EP3149222A4 - Plattierungs- oder beschichtungsverfahren zur herstellung einer metall-keramik-beschichtung auf einem substrat - Google Patents

Plattierungs- oder beschichtungsverfahren zur herstellung einer metall-keramik-beschichtung auf einem substrat Download PDF

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Publication number
EP3149222A4
EP3149222A4 EP15798809.8A EP15798809A EP3149222A4 EP 3149222 A4 EP3149222 A4 EP 3149222A4 EP 15798809 A EP15798809 A EP 15798809A EP 3149222 A4 EP3149222 A4 EP 3149222A4
Authority
EP
European Patent Office
Prior art keywords
plating
substrate
coating
producing metal
coating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15798809.8A
Other languages
English (en)
French (fr)
Other versions
EP3149222A1 (de
Inventor
Bo Hu
Chao XIONG
Wei Gao
Yuxin Wang
Xin Shu
Shanghai WEI
Soroor GHAZIOF
See Leng TAY
Ying JU
Marzieh SHARIFI
Christopher W. Goode
Glen SLATER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auckland Uniservices Ltd
Original Assignee
Auckland Uniservices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auckland Uniservices Ltd filed Critical Auckland Uniservices Ltd
Publication of EP3149222A1 publication Critical patent/EP3149222A1/de
Publication of EP3149222A4 publication Critical patent/EP3149222A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
EP15798809.8A 2014-05-27 2015-05-26 Plattierungs- oder beschichtungsverfahren zur herstellung einer metall-keramik-beschichtung auf einem substrat Withdrawn EP3149222A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462003341P 2014-05-27 2014-05-27
PCT/IB2015/053902 WO2015181706A1 (en) 2014-05-27 2015-05-26 Plating or coating method for producing metal-ceramic coating on a substrate

Publications (2)

Publication Number Publication Date
EP3149222A1 EP3149222A1 (de) 2017-04-05
EP3149222A4 true EP3149222A4 (de) 2018-06-06

Family

ID=54698204

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15798809.8A Withdrawn EP3149222A4 (de) 2014-05-27 2015-05-26 Plattierungs- oder beschichtungsverfahren zur herstellung einer metall-keramik-beschichtung auf einem substrat

Country Status (5)

Country Link
US (1) US20170101722A1 (de)
EP (1) EP3149222A4 (de)
CN (1) CN107075683A (de)
TW (1) TWI674332B (de)
WO (1) WO2015181706A1 (de)

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IT201700012608A1 (it) * 2017-02-06 2018-08-06 Arnaldo Morganti Componenti meccanici antifrizione perfezionati, procedimento di rivestimento e vasca dell’impianto per la loro fabbricazione
CN107012377B (zh) * 2017-04-25 2019-03-26 湖南理工学院 一种SiC复合材料及其制备工艺
CN107012378B (zh) * 2017-04-25 2019-12-17 湖南理工学院 一种Cu70Zr20Ti10非晶合金增强的SiC复合材料及其制备工艺
CN107385440B (zh) * 2017-08-09 2019-12-10 无锡市恒利弘实业有限公司 一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法
CN107299368B (zh) * 2017-08-09 2019-12-10 无锡市恒利弘实业有限公司 一种在钢制基材表面无氰复合镀RE-TiO2-Ag层的电镀方法
CN107779934A (zh) * 2017-10-25 2018-03-09 昆山钴瓷金属科技有限公司 一种输油管道纳米复合涂层的制备方法
CN107876048A (zh) * 2017-12-04 2018-04-06 安徽中弘科技发展有限公司 一种有效清除室内装修污染的光触媒制剂
CN107955413A (zh) * 2017-12-08 2018-04-24 马鞍山虹润彩印有限责任公司 一种应用在导电油墨上的导电填料的制备方法
CN108411343A (zh) * 2018-04-10 2018-08-17 上海大学 一种电镀钴钨锰高强钢及其制备方法和应用
CN110016709A (zh) * 2018-11-15 2019-07-16 暨南大学 具有光生阴极保护作用的Zn@P纳米镀层及其制备方法
CN110158065A (zh) * 2019-06-10 2019-08-23 德华兔宝宝装饰新材股份有限公司 一种表面均匀化学镀Ni-P-SiO2纳米粒子复合层的防腐蚀木材的制备方法
US11608563B2 (en) * 2019-07-19 2023-03-21 Asmpt Nexx, Inc. Electrochemical deposition systems
CN110373706B (zh) * 2019-08-22 2021-05-14 电子科技大学 一种酸性光亮镀铜电镀液的在线维护方法
US11270872B2 (en) 2019-09-25 2022-03-08 Western Digital Technologies, Inc. Base conducting layer beneath graphite layer of ceramic cathode for use with cathodic arc deposition
CN110760916B (zh) * 2019-11-18 2022-04-05 和县科嘉阀门铸造有限公司 一种提高镁合金阀门耐蚀性的方法
JP7501896B2 (ja) * 2020-07-16 2024-06-18 奥野製薬工業株式会社 電気ニッケルめっき皮膜及びめっき液、並びに電気ニッケルめっき液を用いた電気ニッケルめっき皮膜の製造方法
CN111676499A (zh) * 2020-07-30 2020-09-18 华南理工大学 基于阴极等离子体电解沉积的阻氢涂层及制备方法
CN114016008B (zh) * 2021-10-27 2023-08-29 东北电力大学 一种化学镀Ni-P-PTFE-TiO2复合纳米镀层及其制备方法
CN114182241A (zh) * 2021-11-24 2022-03-15 国网浙江省电力有限公司舟山供电公司 Ni-W-P/Ni-P纳米氧化铈复合防腐镀层及工艺
CN115058746B (zh) * 2022-07-07 2024-04-12 中国人民解放军陆军装甲兵学院 一种金属镀层、其制备方法及应用
WO2025072258A1 (en) * 2023-09-26 2025-04-03 Nanovis, LLC Electrodeposition using ultrashort duration pulses
CN120443284B (zh) * 2025-07-07 2025-09-30 胜利油田胜鑫防腐有限责任公司 一种多元金属防腐镀层的电镀工艺

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EP2103718A1 (de) * 2006-09-28 2009-09-23 Nihon Parkerizing Co., Ltd. Verfahren zum aufbringen eines keramikfilms auf metall, elektrolyselösung zur verwendung bei dem verfahren und keramikfilm und metallmaterial
WO2011002311A1 (en) * 2009-06-29 2011-01-06 Auckland Uniservices Limited Plating or coating method for producing metal-ceramic coating on a substrate

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EP1818428B1 (de) * 2004-11-05 2014-02-26 Nihon Parkerizing Co., Ltd. Verfahren zur elektrolytischen keramikbeschichtung für metall, elektrolyt zur verwendung bei der elektrolytischen keramikbeschichtung für metall und metallmaterial
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Publication number Priority date Publication date Assignee Title
EP2103718A1 (de) * 2006-09-28 2009-09-23 Nihon Parkerizing Co., Ltd. Verfahren zum aufbringen eines keramikfilms auf metall, elektrolyselösung zur verwendung bei dem verfahren und keramikfilm und metallmaterial
WO2011002311A1 (en) * 2009-06-29 2011-01-06 Auckland Uniservices Limited Plating or coating method for producing metal-ceramic coating on a substrate

Non-Patent Citations (1)

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Title
See also references of WO2015181706A1 *

Also Published As

Publication number Publication date
US20170101722A1 (en) 2017-04-13
WO2015181706A1 (en) 2015-12-03
TW201610225A (zh) 2016-03-16
TWI674332B (zh) 2019-10-11
CN107075683A (zh) 2017-08-18
EP3149222A1 (de) 2017-04-05

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