TWI674332B - 於基材上產生金屬－陶瓷覆層之鍍覆或塗覆方法 - Google Patents

於基材上產生金屬－陶瓷覆層之鍍覆或塗覆方法 Download PDF

Info

Publication number: TWI674332B
Authority: TW; Taiwan
Prior art keywords: coating; plating; sol; ceramic; electrolyte
Prior art date: 2014-05-27

Application number

TW104116952A

Other languages

English (en)

Chinese (zh)

Other versions

TW201610225A (zh

Inventor

胡泊

熊超

唯高

王宇鑫

舒心

魏尙海

索歐爾加茲歐夫

思琳鄭

鞠穎

馬齊夏瑞菲

克里斯多夫Ｗ古迪

葛連斯拉特

Original Assignee

紐西蘭商奧克蘭聯合服務公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-05-27

Filing date

2015-05-27

Publication date

2019-10-11

2015-05-27 Application filed by 紐西蘭商奧克蘭聯合服務公司 filed Critical 紐西蘭商奧克蘭聯合服務公司

2016-03-16 Publication of TW201610225A publication Critical patent/TW201610225A/zh

2019-10-11 Application granted granted Critical

2019-10-11 Publication of TWI674332B publication Critical patent/TWI674332B/zh

Links

238000000576 coating method Methods 0.000 title claims abstract description 749
238000007747 plating Methods 0.000 title claims abstract description 398
239000000758 substrate Substances 0.000 title claims abstract description 121
238000005524 ceramic coating Methods 0.000 title claims description 29
239000011248 coating agent Substances 0.000 claims abstract description 594
239000000919 ceramic Substances 0.000 claims abstract description 294
239000003792 electrolyte Substances 0.000 claims abstract description 154
239000002131 composite material Substances 0.000 claims abstract description 129
238000002156 mixing Methods 0.000 claims abstract description 79
238000000034 method Methods 0.000 claims abstract description 77
239000002245 particle Substances 0.000 claims abstract description 67
239000000243 solution Substances 0.000 claims description 233
229910010413 TiO 2 Inorganic materials 0.000 claims description 207
229910018104 Ni-P Inorganic materials 0.000 claims description 63
229910018536 Ni—P Inorganic materials 0.000 claims description 63
229910017709 Ni Co Inorganic materials 0.000 claims description 40
229910003267 Ni-Co Inorganic materials 0.000 claims description 40
229910003262 Ni‐Co Inorganic materials 0.000 claims description 40
239000002105 nanoparticle Substances 0.000 claims description 35
239000008151 electrolyte solution Substances 0.000 claims description 33
229910052751 metal Inorganic materials 0.000 claims description 33
239000002184 metal Substances 0.000 claims description 33
229910017398 Au—Ni Inorganic materials 0.000 claims description 32
229910052759 nickel Inorganic materials 0.000 claims description 30
230000008569 process Effects 0.000 claims description 28
229910052802 copper Inorganic materials 0.000 claims description 21
229910052725 zinc Inorganic materials 0.000 claims description 19
229910052709 silver Inorganic materials 0.000 claims description 17
229910052782 aluminium Inorganic materials 0.000 claims description 16
229910052804 chromium Inorganic materials 0.000 claims description 16
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 14
229910052737 gold Inorganic materials 0.000 claims description 14
229910052721 tungsten Inorganic materials 0.000 claims description 14
230000015572 biosynthetic process Effects 0.000 claims description 12
229910052796 boron Inorganic materials 0.000 claims description 12
229910052719 titanium Inorganic materials 0.000 claims description 12
239000011247 coating layer Substances 0.000 claims description 10
150000004767 nitrides Chemical class 0.000 claims description 10
229910017888 Cu—P Inorganic materials 0.000 claims description 9
GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 claims description 9
229910052742 iron Inorganic materials 0.000 claims description 9
238000007772 electroless plating Methods 0.000 claims description 8
229910052745 lead Inorganic materials 0.000 claims description 8
239000002243 precursor Substances 0.000 claims description 8
229910021332 silicide Inorganic materials 0.000 claims description 8
FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 8
229910052726 zirconium Inorganic materials 0.000 claims description 8
229910003271 Ni-Fe Inorganic materials 0.000 claims description 7
238000001556 precipitation Methods 0.000 claims description 7
229910052718 tin Inorganic materials 0.000 claims description 7
239000012905 visible particle Substances 0.000 claims description 7
229910017090 AlO 2 Inorganic materials 0.000 claims description 6
239000013078 crystal Substances 0.000 claims description 6
LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 claims description 6
229910052752 metalloid Inorganic materials 0.000 claims description 6
150000002738 metalloids Chemical class 0.000 claims description 6
239000004033 plastic Substances 0.000 claims description 6
229910052710 silicon Inorganic materials 0.000 claims description 5
229910052727 yttrium Inorganic materials 0.000 claims description 5
229910004298 SiO 2 Inorganic materials 0.000 claims description 4
239000003638 chemical reducing agent Substances 0.000 claims description 4
LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 4
229910052761 rare earth metal Inorganic materials 0.000 claims description 4
229910052703 rhodium Inorganic materials 0.000 claims description 4
235000011006 sodium potassium tartrate Nutrition 0.000 claims description 4
FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 claims description 3
KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 3
WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
229910052787 antimony Inorganic materials 0.000 claims description 3
229910052785 arsenic Inorganic materials 0.000 claims description 3
WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
229910052793 cadmium Inorganic materials 0.000 claims description 3
229940015043 glyoxal Drugs 0.000 claims description 3
229910052735 hafnium Inorganic materials 0.000 claims description 3
239000012493 hydrazine sulfate Substances 0.000 claims description 3
229910000377 hydrazine sulfate Inorganic materials 0.000 claims description 3
229910052738 indium Inorganic materials 0.000 claims description 3
229910052741 iridium Inorganic materials 0.000 claims description 3
WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
229910052750 molybdenum Inorganic materials 0.000 claims description 3
229910052758 niobium Inorganic materials 0.000 claims description 3
229910052762 osmium Inorganic materials 0.000 claims description 3
229910052763 palladium Inorganic materials 0.000 claims description 3
229910052702 rhenium Inorganic materials 0.000 claims description 3
229910052707 ruthenium Inorganic materials 0.000 claims description 3
239000012279 sodium borohydride Substances 0.000 claims description 3
229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 3
229910052715 tantalum Inorganic materials 0.000 claims description 3
229910052720 vanadium Inorganic materials 0.000 claims description 3
-1 Ni-W Inorganic materials 0.000 claims description 2
239000008121 dextrose Substances 0.000 claims description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 70
239000010410 layer Substances 0.000 description 53
238000005260 corrosion Methods 0.000 description 52
230000007797 corrosion Effects 0.000 description 51
239000002114 nanocomposite Substances 0.000 description 32
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238000012360 testing method Methods 0.000 description 28
238000002441 X-ray diffraction Methods 0.000 description 26
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229910007567 Zn-Ni Inorganic materials 0.000 description 25
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230000001965 increasing effect Effects 0.000 description 25
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239000000523 sample Substances 0.000 description 22
239000011701 zinc Substances 0.000 description 22
238000005253 cladding Methods 0.000 description 20
238000003756 stirring Methods 0.000 description 20
238000005299 abrasion Methods 0.000 description 19
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 16
239000000203 mixture Substances 0.000 description 16
238000013019 agitation Methods 0.000 description 15
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
230000035508 accumulation Effects 0.000 description 14
238000009825 accumulation Methods 0.000 description 14
239000010936 titanium Substances 0.000 description 14
229910001369 Brass Inorganic materials 0.000 description 13
239000010951 brass Substances 0.000 description 13
239000011159 matrix material Substances 0.000 description 13
229910045601 alloy Inorganic materials 0.000 description 12
239000000956 alloy Substances 0.000 description 12
238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 12
229910052698 phosphorus Inorganic materials 0.000 description 12
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 11
229910018605 Ni—Zn Inorganic materials 0.000 description 11
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
239000011574 phosphorus Substances 0.000 description 11
150000003839 salts Chemical class 0.000 description 11
238000005406 washing Methods 0.000 description 11
229910007570 Zn-Al Inorganic materials 0.000 description 10
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238000004458 analytical method Methods 0.000 description 9
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XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
238000005259 measurement Methods 0.000 description 8
230000010287 polarization Effects 0.000 description 8
238000005498 polishing Methods 0.000 description 8
239000011780 sodium chloride Substances 0.000 description 8
239000007921 spray Substances 0.000 description 8
239000006185 dispersion Substances 0.000 description 7
238000006073 displacement reaction Methods 0.000 description 7
238000009713 electroplating Methods 0.000 description 7
239000011777 magnesium Substances 0.000 description 7
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239000003960 organic solvent Substances 0.000 description 7
239000002356 single layer Substances 0.000 description 7
238000001228 spectrum Methods 0.000 description 7
238000005728 strengthening Methods 0.000 description 7
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GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
238000000151 deposition Methods 0.000 description 6
239000012153 distilled water Substances 0.000 description 6
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239000002585 base Substances 0.000 description 4
230000005540 biological transmission Effects 0.000 description 4
230000008859 change Effects 0.000 description 4
238000000840 electrochemical analysis Methods 0.000 description 4
238000000157 electrochemical-induced impedance spectroscopy Methods 0.000 description 4
238000004070 electrodeposition Methods 0.000 description 4
238000002389 environmental scanning electron microscopy Methods 0.000 description 4
238000003760 magnetic stirring Methods 0.000 description 4
239000000463 material Substances 0.000 description 4
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
230000005855 radiation Effects 0.000 description 4
239000011135 tin Substances 0.000 description 4
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
241000209094 Oryza Species 0.000 description 3
235000007164 Oryza sativa Nutrition 0.000 description 3
239000007864 aqueous solution Substances 0.000 description 3
238000012512 characterization method Methods 0.000 description 3
230000003247 decreasing effect Effects 0.000 description 3
229910003460 diamond Inorganic materials 0.000 description 3
239000010432 diamond Substances 0.000 description 3
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150000002500 ions Chemical class 0.000 description 3
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239000011859 microparticle Substances 0.000 description 3
238000002161 passivation Methods 0.000 description 3
230000000737 periodic effect Effects 0.000 description 3
239000010948 rhodium Substances 0.000 description 3
235000009566 rice Nutrition 0.000 description 3
238000001350 scanning transmission electron microscopy Methods 0.000 description 3
238000005507 spraying Methods 0.000 description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
229910017767 Cu—Al Inorganic materials 0.000 description 2
FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical group [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
229910021607 Silver chloride Inorganic materials 0.000 description 2
230000004913 activation Effects 0.000 description 2
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XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
239000011195 cermet Substances 0.000 description 2
230000007547 defect Effects 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
238000002524 electron diffraction data Methods 0.000 description 2
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238000003384 imaging method Methods 0.000 description 2
238000005470 impregnation Methods 0.000 description 2
238000007373 indentation Methods 0.000 description 2
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
229910052755 nonmetal Inorganic materials 0.000 description 2
230000003287 optical effect Effects 0.000 description 2
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VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
229910052697 platinum Inorganic materials 0.000 description 2
239000002244 precipitate Substances 0.000 description 2
230000009467 reduction Effects 0.000 description 2
239000004332 silver Substances 0.000 description 2
HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 2
230000003746 surface roughness Effects 0.000 description 2
241001163841 Albugo ipomoeae-panduratae Species 0.000 description 1
235000011299 Brassica oleracea var botrytis Nutrition 0.000 description 1
240000003259 Brassica oleracea var. botrytis Species 0.000 description 1
241000080590 Niso Species 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
238000005273 aeration Methods 0.000 description 1
125000003158 alcohol group Chemical group 0.000 description 1
239000003513 alkali Substances 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
230000005587 bubbling Effects 0.000 description 1
FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000003153 chemical reaction reagent Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000008199 coating composition Substances 0.000 description 1
239000000084 colloidal system Substances 0.000 description 1
238000004737 colorimetric analysis Methods 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
238000005336 cracking Methods 0.000 description 1
238000002425 crystallisation Methods 0.000 description 1
230000008025 crystallization Effects 0.000 description 1
230000002950 deficient Effects 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
238000001514 detection method Methods 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
238000005868 electrolysis reaction Methods 0.000 description 1
239000002001 electrolyte material Substances 0.000 description 1
239000012776 electronic material Substances 0.000 description 1
RDYMFSUJUZBWLH-UHFFFAOYSA-N endosulfan Chemical compound C12COS(=O)OCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl RDYMFSUJUZBWLH-UHFFFAOYSA-N 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
238000013213 extrapolation Methods 0.000 description 1
239000008103 glucose Substances 0.000 description 1
239000010931 gold Substances 0.000 description 1
239000012535 impurity Substances 0.000 description 1
238000011065 in-situ storage Methods 0.000 description 1
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230000000977 initiatory effect Effects 0.000 description 1
238000007689 inspection Methods 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
238000002386 leaching Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000000314 lubricant Substances 0.000 description 1
238000005461 lubrication Methods 0.000 description 1
230000014759 maintenance of location Effects 0.000 description 1
238000010907 mechanical stirring Methods 0.000 description 1
230000007246 mechanism Effects 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000012544 monitoring process Methods 0.000 description 1
239000002086 nanomaterial Substances 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
230000006911 nucleation Effects 0.000 description 1
238000010899 nucleation Methods 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
238000003921 particle size analysis Methods 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
235000021110 pickles Nutrition 0.000 description 1
229910052573 porcelain Inorganic materials 0.000 description 1
239000011148 porous material Substances 0.000 description 1
238000004881 precipitation hardening Methods 0.000 description 1
239000000047 product Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
239000010979 ruby Substances 0.000 description 1
229910001750 ruby Inorganic materials 0.000 description 1
238000000926 separation method Methods 0.000 description 1
239000010944 silver (metal) Substances 0.000 description 1
239000011734 sodium Substances 0.000 description 1
SIGUVTURIMRFDD-UHFFFAOYSA-M sodium dioxidophosphanium Chemical compound [Na+].[O-][PH2]=O SIGUVTURIMRFDD-UHFFFAOYSA-M 0.000 description 1
229910021384 soft carbon Inorganic materials 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000006104 solid solution Substances 0.000 description 1
239000000725 suspension Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1
238000004627 transmission electron microscopy Methods 0.000 description 1
UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
229940007718 zinc hydroxide Drugs 0.000 description 1
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Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1669—Agitation, e.g. air introduction
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling

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Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
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Mechanical Engineering (AREA)
Automation & Control Theory (AREA)
Dispersion Chemistry (AREA)
Chemically Coating (AREA)

TW104116952A 2014-05-27 2015-05-27 於基材上產生金屬－陶瓷覆層之鍍覆或塗覆方法 TWI674332B (zh)

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US (1)	US20170101722A1 (de)
EP (1)	EP3149222A4 (de)
CN (1)	CN107075683A (de)
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CN111676499A (zh) *	2020-07-30	2020-09-18	华南理工大学	基于阴极等离子体电解沉积的阻氢涂层及制备方法
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US20170101722A1 (en)	2017-04-13
WO2015181706A1 (en)	2015-12-03
TW201610225A (zh)	2016-03-16
CN107075683A (zh)	2017-08-18
EP3149222A4 (de)	2018-06-06
EP3149222A1 (de)	2017-04-05

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Li et al.	2019	Effect of current density and deposition time on microstructure and corrosion resistance of Ni-W/TiN nanocomposite coating
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