一離型膜，其貼附在該填充材料之一第一表面，且厚度為50微米到100微米；一第二離型膜，其貼附在該填充材料之一第二表面，且厚度為20微米到50微米；及一支撐層，其貼附在該第二離型膜上，且厚度為50微米到100微米，其中，該第一離型膜與該填充材料間之結合力大於該第二離型膜與該填充材料間之結合力；其中，該第二離型膜與該支撐層間之結合力大於該填充材料與該第二離型膜間之結合力，以使該支撐層與該第二離型膜一起從該填充材料上分離。
  2. 如申請專利範圍第1項所述之填充膜，其中該支撐層包含聚對苯二甲酸乙二酯。
  3. 如申請專利範圍第1項所述之填充膜，其中該第一離型膜之厚度大於該第二離型膜之厚度。
  4. 如申請專利範圍第1項所述之填充膜，其中該支撐層之上表面有一靜電屏蔽。
  5. 一種製造有機發光顯示設備之方法，該方法包含：從一疊堆中分離出一填充膜，其中該疊堆由複數個該填充膜堆成； 在一載膜臺上中心定位分離出之該填充膜；將該填充膜之一填充材料層疊於一封裝基板上；及將該封裝基板與包含一顯示單元之一基板結合；其中，在層疊前，該填充膜包含貼附在該填充材料之一第一表面且厚度為50微米到100微米之一第一離型膜、貼附在該填充材料之一第二表面且厚度為20微米到50微米之一第二離型膜、以及貼附在該第二離型膜上之一支撐層，且該支撐層包含聚對苯二甲酸乙二酯並具有範圍約50微米至約100微米之厚度，其中，該第一離型膜與該填充材料間之結合力大於該第二離型膜與該填充材料間之結合力；其中，該支撐層與該第二離型膜一起從該填充材料上分離。
  6. 如申請專利範圍第5項所述之方法，其中該支撐層之上表面有一靜電屏蔽。
  7. 如申請專利範圍第5項所述之方法，其中該第二離型膜與該支撐層間之結合力大於該第二離型膜與該填充材料間之結合力。
  8. 如申請專利範圍第5項所述之方法，其中該第一離型膜之厚度大於該第二離型膜之厚度。
  9. 如申請專利範圍第5項所述之方法，其中分離該填充膜包含使用一拾取單元之一真空墊提起該填充膜。
  10. 如申請專利範圍第9項所述之方法，其中分離該填充膜進一步包含在提起該填充膜時或提起該填充膜後之一搖擺動作。
  11. 如申請專利範圍第5項所述之方法，其中，中心定位分離出之該填充膜包含以形成在該載膜臺上之一中心定位銷推壓該填充膜之側表 面，其中，配置該支撐層以防止該填充膜在中心定位過程期間彎曲或起皺。
  12. 如申請專利範圍第5項所述之方法，其進一步包含在層疊該填充材料前，先從該填充材料分離該支撐層與該第二離型膜。
  13. 如申請專利範圍第5項所述之方法，其進一步包含在結合該封裝基板與該基板前從該填充材料分離該第一離型膜。
  14. 如申請專利範圍第5項所述之方法，其進一步包含在結合該封裝基板與該基板前在該封裝基板上設置一密封材料與一濕氣吸收劑。
  15. 一種填充膜，其包含：一第一離型膜，其具有厚度為50微米到100微米的一第一厚度；一填充材料，設置在該第一離型膜上，且厚度為10微米到30微米；一第二離型膜，設置在該填充材料上且具有厚度為20微米到50微米的一第二厚度，該第二厚度小於該第一厚度；以及一支撐層，設置在該第二離型膜上，該支撐層包含聚對苯二甲酸乙二酯且具有厚度為50微米到100微米的一第三厚度，該第三厚度大於該第二厚度，其中，該第一離型膜與該填充材料間之結合力大於該第二離型膜與該填充材料間之結合力；其中，該支撐層與該第二離型膜一起從該填充材料上分離。
  16. 如申請專利範圍第15項所述之填充膜，其中該第一離型膜包含聚甲基戊烯膜、聚對苯二甲酸乙二酯膜、鐵氟龍®膜、以及聚丙烯膜之至少之一，且該第二離型膜包含聚甲基戊烯膜、聚對苯二甲酸乙二 酯膜、鐵氟龍®膜、以及聚丙烯膜之至少之一。
  17. 如申請專利範圍第16項所述之填充膜，其中：該支撐層之上表面有一靜電屏蔽，且該第一厚度與該第三厚度皆等於100微米。
TW103111153A 2013-05-22 2014-03-26 填充膜與用其製造有機發光顯示設備之方法 TWI655761B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2013-0057953 2013-05-22
KR1020130057953A KR101596725B1 (ko) 2013-05-22 2013-05-22 충전 필름 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법

Publications (2)

Publication Number Publication Date
TW201507137A TW201507137A (zh) 2015-02-16
TWI655761B true TWI655761B (zh) 2019-04-01

Family

ID=50389329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103111153A TWI655761B (zh) 2013-05-22 2014-03-26 填充膜與用其製造有機發光顯示設備之方法

Country Status (5)

Country Link
US (1) US9825227B2 (zh)
EP (1) EP2806474A3 (zh)
KR (1) KR101596725B1 (zh)
CN (1) CN104183779B (zh)
TW (1) TWI655761B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062477B3 (de) * 2008-12-16 2010-03-25 Airbus Deutschland Gmbh Verfahren, System und Formwerkzeug zum Herstellen von Bauteilen aus Faserverbundwerkstoffen
CN107123370B (zh) * 2016-02-25 2019-10-18 三星Sdi株式会社 柔性显示装置
US10476037B2 (en) 2016-04-22 2019-11-12 Samsung Sdi Co., Ltd. Flexible display apparatus
KR101984581B1 (ko) * 2016-11-10 2019-06-03 주식회사 비에스피 유기발광소자의 인캡슐레이션 방법
KR102366313B1 (ko) 2017-09-08 2022-02-23 삼성디스플레이 주식회사 보호 필름, 표시 모듈, 표시 장치, 표시 모듈 제조 방법 및 표시 장치 제조 방법
CN110282253B (zh) * 2019-06-26 2021-08-06 友达光电（苏州）有限公司 保护膜及包装结构
CN111554186B (zh) * 2020-04-29 2022-05-17 昆山国显光电有限公司 离型层结构和显示面板的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002023151A (ja) * 2000-07-12 2002-01-23 Toshiba Corp 偏光板を備える液晶表示装置の製造方法及び製造装置
EP2039506A1 (en) * 2006-07-06 2009-03-25 Nitto Denko Corporation Release liners, pressure-sensitive adhesive tape, and pressure-sensitive adhesive tape roll
TW200923046A (en) * 2007-09-20 2009-06-01 Toyo Boseki Adhesive sheet, upper electrode for touch panel and image display device
US20120241071A1 (en) * 2009-11-06 2012-09-27 Mitsubishi Plastics, Inc. Double-sided pressure-sensitive adhesive sheet with release sheets

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA971093A (en) * 1970-04-25 1975-07-15 Yasuhiro Moriyama Method for preparing laminated film of polymeric substances
US5556505A (en) * 1994-07-05 1996-09-17 Ford Motor Company Windshield assembly system
US5691022A (en) * 1994-10-20 1997-11-25 International Paper Company Release liner base stock for printed films or labels
US6210767B1 (en) * 1994-10-20 2001-04-03 International Paper Company Release liner base stock for printed films or labels
US5817386A (en) * 1996-03-28 1998-10-06 Norton Performance Plastics Corporation Silicone-free release films
JP3429135B2 (ja) * 1996-06-28 2003-07-22 シャープ株式会社 粘着層積層体並びにそれを用いた表示装置及びその製造方法
JPH10289556A (ja) * 1997-04-11 1998-10-27 Lintec Corp 光ディスク用ラベル及びそれを貼付した光ディスク
US6020412A (en) * 1997-12-04 2000-02-01 Mitsubishi Polyester Film, Llc Controlled release coating comprising blend of silicone polymer and adhesion promoter
US6365254B1 (en) * 1998-02-02 2002-04-02 3M Innovative Properties Company Roll stabilizing release liner
US6368722B1 (en) * 1998-12-02 2002-04-09 Toray Industries, Inc. Laminated film and process
JP4437344B2 (ja) * 1998-12-25 2010-03-24 日東電工株式会社 剥離ライナ及び感圧性接着シート
US6299945B1 (en) * 1999-01-28 2001-10-09 Loparex Inc. Processes for making release liners
JP2001003010A (ja) * 1999-06-16 2001-01-09 Nitto Denko Corp 感圧性両面接着シート及び感圧性接着部材
DE10021109B4 (de) * 2000-05-02 2016-11-10 Infiana Germany Gmbh & Co. Kg Verfahren zum Herstellen eines mehrschichtigen Coextrudates und danach hergestellter Folienaufbau
US6521312B1 (en) * 2000-11-28 2003-02-18 Loparex, Inc. Multilayered film structures and methods of making and using the same
US6652943B2 (en) * 2001-06-04 2003-11-25 Saint-Gobain Performance Plastics Corporation Multilayer polymeric article with intercrosslinked polymer layers and method of making same
US6703463B2 (en) * 2001-08-01 2004-03-09 Avery Dennison Corporation Optical adhesive coating having low refractive index
JP3901490B2 (ja) * 2001-10-23 2007-04-04 日東電工株式会社 剥離ライナー及びそれを用いた感圧性接着テープ又はシート
US20030091817A1 (en) * 2001-11-08 2003-05-15 Nitto Denko Corporation Pressure-sensitive adhesive members and processes for producing the same
TW594119B (en) * 2001-12-21 2004-06-21 Au Optronics Corp Backlight module for thin film transistor liquid crystal display
KR101028603B1 (ko) * 2002-06-17 2011-04-11 세키스이가가쿠 고교가부시키가이샤 유기 전계 발광 소자 밀봉용 접착제 및 그의 응용
JP4800247B2 (ja) 2002-06-17 2011-10-26 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子
US20060100299A1 (en) * 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
JP2004224991A (ja) 2003-01-27 2004-08-12 Nitto Denko Corp 粘着剤組成物および有機ｅｌ表示装置
JP2004238441A (ja) * 2003-02-04 2004-08-26 Nitto Denko Corp 光半導体素子封止用樹脂
JP4300215B2 (ja) * 2003-05-14 2009-07-22 三菱樹脂株式会社 フッ素系積層フィルム及びその製造方法
JP4334925B2 (ja) 2003-06-26 2009-09-30 日東電工株式会社 偏光板およびその製造方法、偏光板用保護フィルム、偏光板を用いた光学フィルムならびに画像表示装置
US7135352B2 (en) * 2004-02-26 2006-11-14 Eastman Kodak Company Method of fabricating a cover plate bonded over an encapsulated OLEDs
WO2005100498A1 (ja) * 2004-04-16 2005-10-27 Riken Technos Corporation 粘着シートおよび剥離材
JP2005350650A (ja) * 2004-05-14 2005-12-22 Nitto Denko Corp 剥離ライナー及びそれを用いた感圧性接着テープ又はシート
KR100634960B1 (ko) * 2004-06-24 2006-10-17 (주)모디스텍 유기 발광소자 봉지용 필름 및 이를 이용한 봉지방법
JP2007042616A (ja) * 2005-06-29 2007-02-15 Asahi Kasei Corp 発光素子及び表示デバイス並びにそれらの製造方法
WO2007042772A2 (en) * 2005-10-13 2007-04-19 Cpfilms Inc An electrically conductive release liner
CN101304878B (zh) * 2005-11-08 2012-06-13 东丽株式会社 聚酯层合膜及转印箔
JP4976075B2 (ja) * 2005-12-26 2012-07-18 リンテック株式会社 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
JP4869748B2 (ja) 2006-03-14 2012-02-08 日東電工株式会社 ガラス保護用粘着シートおよび自動車ガラス用保護フィルム
US8264466B2 (en) * 2006-03-31 2012-09-11 3M Innovative Properties Company Touch screen having reduced visibility transparent conductor pattern
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
JP4803827B2 (ja) * 2007-06-04 2011-10-26 日東電工株式会社 剥離ライナーおよび該ライナーを備える感圧接着シート
TWI426118B (zh) * 2007-10-11 2014-02-11 琳得科股份有限公司 電子零件用兩面黏著片及其製造方法
KR20150084068A (ko) * 2007-11-08 2015-07-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 확산 특성을 갖는 광학 접착제
US20100178496A1 (en) * 2007-11-16 2010-07-15 Taica Corporation Transparent pressure-sensitive adhesive product for optical use, transparent pressure-sensitive adhesive laminate for optical use and manufacturing method thereof
JP5432459B2 (ja) * 2008-02-22 2014-03-05 リンテック株式会社 基材レス両面粘着シート及び剥離シート
JP4813509B2 (ja) * 2008-03-13 2011-11-09 日東電工株式会社 両面粘着シートとその製造方法及びプラスチックフィルムの固定方法
JP5351432B2 (ja) * 2008-04-10 2013-11-27 リンテック株式会社 両面粘着シートおよびその製造方法
JP2010020973A (ja) 2008-07-09 2010-01-28 Hitachi Displays Ltd 有機ｅｌ表示装置の製造方法
US20100055371A1 (en) * 2008-09-04 2010-03-04 Edwards David N Multi-Layer Dry Paint Transfer Laminate Having Olefinic Release Layer and Water-Based Opaque Layer
JP2010080289A (ja) * 2008-09-26 2010-04-08 Dainippon Printing Co Ltd 有機エレクトロルミネッセンスパネル、及びその製造方法
JP5572305B2 (ja) * 2008-12-12 2014-08-13 株式会社日立製作所 発光素子，発光素子を用いた発光装置、及び発光素子に使用される透明基板
JP5243990B2 (ja) * 2009-02-18 2013-07-24 日東電工株式会社 両面粘着シート
US9296933B2 (en) * 2009-05-15 2016-03-29 3M Innovative Properties Company Urethane-based pressure sensitive adhesives
US20110003092A1 (en) * 2009-07-02 2011-01-06 Brady Worldwide, Inc. Silicone Optical Film
US20110002090A1 (en) * 2009-07-02 2011-01-06 Roland Tobias Alfredsson Image Display Assembly and Apparatus and Method for Manufacturing the Same
EP2473357B1 (en) * 2009-08-31 2019-04-24 3M Innovative Properties Company Laser marking process and articles
KR101139260B1 (ko) 2009-09-14 2012-05-15 전상길 열전사 시트
WO2011112447A2 (en) * 2010-03-09 2011-09-15 3M Innovative Properties Company Heat activated optically clear adhesive for bonding display panels
PL2415583T3 (pl) * 2010-06-10 2014-09-30 Nitto Denko Corp Sposób regulacji położenia arkusza warstwowego i prostokątnego panelu w urządzeniu do produkcji paneli wyświetlaczy
JP5647450B2 (ja) * 2010-07-12 2014-12-24 日東電工株式会社 フレキシブル印刷回路基板固定用両面粘着シートおよびその製造方法
JP5725760B2 (ja) * 2010-08-19 2015-05-27 大同化成工業株式会社 タッチパネル用粘着剤組成物に用いるアクリル系高分子化合物
KR20120045213A (ko) 2010-10-29 2012-05-09 도레이첨단소재 주식회사 그린시트 성형용 캐리어 필름
JP5723618B2 (ja) * 2011-02-04 2015-05-27 日東電工株式会社 粘着シートおよび表面保護フィルム
JP6011067B2 (ja) * 2011-08-12 2016-10-19 日立化成株式会社 粘着フィルム
JP2013157408A (ja) * 2012-01-27 2013-08-15 Nitto Denko Corp 発光ダイオード装置およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002023151A (ja) * 2000-07-12 2002-01-23 Toshiba Corp 偏光板を備える液晶表示装置の製造方法及び製造装置
EP2039506A1 (en) * 2006-07-06 2009-03-25 Nitto Denko Corporation Release liners, pressure-sensitive adhesive tape, and pressure-sensitive adhesive tape roll
TW200923046A (en) * 2007-09-20 2009-06-01 Toyo Boseki Adhesive sheet, upper electrode for touch panel and image display device
US20120241071A1 (en) * 2009-11-06 2012-09-27 Mitsubishi Plastics, Inc. Double-sided pressure-sensitive adhesive sheet with release sheets

Also Published As

Publication number Publication date
KR101596725B1 (ko) 2016-02-24
EP2806474A3 (en) 2015-07-29
TW201507137A (zh) 2015-02-16
US20140345796A1 (en) 2014-11-27
KR20140137249A (ko) 2014-12-02
CN104183779B (zh) 2018-12-21
EP2806474A2 (en) 2014-11-26
CN104183779A (zh) 2014-12-03
US9825227B2 (en) 2017-11-21

Similar Documents

Publication Publication Date Title
TWI655761B (zh) 填充膜與用其製造有機發光顯示設備之方法
US11600798B2 (en) Organic light-emitting display apparatus for increasing contact area between sealing member and insulating layers
US10944071B2 (en) Organic light-emitting display apparatus and method of manufacturing the same
US9455418B2 (en) Support supply apparatus and method for supplying support
US9772435B2 (en) Flexible display apparatus
US8304989B2 (en) Organic light-emitting display device and method of manufacturing the same
CN110649175A (zh) 有机发光二极管显示器、包括其的电子装置及其制造方法
KR20160043227A (ko) 유기 발광 표시 장치
JP2009187941A (ja) 有機発光ディスプレイ装置及びその製造方法
CN103682143A (zh) 有机发光显示装置及其制造方法
CN104538557A (zh) 柔性oled显示器件及其制造方法
CN103035663A (zh) 显示器件
KR20110065855A (ko) 유기 발광 디스플레이 장치 및 그 제조 방법
KR20140102996A (ko) 유기 발광 디스플레이 장치 및 이의 제조 방법
CN112531131A (zh) 有机发光显示面板及其制造方法
CN100444699C (zh) 双面显示装置
CN110875439A (zh) 具有发光元件的装置
US9887380B2 (en) Display apparatus including bonding member having a core-shell structure and method of manufacturing the same
KR100670367B1 (ko) 유기 발광 디스플레이 장치
KR100943188B1 (ko) 유기 발광 디스플레이 장치