TWI667281B - Thermosetting resin composition - Google Patents

Thermosetting resin composition Download PDF

Info

Publication number
TWI667281B
TWI667281B TW104129948A TW104129948A TWI667281B TW I667281 B TWI667281 B TW I667281B TW 104129948 A TW104129948 A TW 104129948A TW 104129948 A TW104129948 A TW 104129948A TW I667281 B TWI667281 B TW I667281B
Authority
TW
Taiwan
Prior art keywords
component
group
resin composition
thermosetting resin
epoxy resin
Prior art date
Application number
TW104129948A
Other languages
English (en)
Chinese (zh)
Other versions
TW201623428A (zh
Inventor
庄司信一郎
遠藤浩平
柴野匡哉
Original Assignee
日商帝人股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商帝人股份有限公司 filed Critical 日商帝人股份有限公司
Publication of TW201623428A publication Critical patent/TW201623428A/zh
Application granted granted Critical
Publication of TWI667281B publication Critical patent/TWI667281B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • C07D491/02—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
    • C07D491/10—Spiro-condensed systems
    • C07D491/113—Spiro-condensed systems with two or more oxygen atoms as ring hetero atoms in the oxygen-containing ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW104129948A 2014-09-11 2015-09-10 Thermosetting resin composition TWI667281B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2014185246 2014-09-11
JP2014-185246 2014-09-11
JP2015031753 2015-02-20
JP2015-031753 2015-02-20
JP2015035480 2015-02-25
JP2015-035480 2015-02-25
JP2015150407 2015-07-30
JP2015-150407 2015-07-30

Publications (2)

Publication Number Publication Date
TW201623428A TW201623428A (zh) 2016-07-01
TWI667281B true TWI667281B (zh) 2019-08-01

Family

ID=55459222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104129948A TWI667281B (zh) 2014-09-11 2015-09-10 Thermosetting resin composition

Country Status (10)

Country Link
US (2) US20170253693A1 (ja)
EP (1) EP3192834B1 (ja)
JP (1) JP6461170B2 (ja)
KR (1) KR102393692B1 (ja)
CN (1) CN106715578B (ja)
MY (1) MY179663A (ja)
PH (1) PH12017500465B1 (ja)
SG (2) SG10201903565YA (ja)
TW (1) TWI667281B (ja)
WO (1) WO2016039486A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017031402A (ja) * 2015-08-04 2017-02-09 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物
JP6686457B2 (ja) * 2016-01-15 2020-04-22 住友ベークライト株式会社 封止用樹脂組成物および電子装置
JP6766360B2 (ja) * 2016-01-15 2020-10-14 住友ベークライト株式会社 樹脂組成物
JP2017160427A (ja) * 2016-03-04 2017-09-14 京セラ株式会社 封止用樹脂組成物及び半導体装置
JPWO2017168732A1 (ja) * 2016-03-31 2019-02-07 日立化成株式会社 樹脂組成物、プリプレグ、樹脂シート及び積層板
JP6642342B2 (ja) * 2016-09-02 2020-02-05 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物
JP6947468B2 (ja) * 2017-08-28 2021-10-13 日清紡ケミカル株式会社 ポリカルボジイミド化合物及び熱硬化性樹脂組成物
US20200317913A1 (en) * 2017-12-22 2020-10-08 Teijin Limited Thermosetting resin composition
WO2019138919A1 (ja) * 2018-01-15 2019-07-18 日立化成株式会社 液状封止樹脂組成物、電子部品装置及び電子部品装置の製造方法
CN112513180A (zh) * 2018-08-09 2021-03-16 三菱瓦斯化学株式会社 印刷电路板用树脂组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板
KR102257926B1 (ko) * 2018-09-20 2021-05-28 주식회사 엘지화학 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치
CN109762436B (zh) * 2018-12-12 2021-04-13 苏州太湖电工新材料股份有限公司 一种适用于超导绝缘材料的耐低温导热绝缘树脂漆及其制备方法和应用
US20240101523A1 (en) * 2021-01-29 2024-03-28 Honshu Chemical Industry Co., Ltd. Novel benzoxazine compound, resin raw material composition containing the same, curable resin composition, and cured product thereof
JP7649038B2 (ja) * 2021-08-24 2025-03-19 ナミックス株式会社 樹脂組成物及び接着剤
TW202344552A (zh) * 2022-03-23 2023-11-16 日商納美仕有限公司 樹脂組成物、接著劑或密封材、硬化物、半導體裝置及電子元件
CN117142992B (zh) * 2023-08-30 2024-10-01 苏州微构新材料科技有限公司 多官萘化合物及制备方法、固化剂、树脂组合物和胶黏剂

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285557A (ja) * 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
TW201141927A (en) * 2010-01-27 2011-12-01 Teijin Ltd Film
JP2012001478A (ja) * 2010-06-16 2012-01-05 Teijin Ltd アミン体の製造方法
JP2012001476A (ja) * 2010-06-16 2012-01-05 Kawaguchi Kagaku Kogyo Kk カルボジイミド体の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS621714A (ja) 1985-06-28 1987-01-07 Nisshinbo Ind Inc 熱硬化性樹脂の製造方法
DE3643239C2 (ja) 1985-03-29 1990-12-20
JPH02175756A (ja) 1988-12-28 1990-07-09 Mitsui Toatsu Chem Inc 熱硬化性樹脂組成物
JP4200250B2 (ja) 1999-10-26 2008-12-24 パナソニック電工株式会社 エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔及び積層板
AU2005254742A1 (en) 2004-06-21 2005-12-29 Huntsman Advanced Materials (Deutschland) Gmbh & Co. Kg Polyaminoamide-monoepoxy adducts
JP2006176549A (ja) 2004-12-20 2006-07-06 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN102245703B (zh) 2008-12-15 2015-04-29 帝人株式会社 含有环状碳二亚胺的树脂组合物
JP2010144121A (ja) 2008-12-22 2010-07-01 Kyocera Chemical Corp 封止用樹脂組成物および半導体封止装置
JP2011068814A (ja) 2009-09-28 2011-04-07 Dic Corp エポキシ樹脂組成物及びその硬化物
WO2011158959A1 (ja) * 2010-06-16 2011-12-22 帝人株式会社 環状カルボジイミド化合物の中間体の製造方法
ES2538090T3 (es) * 2010-06-16 2015-06-17 Kawaguchi Chemical Industry Co. Ltd. Proceso para la producción de una carbodiimida
WO2014046296A1 (ja) 2012-09-21 2014-03-27 帝人株式会社 複合材料の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285557A (ja) * 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
TW201141927A (en) * 2010-01-27 2011-12-01 Teijin Ltd Film
JP2012001478A (ja) * 2010-06-16 2012-01-05 Teijin Ltd アミン体の製造方法
JP2012001476A (ja) * 2010-06-16 2012-01-05 Kawaguchi Kagaku Kogyo Kk カルボジイミド体の製造方法

Also Published As

Publication number Publication date
KR20170057248A (ko) 2017-05-24
US20170253693A1 (en) 2017-09-07
CN106715578B (zh) 2019-05-10
EP3192834B1 (en) 2023-04-05
WO2016039486A1 (ja) 2016-03-17
JP6461170B2 (ja) 2019-01-30
SG10201903565YA (en) 2019-05-30
CN106715578A (zh) 2017-05-24
PH12017500465B1 (en) 2023-06-30
SG11201701852VA (en) 2017-04-27
TW201623428A (zh) 2016-07-01
MY179663A (en) 2020-11-11
EP3192834A4 (en) 2017-08-30
US10865272B2 (en) 2020-12-15
PH12017500465A1 (en) 2017-07-31
US20190194381A1 (en) 2019-06-27
KR102393692B1 (ko) 2022-05-02
EP3192834A1 (en) 2017-07-19
JPWO2016039486A1 (ja) 2017-06-22

Similar Documents

Publication Publication Date Title
TW201623428A (zh) 熱硬化性樹脂組成物
TWI387608B (zh) An epoxy resin, a hardened resin composition containing the same, and a use thereof
EP2814802B1 (en) Mixture of benzoxazine, epoxy and anhydride
CN101952262B (zh) 用于高tg应用的无卤苯并噁嗪基可固化组合物
TWI693250B (zh) 組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料
JPH09272786A (ja) 熱硬化性樹脂組成物及びその硬化物
TWI571477B (zh) 含磷環氧樹脂及該樹脂組成物,及硬化物
TW201726801A (zh) 熱硬化性環氧樹脂組成物
JP2012102228A (ja) フルオレン骨格を有するエポキシ樹脂組成物およびその硬化物
CN104603119B (zh) 基于酚醛清漆的环氧化合物、其制备方法、包含该环氧化物的组合物和固化制品及其用途
TW201835146A (zh) 包接化合物及其製造方法以及其用途
JP5153000B2 (ja) エポキシ樹脂、その製造方法、エポキシ樹脂組成物および硬化物
TWI623566B (zh) 多羥基聚醚樹脂之製造方法,多羥基聚醚樹脂,其樹脂組成物及其硬化物
TW201141949A (en) Benzoxazine-ring-containing theremosetting resin composition, process for production thereof, and molded products and cured products thereof
TW201323468A (zh) 含磷苯酚樹脂及其製造方法、該樹脂之組成物、硬化物
TW201943792A (zh) 環氧樹脂組成物及其成型體
JP2010006897A (ja) 多価フェノール樹脂、エポキシ樹脂組成物、およびその硬化物
TWI724229B (zh) 順丁烯二醯亞胺樹脂成形體、順丁烯二醯亞胺樹脂成形體的製造方法、順丁烯二醯亞胺樹脂組成物及其硬化物
TWI577717B (zh) A method for producing a naphthol resin containing an imide group, a thermosetting resin composition and a hardened product thereof and a use
JP7776702B1 (ja) マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物
JP2010053314A (ja) 熱硬化性樹脂、熱硬化性組成物、積層フィルム及び積層体
KR101910134B1 (ko) 변성 에폭시 수지 및 그 제조방법
JP2006321826A (ja) フェノール樹脂組成物、エポキシ樹脂組成物、及びその硬化物
JP2013185034A (ja) ベンゾオキサジン樹脂組成物及びその製造方法、並びにその成形体及び硬化体
JP2016008297A (ja) 樹脂ワニスの製造方法